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Renesas M30042040054X0ISAR

Part No.:
M30042040054X0ISAR
Manufacturer:
Renesas
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixM30042040054X0ISAR.pdf
Description:
IC RAM 4MBIT 54MHZ 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,706

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Product details

Overview

M30042040054X0ISAR from Renesas is a 4Mb serial STT-MRAM non-volatile memory IC with QSPI interface, 54MHz DDR timing, industrial temperature range (−40°C to +85°C), and 8-pin SOIC package. It delivers SRAM-compatible random read/write latency, zero write endurance limit, and data retention exceeding 20 years - deployed in factory automation controllers for real-time parameter logging without battery backup.

For engineers reviewing the M30042040054X0ISAR datasheet, M30042040054X0ISAR pinout, M30042040054X0ISAR application, or M30042040054X0ISAR equivalent, key selection criteria include its 1.71–2.0V/2.7–3.6V dual-voltage support, hardware/software write protection, 256-byte augmented storage array, and JEDEC-compliant reset capability.

Technical Context

The M30042040054X0ISAR implements Quad SPI (4-4-4) with Double Data Rate mode at 54MHz, supporting both SPI Mode 0 and Mode 3. Its pMTJ-based STT-MRAM cell structure enables true random access with no erase cycles, eliminating write latency penalties inherent in Flash.

It integrates dedicated registers for status control, configuration (four registers), device identification (64-bit unique ID), and user-programmable serial number. The 256-byte augmented storage array is partitioned into eight 32-byte sections, each independently programmable and protectable via configuration bits.

Key Specifications

Parameter Value and Actual Design Meaning
Density4Mbit (512KB) main memory array - supports firmware parameter storage with byte-level random access
InterfaceQSPI (4-4-4) with DDR mode at 54MHz - doubles throughput vs SDR; compatible with standard SPI host controllers
Operating Voltage1.71V–2.00V or 2.70V–3.60V - dual-rail flexibility for 1.8V and 3.3V system integration
Temperature RangeIndustrial: −40°C to +85°C - qualified for embedded control environments without derating
Endurance & RetentionVirtually unlimited write cycles (>10¹⁵) and >20-year data retention - eliminates wear leveling and refresh logic
Package8-pin SOIC (5.2mm × 5.2mm) - drop-in replacement for legacy SPI NOR/EEPROM in existing PCB footprints
Data ProtectionHardware WP# pin + software-configurable block/top-bottom protection - prevents accidental writes during power transients

Pinout & Package

8-pin SOIC package (5.2mm × 5.2mm), RoHS-compliant, surface-mountable with standard reflow profile.

Pin/Terminal Circuit Role Design Meaning
CS#Chip Select InputActive-low enable; must be low before command latching; high places device in standby (ISB current)
WP# / IO[2]Bidirectional I/O / Write ProtectIn SPI mode: hardware write protect for status register; in QPI mode: bidirectional data line IO[2]
SI / IO[0]Serial Input / Bidirectional Data 0In SPI: command/address/data input; in QPI: bidirectional data line IO[0]
CLKClock InputSynchronizes all transfers; DDR uses both rising/falling edges; SDR uses rising edge for input, falling for output
IO[3]Bidirectional Data 3QPI-only data line; tied to VCC if unused in SPI mode
SO / IO[1]Serial Output / Bidirectional Data 1In SPI: data output on falling edge; in QPI: bidirectional data line IO[1]
VCCPower SupplyCore and I/O supply; supports 1.71–2.0V or 2.7–3.6V operation
VSSGroundReference for all signals and internal regulators; requires local decoupling

Key Features

Feature Design Value
eXecute-In-Place (XIP)Enables continuous read sequences without repeated command overhead - reduces effective random read latency by ~30%
Augmented Storage Array256-byte user-programmable space, partitioned into eight 32-byte sections, each individually write-protectable
JEDEC Reset SupportStandardized reset command (66h) ensures interoperability with host bootloaders and memory managers
Low-Power StatesDeep Power Down (IDPD) and Hibernate modes retain full configuration and data while drawing <1µA
Unique Identification64-bit factory-programmed UID + 64-bit user-programmable serial number - enables secure device binding and traceability

Applications

Factory Automation Controller Medical Diagnostic Imaging Module

Use Scenario: Real-time logging of sensor calibration coefficients and operational event timestamps across multiple production lines.

IC Role / Device Role / Timing Role: Non-volatile parameter store with sub-100ns random write capability and zero write latency penalty.

Use Value: Eliminates supercapacitor/battery backup circuitry while guaranteeing data integrity during unexpected power loss.

Use Scenario: Storing DICOM header metadata and acquisition settings between imaging sessions in portable ultrasound units.

IC Role / Device Role / Timing Role: Persistent configuration memory accessed during cold boot and runtime reconfiguration.

Use Value: Ensures deterministic startup timing and eliminates EEPROM write-time delays that disrupt imaging workflow.

Industrial Network Switch Multifunction Printer Engine Control

Use Scenario: Storing MAC address tables, VLAN configurations, and firmware update staging buffers in managed Ethernet switches.

IC Role / Device Role / Timing Role: High-reliability configuration store supporting concurrent read/write under network traffic load.

Use Value: Prevents configuration corruption during firmware updates or link flapping events due to infinite endurance.

Use Scenario: Holding print job queue metadata, toner level history, and calibration profiles across power cycles in A3-format printers.

IC Role / Device Role / Timing Role: Fast-access persistent memory interfaced directly to ARM Cortex-M7 application processor via QSPI.

Use Value: Enables instant-on functionality and eliminates 2–3 second "warming up" delay caused by slow NOR flash initialization.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial non-volatile memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress Semiconductors FM25V05-G512Kb F-RAM; 40MHz SPI; single 3.3V supply only; no QPI or DDR modeLimited density and interface bandwidth; lacks augmented storage array and JEDEC resetChoose for cost-sensitive, low-bandwidth systems where 512KB suffices and QPI is unnecessary
Winbond W25Q40EW4Mb SPI NOR Flash; 133MHz SDR; requires sector erase before write; 100K-cycle enduranceHigher write latency, finite endurance, no XIP support; incompatible with MRAM's instant-write architectureChoose only if legacy NOR footprint compatibility is mandatory and write frequency is low (<100x/day)

Compared with FM25V05-G and W25Q40EW, the M30042040054X0ISAR provides 8× higher density than F-RAM and eliminates Flash's erase bottleneck - enabling deterministic real-time logging in industrial control loops without wear management overhead.

Availability

M30042040054X0ISAR is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial networking requiring stable component supply, long-term lifecycle assurance, and guaranteed MRAM performance consistency.

Supply support for M30042040054X0ISAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.

The Mxxxx204 family was designed as a persistent SRAM (P-SRAM) replacement - delivering true random-access non-volatility for mission-critical embedded systems where data integrity, speed, and endurance outweigh cost-per-bit considerations.

FAQ

What voltage ranges does the M30042040054X0ISAR support?

The M30042040054X0ISAR supports two independent operating voltage ranges: 1.71V to 2.00V for 1.8V systems and 2.70V to 3.60V for 3.3V systems. Both ranges are fully specified across the full industrial temperature range (−40°C to +85°C), and the device automatically adapts internal regulation - no external voltage selection logic is required for M30042040054X0ISAR operation.

Does the M30042040054X0ISAR require an erase cycle before writing?

No, the M30042040054X0ISAR does not require any erase operation prior to writing. As a spin-transfer torque MRAM device, it performs true byte-level random writes with identical timing for read and write operations. This eliminates the latency, complexity, and endurance limitations associated with Flash erase cycles - a core architectural advantage confirmed in the M30042040054X0ISAR datasheet Section 1.

What is the function of the Augmented Storage Array in the M30042040054X0ISAR?

The M30042040054X0ISAR includes a dedicated 256-byte Augmented Storage Array, physically separate from the main 4Mb memory. It is divided into eight 32-byte sections, each independently programmable and write-protectable via configuration registers. This area is commonly used for storing cryptographic keys, calibration data, or device-specific identifiers - and its isolation enhances security and reliability for critical parameters.

Is the M30042040054X0ISAR pin-compatible with standard SPI NOR flash devices?

Yes, the M30042040054X0ISAR in 8-pin SOIC package uses the industry-standard pinout (CS#, WP#/IO[2], SI/IO[0], CLK, IO[3], SO/IO[1], VCC, VSS) defined in JEDEC JESD252. This allows direct PCB-level replacement of legacy SPI NOR devices such as Winbond W25Q40EW or Macronix MX25L4006E - provided host firmware supports MRAM-specific commands like JEDEC reset (66h) and XIP entry (Axh).

How does the M30042040054X0ISAR handle power-loss events during write operations?

The M30042040054X0ISAR guarantees atomic write completion down to VCC = 1.6V (VCC_CUTOFF threshold). Below this voltage, the device enters a safe state and retains all previously written data. No external capacitor or backup power source is needed - data persistence is inherent to the STT-MRAM cell physics. This behavior is validated per JEDEC JESD22-A123 and documented in the M30042040054X0ISAR power-up/down timing tables (Pages 14–15).

M30042040054X0ISAR Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
RAM
Technology:
MRAM (Magnetoresistive RAM)
Memory Size:
4Mbit
Memory Organization:
1M x 4
Memory Interface:
-
Clock Frequency:
54 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

M30042040054X0ISAR FAQ

1.How can I place an order for M30042040054X0ISAR through Aetrix?

Please submit a Request for Quotation (RFQ) for M30042040054X0ISAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for M30042040054X0ISAR reliable?

The price and inventory of M30042040054X0ISAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M30042040054X0ISAR is usually 5 days.

3.What payment methods are accepted for M30042040054X0ISAR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M30042040054X0ISAR transactions.

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4.How is shipping managed for M30042040054X0ISAR?

M30042040054X0ISAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your M30042040054X0ISAR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M30042040054X0ISAR?

For technical support, including M30042040054X0ISAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M30042040054X0ISAR requirements.

6.How does Aetrix verify that M30042040054X0ISAR is sourced from the original manufacturer or authorized distributors?

All M30042040054X0ISAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M30042040054X0ISAR meets industry standards.

7.What is the process for return or replacement of M30042040054X0ISAR?

All M30042040054X0ISAR units undergo pre-shipment inspection (PSI). If there is an issue with M30042040054X0ISAR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M30042040054X0ISAR part is unused and in its original packaging.

Return procedure for M30042040054X0ISAR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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