My Inquiry
My Account
STMicroelectronics M29DW323DB90N6
- Part No.:
- M29DW323DB90N6
- Manufacturer:
- STMicroelectronics
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
M29DW323DB90N6.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,452
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
M29DW323DB90N6 from STMicroelectronics is a 32 Mbit (4Mb x8 or 2Mb x16) dual-bank boot-block flash memory with asymmetric 8Mbit+24Mbit bank architecture, 70 ns access time, 10 µs typical byte/word programming, and 100,000 program/erase cycles per block. It supports concurrent read in one bank while programming or erasing in the other, and is used in embedded systems for firmware storage and boot code execution.
For engineers reviewing the M29DW323DB90N6 datasheet, M29DW323DB90N6 pinout, M29DW323DB90N6 application, or M29DW323DB90N6 equivalent, key selection criteria include dual-bank operation support, bottom-boot block configuration, TSOP48 (N) package compatibility, CFI-compliant command interface, and VPP/WP pin functionality for fast programming and hardware write protection.
Technical Context
This device implements a JEDEC-standard Common Flash Interface (CFI) with 64-bit security code, enabling standardized host detection and configuration. Its dual-bank architecture separates 8Mbit (Bank A, parameter blocks) and 24Mbit (Bank B, main blocks), allowing true background operations - e.g., reading from Bank B while erasing Bank A.
The on-chip Program/Erase Controller handles voltage sequencing, timing, and status monitoring, eliminating external high-voltage generators. Block-level erase suspend/resume enables real-time interrupt handling during long erase operations, and the extended block (32 KWord in x16 mode) provides irreversible factory- or customer-lockable secure storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (4Mb x8 or 2Mb x16 organization) |
| Access Time | 70 ns - determines maximum bus clock rate for zero-wait-state read operations |
| Programming Time | 10 µs/byte or word - enables high-throughput firmware updates in production |
| Endurance | 100,000 program/erase cycles per block - supports field-upgradable embedded applications |
| VCC Range | 2.7V to 3.6V - compatible with 3.3V logic systems without level shifting |
| Block Architecture | Asymmetric dual bank: 8Mbit + 24Mbit with bottom-boot parameter blocks - ensures reliable boot code retention |
| Security Feature | 64-bit CFI security code + irreversible extended block lock - prevents unauthorized firmware modification |
Pinout & Package
Package: TSOP48 (N), 12 × 20 mm, plastic thin small outline, lead-free compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 32 Mbit addressing in x8/x16 modes |
| DQ0–DQ7 | Data I/O (x8 mode) | 8-bit bidirectional data path; multiplexed with DQ8–DQ14 in x16 mode |
| DQ8–DQ14 | Data I/O (x16 mode) | Upper data byte in x16 configuration; unused in x8 mode |
| DQ15A–1 | Data I/O or Address Input | Acts as A–1 in x8 mode; DQ15 in x16 mode - enables flexible bus-width selection |
| E (Chip Enable) | Chip Select Control | Active-low enable for memory access; allows multi-chip decoding without glue logic |
| G (Output Enable) | Output Gate Control | Active-low control of data bus drivers - enables shared bus arbitration |
| W (Write Enable) | Write Strobe | Controls latching of commands and data; supports both CE- and WE-controlled write protocols |
| VPP/WP | Fast Program Voltage / Write Protect | 12V input enables accelerated programming; tied low disables all writes for hardware lock |
| RP | Reset / Temporary Unprotect | Resets internal state; toggling unprotects temporarily locked parameter blocks |
| RB | Ready/Busy Output | Open-drain signal indicating active program/erase - eliminates polling overhead |
| BYTE | Bus Width Select | VIH = x16 mode; VIL = x8 mode - configures data bus width at power-on |
| VCC, VSS | Power Supply | Single 2.7–3.6V supply; no separate I/O or core voltage rails required |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Bank Concurrent Operations | Read from one bank while programming/erasing the other - enables zero-downtime firmware updates |
| Erase Suspend/Resume | Pause ongoing block erase to service interrupts or read other blocks - critical for real-time OS integration |
| Unlock Bypass Programming | Reduces command overhead by skipping unlock sequence for sequential writes - improves batch programming throughput |
| Bottom-Boot Block Architecture | Parameter blocks located at lowest addresses (000000h–001FFFh in x8) - ensures boot loader executes from fixed, protected location |
| Extended Security Block | 32 KWord (x16) or 64 KByte (x8) dedicated block with irreversible lock - stores cryptographic keys or calibration data |
| CFI Compliance | JEDEC JESD68-defined query table - enables automatic driver detection and configuration in Linux/BSP environments |
Applications
| Industrial PLC Firmware Storage | Automotive ECU Boot Memory |
|---|---|
Use Scenario: Storing and updating ladder logic programs and I/O configuration in programmable logic controllers with runtime integrity checks. IC Role / Device Role / Timing Role: Non-volatile boot and application code storage with dual-bank read-while-write capability to maintain operational continuity during field updates. Use Value: Enables hot firmware patching without system reset; bottom-boot layout guarantees bootloader execution from verified, write-protected region. |
Use Scenario: Holding boot code and safety-critical calibration data in engine control units requiring ASIL-B compliance and tamper resistance. IC Role / Device Role / Timing Role: Primary boot flash with extended block used for immutable security keys and sensor offset tables. Use Value: Irreversible extended block lock prevents unauthorized reprogramming; CFI interface simplifies bootloader compatibility across MCU platforms. |
| Medical Device Diagnostic Firmware | Networking Equipment Configuration Storage |
Use Scenario: Hosting diagnostic self-test routines and regulatory-compliant update packages in portable ultrasound and infusion pumps. IC Role / Device Role / Timing Role: Dual-bank flash supporting concurrent diagnostics execution (Bank A) and firmware validation/write (Bank B). Use Value: 70 ns access time meets real-time response requirements; 100K-cycle endurance supports frequent regulatory-mandated field updates. |
Use Scenario: Storing boot images, FPGA bitstreams, and vendor-specific configuration profiles in enterprise switches and routers. IC Role / Device Role / Timing Role: High-reliability configuration store with hardware write protection (VPP/WP pin) preventing accidental corruption during power transients. Use Value: TSOP48 package enables compact PCB layout; CFI query support allows unified driver stack across multiple switch ASIC families. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar boot-block flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SST39VF3201B-70-4I-EKE | 32 Mbit, 70 ns, single-bank architecture; no dual-operation or erase suspend | Lacks concurrent read-while-erase; requires full chip erase for updates | Select when cost sensitivity outweighs need for background operations and endurance is secondary |
| MX29LV320EBTI-70G | 32 Mbit, 70 ns, top-boot configuration; identical dual-bank and CFI support | Parameter blocks at top address space (vs. bottom in M29DW323DB); incompatible boot vector mapping | Choose only if existing design uses top-boot layout and pinout compatibility is confirmed |
Compared with SST39VF3201B-70-4I-EKE, M29DW323DB90N6 delivers true background operations and higher reliability via erase suspend and bottom-boot security; versus MX29LV320EBTI-70G, it offers identical performance but mandates board-level address remapping due to inverted boot block orientation.
Availability
M29DW323DB90N6 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical device diagnostic firmware requiring stable component supply, long-lifecycle availability, and consistent TSOP48 packaging.
Supply support for M29DW323DB90N6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in microcontrollers, power management, and non-volatile memory solutions for industrial, automotive, and consumer applications.
The M29DW323DB belongs to ST's M29DW family of dual-bank boot-block flash memories, designed specifically for embedded systems requiring field-upgradable firmware with guaranteed boot code integrity and real-time operational continuity.
FAQ
What boot configuration does M29DW323DB90N6 use?
M29DW323DB90N6 implements a bottom-boot block architecture: its 8 parameter blocks (each 8 KByte in x8 mode) reside at the lowest address range (000000h–001FFFh), ensuring the processor fetches boot code from a fixed, hardware-protected region upon reset. This differs from the top-boot M29DW323DT variant.
Does this device require a 12V supply for normal operation?
No - VCC operates from 2.7V to 3.6V for all read, program, and erase functions. The 12V VPP input is optional and only required to activate Fast Program mode, which reduces byte/word programming time. In standard mode, programming occurs at VCC alone with no external high-voltage source needed.
How is block protection implemented and can it be reversed?
Block protection is implemented via software commands and hardware pins (VPP/WP low disables all writes). Parameter blocks support temporary unprotection via RP pin toggling. However, the extended block's protection is irreversible once set - it cannot be unlocked, making it suitable for permanent security data storage such as cryptographic keys.
Is the TSOP48 package RoHS compliant and lead-free?
Yes - the "N" suffix in M29DW323DB90N6 explicitly denotes a lead-free, RoHS-compliant TSOP48 package (12 × 20 mm), qualified per JEDEC standards and suitable for modern automated assembly processes without requiring special solder profile adjustments.
M29DW323DB90N6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
M29DW323DB90N6 FAQ
1.How can I place an order for M29DW323DB90N6 through Aetrix?
Please submit a Request for Quotation (RFQ) for M29DW323DB90N6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M29DW323DB90N6 reliable?
The price and inventory of M29DW323DB90N6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M29DW323DB90N6 is usually 5 days.
3.What payment methods are accepted for M29DW323DB90N6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M29DW323DB90N6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M29DW323DB90N6?
M29DW323DB90N6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M29DW323DB90N6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M29DW323DB90N6?
For technical support, including M29DW323DB90N6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M29DW323DB90N6 requirements.
6.How does Aetrix verify that M29DW323DB90N6 is sourced from the original manufacturer or authorized distributors?
All M29DW323DB90N6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M29DW323DB90N6 meets industry standards.
7.What is the process for return or replacement of M29DW323DB90N6?
All M29DW323DB90N6 units undergo pre-shipment inspection (PSI). If there is an issue with M29DW323DB90N6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M29DW323DB90N6 part is unused and in its original packaging.
Return procedure for M29DW323DB90N6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M29DW323DB90N6 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
