STMicroelectronics M27C256B-70XF1
- Part No.:
- M27C256B-70XF1
- Manufacturer:
- STMicroelectronics
- Category:
- Memory
- Package:
- 28-CDIP (0.600", 15.24mm) Window
- Datasheet:
-
M27C256B-70XF1.pdf
- Description:
- IC EPROM 256KBIT PARALLEL 28CDIP
- Quantity:
- Payment:

- Shipping:

Inventory:1,687
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Product details
Overview
M27C256B-70XF1 from STMicroelectronics is a 256 Kbit (32K × 8) UV-erasable EPROM in FDIP28W ceramic window package, operating at 5V ±10%, with 70 ns access time, 30 mA active current, and 100 µA standby current. It features dual-line control (E/G), electronic signature (20h/8Dh), and supports programming at 12.75 V with 100 µs/word pulse width - used for firmware storage in legacy microprocessor systems requiring field-erasable non-volatility.
For engineers reviewing the M27C256B-70XF1 datasheet, M27C256B-70XF1 pinout, M27C256B-70XF1 application, or M27C256B-70XF1 equivalent, key selection criteria include UV erasure capability, TTL-compatible timing, two-line output enable architecture, A9-based electronic signature verification, and FDIP28W package compatibility with UV exposure fixtures.
Technical Context
The M27C256B-70XF1 implements a classic NMOS EPROM architecture with address latching via A0–A14 (15-bit), parallel 8-bit data I/O on Q0–Q7, and independent chip enable (E) and output enable (G) controls enabling low-power array partitioning. Its two-line control logic ensures bus contention avoidance and minimizes active power during partial memory access.
Programming requires precise 12.75 V ±0.25 V on VPP, 6.25 V ±0.25 V on VCC, and 11.5–12.5 V on A9 for electronic signature readout. Erasure relies on 2537 Å UV light at ≥15 W·s/cm² dose (15–20 min at 12,000 µW/cm²), with FDIP28W's quartz window enabling direct die exposure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 256 Kbit (32,768 × 8) - supports full 16-bit address space mapping for 8086/8088 and Z80-based systems. |
| Access Time | 70 ns - meets timing budget for 10 MHz CPU buses with adequate setup/hold margin. |
| Supply Voltage | 5 V ±10% - compatible with standard TTL logic rails without regulation overhead. |
| Active Current | 30 mA at 5 MHz - enables thermal management in dense PCB layouts with ≤10 devices per 1W dissipation zone. |
| Standby Current | 100 µA - allows battery-backed retention in maintenance mode without significant drain. |
| Programming Voltage | 12.75 V ±0.25 V - requires dedicated HV supply rail; not compatible with standard 5 V-only programmers. |
| Electronic Signature | Manufacturer Code 20h / Device Code 8Dh - enables automatic algorithm selection in gang programmers. |
Pinout & Package
FDIP28W (28-pin ceramic frit-seal DIP with UV-transparent window); dimensions: 36.9 mm × 15.2 mm × 4.3 mm (L × W × H), lead pitch 2.54 mm, window aperture centered over die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A14 | Address Inputs | 15-bit address bus interface; A9 doubles as electronic signature voltage selector (11.5–12.5 V). |
| Q0–Q7 | Data Outputs | Bi-directional TTL-compatible data bus; outputs driven only when E = L and G = L. |
| E | Chip Enable | Primary device select; high = standby (100 µA), low = active (30 mA); controls power state. |
| G | Output Enable | Secondary output gate; high = Hi-Z regardless of E; enables shared bus arbitration. |
| VPP | Programming Supply | 12.75 V input required only during programming/verify; must be applied after VCC and removed before VCC. |
| VCC | Supply Voltage | 5 V ±10% main power; 6.25 V ±0.25 V required during programming (not 5 V). |
| VSS | Ground | Reference return for all signals; decoupling requires 0.1 µF ceramic + 4.7 µF bulk per 8 devices. |
| NC | No Connect | Internally unconnected pins (e.g., PLCC32 pin 17); must remain floating or grounded per layout rules. |
| DU | Don't Use | Pins marked DU (e.g., PLCC32 pin 1) are reserved; no electrical connection or routing allowed. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-line output control (E + G) | Eliminates bus contention in multi-chip memory arrays by separating power gating (E) from data gating (G). |
| UV erasability (FDIP28W) | Enables unlimited reprogramming cycles via 2537 Å UV exposure (15–20 min), critical for prototype firmware iteration. |
| Electronic signature (20h/8Dh) | Allows automated device identification in production programmers, preventing mismatched algorithm execution. |
| Two-speed AC characterization | Guaranteed 70 ns access at commercial temp (0–70°C); extended 150 ns spec available for industrial –40 to 125°C operation. |
| Low standby current (100 µA) | Supports power-sensitive applications like battery-backed configuration storage in telecom line cards. |
Applications
| Industrial PLC Firmware Storage | Legacy Automotive ECU Boot ROM |
|---|---|
|
Use Scenario: Storing ladder logic firmware in programmable logic controllers where field updates require physical UV erasure and reprogramming. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped to CPU address space; accessed during power-on reset with 70 ns tAVQV timing constraint. Use Value: FDIP28W window enables on-site erasure using portable UV lamps, avoiding costly chip replacement during firmware revision cycles. |
Use Scenario: Holding engine calibration tables and startup routines in pre-OBD-II automotive ECUs with no in-system programming capability. IC Role / Device Role / Timing Role: Read-only instruction memory for 8051 or 68HC11 microcontrollers; timing validated under –40 to 125°C ambient per AEC-Q100 Class 2. Use Value: 100 µA standby current prevents battery drain during vehicle idle periods exceeding 30 days. |
| Military Radio Configuration Memory | Avionics Test Equipment BIOS |
|
Use Scenario: Storing secure radio frequency hopping sequences and encryption keys in manpack radios subject to MIL-STD-810G environmental stress. IC Role / Device Role / Timing Role: Tamper-resistant configuration store; UV window sealed post-programming to prevent unauthorized erasure. Use Value: Ceramic FDIP28W package withstands 1500 g shock and –55 to 125°C thermal cycling without parameter shift. |
Use Scenario: Hosting self-test firmware and hardware initialization code in ground-based avionics diagnostic tools requiring zero-failure reliability. IC Role / Device Role / Timing Role: Cold-start ROM executed immediately after power application; verified with PRESTO II algorithm for 100% bit-level margin. Use Value: Electronic signature (20h/8Dh) ensures correct device recognition during automated test fixture calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar EPROM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM27C256B-70DC | Same 256 Kbit × 8 organization, 70 ns access, but uses PDIP28 (no UV window) and AMD silicon process. | OTP-only; no UV erasure capability - suitable only for final-production firmware with no field update requirement. | Select when cost sensitivity outweighs field reprogrammability and ceramic packaging is unnecessary. |
| AT27C256B-70PU | Atmel variant with identical pinout and AC specs, but lower programming current (30 mA vs. 50 mA) and wider VPP tolerance (12.5–13.5 V). | Compatible with legacy programmers lacking tight 12.75 V regulation; higher immunity to VPP ripple during mass programming. | Select for high-volume gang programming where VPP stability margins are marginal in existing equipment. |
Compared with AM27C256B-70DC, M27C256B-70XF1 provides field-erasable flexibility at the cost of ceramic packaging and UV handling requirements; versus AT27C256B-70PU, it offers tighter VPP control for enhanced programming yield in precision environments.
Availability
M27C256B-70XF1 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, legacy automotive ECU boot ROM, and military radio configuration memory requiring stable component supply across extended product lifecycles.
Supply support for M27C256B-70XF1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with vertical manufacturing capabilities.
The M27C256B belongs to ST's legacy EPROM product line, designed specifically for microprocessor-based systems requiring field-erasable non-volatile storage in harsh or long-lifecycle environments.
FAQ
What UV wavelength and exposure dose are required to fully erase M27C256B-70XF1?
Full erasure requires short-wave ultraviolet light at 2537 Å wavelength with a minimum integrated dose of 15 W·s/cm². Using a standard 12,000 µW/cm² UV lamp, the device must be placed within 2.5 cm of the source for 15–20 minutes. Room fluorescent lighting (3000–4000 Å) can cause partial erasure over months; opaque window labels are recommended for long-term storage.
Can M27C256B-70XF1 be programmed using a standard 5 V-only programmer?
No. Programming requires three distinct voltage rails: VCC = 6.25 V ±0.25 V, VPP = 12.75 V ±0.25 V, and A9 = 11.5–12.5 V for electronic signature verification. Standard 5 V programmers lack the regulated 12.75 V VPP supply and precise A9 biasing, risking incomplete programming or cell damage.
How does the two-line control (E and G) reduce power consumption in multi-chip memory systems?
E (Chip Enable) gates power to the entire array - when high, ICC drops to 100 µA regardless of address or data activity. G (Output Enable) only disables output drivers while keeping internal circuitry active. In multi-chip systems, E is decoded per device while G is shared, ensuring only one device draws 30 mA active current while others remain in ultra-low-power standby.
Is the FDIP28W package RoHS-compliant?
No. The FDIP28W package contains leaded solder (Pb-based frit seal) and is exempt from RoHS under Annex III (category 7a - high-melting temperature type solders). STMicroelectronics discontinued RoHS-compliant replacements for this package; alternatives require redesign to PLCC32 or TSOP28 OTP variants without UV capability.
M27C256B-70XF1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 28-CDIP (0.600", 15.24mm) Window
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- EPROM
- Technology:
- EPROM - UV
- Memory Size:
- 256Kbit
- Memory Organization:
- 32K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 70 ns
- Voltage - Supply:
- 4.75V ~ 5.25V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 28-CDIP Frit Seal with Window
M27C256B-70XF1 FAQ
1.How can I place an order for M27C256B-70XF1 through Aetrix?
Please submit a Request for Quotation (RFQ) for M27C256B-70XF1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M27C256B-70XF1 reliable?
The price and inventory of M27C256B-70XF1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M27C256B-70XF1 is usually 5 days.
3.What payment methods are accepted for M27C256B-70XF1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M27C256B-70XF1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M27C256B-70XF1?
M27C256B-70XF1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M27C256B-70XF1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M27C256B-70XF1?
For technical support, including M27C256B-70XF1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M27C256B-70XF1 requirements.
6.How does Aetrix verify that M27C256B-70XF1 is sourced from the original manufacturer or authorized distributors?
All M27C256B-70XF1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M27C256B-70XF1 meets industry standards.
7.What is the process for return or replacement of M27C256B-70XF1?
All M27C256B-70XF1 units undergo pre-shipment inspection (PSI). If there is an issue with M27C256B-70XF1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M27C256B-70XF1 part is unused and in its original packaging.
Return procedure for M27C256B-70XF1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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