Renesas M30042040108X0PWAR
- Part No.:
- M30042040108X0PWAR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
M30042040108X0PWAR.pdf
- Description:
- IC RAM 4MBIT 108MHZ 8DFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,392
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
M30042040108X0PWAR from Renesas is a 4Mb serial STT-MRAM (Spin-Transfer Torque Magnetoresistive RAM) with QSPI interface, 108MHz SDR clock rate, 1.71–2.0V supply, industrial-plus temperature range (−40°C to +105°C), and 8-pad DFN (WSON) package. It serves as persistent SRAM replacement in real-time data logging systems requiring zero-write-latency non-volatility.
For engineers reviewing the M30042040108X0PWAR datasheet, M30042040108X0PWAR pinout, M30042040108X0PWAR application, or M30042040108X0PWAR equivalent, key selection criteria include QSPI x4 timing compliance, hardware write-protect (WP#) support, 256-byte augmented storage array programmability, and deep power-down exit time ≤400 µs.
Technical Context
The M30042040108X0PWAR implements a 40nm pMTJ STT-MRAM array with true random access, enabling byte-level reads/writes without erase cycles. Its command architecture supports QPI (4-4-4) mode and XIP (eXecute-In-Place), reducing instruction overhead for sequential memory access.
It integrates dual protection: hardware-based via WP# pin (active-low, no internal pull-up) and software-based via status register configuration bits (BPSEL[2:0], TBSEL). The device supports two low-power states-Deep Power Down (IDPD, 3 µs entry, 400 µs exit) and Hibernate (IHBN, 3 µs entry, 450 µs exit)-with full configuration retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 4 Mbit (512 KB); directly maps to 0x000000–0x07FFFF address space |
| Interface | QSPI (4-4-4) with SDR up to 108 MHz; enables 432 MB/s peak throughput |
| Supply Voltage | 1.71 V – 2.00 V; compatible with 1.8V logic domains and low-power SoC I/O |
| Operating Temp | −40°C to +105°C; qualified for industrial-plus environments including motor drives and medical diagnostics |
| Endurance | Virtually unlimited (>10¹⁵ cycles); eliminates wear-leveling firmware overhead |
| Data Retention | ≥20 years at +105°C; guaranteed non-volatility without backup power or capacitors |
| Package | 8-pad DFN (WSON), 5.0 mm × 6.0 mm; surface-mount compatible with standard reflow profiles |
Pinout & Package
8-pad DFN (WSON) package, 5.0 mm × 6.0 mm footprint, wettable flank design for automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable; falling edge initiates instruction latch; high-Z output when deasserted |
| WP# / IO[2] | Bidirectional Data 2 / Write Protect | In SPI mode: hardware write-protect input (no internal pull-up); in QPI mode: bidirectional data line |
| SI / IO[0] | Serial Input / Data 0 | In SPI: unidirectional command/address/data input; in QPI: bidirectional data line |
| CLK | Clock Input | Drives synchronous transfers; rising edge latches commands in SDR/DDR; both edges used for data in DDR |
| IO[3] | Bidirectional Data 3 | QPI-only data line; must be tied to VCC if unused in SPI mode |
| SO / IO[1] | Serial Output / Data 1 | In SPI: unidirectional data output on falling edge; in QPI: bidirectional data line |
| VCC | Power Supply | 1.71–2.00 V core/I/O rail; requires local 100 nF decoupling per datasheet recommendation |
| VSS | Ground | Common reference for core and I/O; must be low-impedance connection to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| QSPI x4 Interface | Enables 4-line parallel data transfer for 4× bandwidth vs. standard SPI; supports JEDEC reset command |
| eXecute-In-Place (XIP) | Allows continuous read bursts without repeated command issuance; reduces average read latency by >30% in firmware code execution |
| Augmented Storage Array | 256-byte user-programmable section with per-32-byte write protection; ideal for storing calibration constants or secure keys |
| Hardware + Software Protection | WP# pin blocks status register writes when asserted; configurable block protect bits (BPSEL[2:0]) lock 1/2/4/8/16/32/64 KB regions |
| Deep Power Down Mode | Reduces current to IDPD level (<1 µA); retains all memory and register contents; 400 µs wake-up enables rapid system recovery |
Applications
| Factory Automation | Medical Diagnostics |
|---|---|
Use Scenario: PLCs and motion controllers logging sensor timestamps, fault codes, and recipe parameters during power loss events. IC Role / Device Role / Timing Role: Persistent SRAM replacement storing volatile runtime data with instant write capability and no endurance limits. Use Value: Eliminates supercapacitor or battery backup; guarantees data integrity across 100% duty-cycle operation at +105°C ambient. | Use Scenario: Portable ultrasound and MRI subsystems capturing calibration coefficients, patient session metadata, and diagnostic logs. IC Role / Device Role / Timing Role: Non-volatile parameter store accessed during boot and runtime; supports secure write-protection of regulatory-critical values. Use Value: Meets IEC 62304 Class C software requirements via guaranteed 20-year data retention at +105°C and tamper-resistant augmented storage. |
| Industrial Control And Monitoring | Data Switches And Routers |
Use Scenario: Remote RTUs and edge gateways recording telemetry, firmware update staging, and configuration snapshots in harsh environments. IC Role / Device Role / Timing Role: High-reliability configuration memory with hardware WP# and block-protect registers preventing accidental overwrites. Use Value: Enables field firmware updates without risk of corruption; supports −40°C cold-start and sustained +105°C operation in sealed enclosures. | Use Scenario: Layer-2/Layer-3 switches caching MAC tables, ACL rules, and port statistics during traffic surges or failover events. IC Role / Device Role / Timing Role: Low-latency packet metadata store with sub-100 ns write cycle time and zero erase latency. Use Value: Maintains forwarding table consistency across power cycles; avoids 10–100 ms flash erase delays that cause packet loss during reboot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial non-volatile memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors FM25V04-G | 4Mb F-RAM; 1.8V supply; 40 MHz SPI max; SOIC-8 only; no QPI or XIP | Limited to lower-speed control-plane storage; lacks augmented storage array and deep power-down exit optimization | Select for cost-sensitive designs where 40 MHz bandwidth suffices and QPI/XIP are unnecessary |
| Infineon Technologies CY14B104N-ZSP25XI | 4Mb nvSRAM; 2.7–3.6V supply; 25 MHz SPI; SOIC-28; built-in SRAM-to-Flash auto-store | Requires external capacitor for store operation; larger footprint; incompatible voltage domain with 1.8V systems | Select only when legacy 3.3V infrastructure exists and capacitor-based store reliability is acceptable |
Compared with FM25V04-G and CY14B104N-ZSP25XI, the M30042040108X0PWAR delivers 2.7× higher interface bandwidth, native 1.8V operation, smaller WSON footprint, and deterministic zero-latency writes-making it optimal for next-generation industrial edge nodes demanding speed, size, and thermal resilience.
Availability
M30042040108X0PWAR is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial control applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for M30042040108X0PWAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The M30042040108X0PWAR belongs to Renesas' Persistent SRAM (P-SRAM) family, engineered to replace battery-backed SRAM and legacy nvSRAM in mission-critical systems where data persistence, speed, and reliability cannot be compromised.
FAQ
What is the operating voltage range for the M30042040108X0PWAR?
The M30042040108X0PWAR operates from 1.71 V to 2.00 V. This 1.8V nominal supply range ensures compatibility with modern low-power microcontrollers and SoCs while maintaining robust noise margins. Operation outside this range may result in undefined behavior or data corruption. The device does not support 3.0V operation-M30042040108X0PWAR is specifically configured for the 1.8V voltage bin per its ordering code "1" in position 9 of the part number.
Does the M30042040108X0PWAR support Quad Peripheral Interface (QPI) mode?
Yes, the M30042040108X0PWAR supports full QPI (4-4-4) mode, using all four I/O pins (IO[0]–IO[3]) for command, address, and data transfer. This enables maximum throughput at 108 MHz SDR. QPI mode is enabled via configuration register settings and requires proper initialization sequence; it is not default on power-up. The M30042040108X0PWAR datasheet specifies timing for all QPI instruction types in Tables 3 and 4.
How is write protection implemented on the M30042040108X0PWAR?
The M30042040108X0PWAR implements dual-layer write protection: hardware-based via the WP# pin (active-low, no internal pull-up-must be driven), and software-based via status register bits (WP#EN, BPSEL[2:0], TBSEL). When WP#EN = 1 and WP# is low, the status register becomes read-only. Block protection can lock memory regions from 1 KB to 64 KB. Both schemes apply to main array and augmented storage array.
What is the purpose of the Augmented Storage Array in the M30042040108X0PWAR?
The M30042040108X0PWAR includes a dedicated 256-byte Augmented Storage Array, divided into eight 32-byte sections. Each section can be individually programmed and write-protected. It is intended for storing critical, infrequently updated data such as calibration coefficients, device serial numbers, or cryptographic keys-separate from main memory to prevent accidental overwrite during firmware updates or bulk operations.
What are the power-down capabilities of the M30042040108X0PWAR?
The M30042040108X0PWAR supports two ultra-low-power states: Deep Power Down (IDPD, <1 µA typical) and Hibernate (IHBN, ~10 µA). Both retain full memory and register contents. Entry requires specific JEDEC commands (B9h/BAh); exit times are guaranteed ≤400 µs (IDPD) and ≤450 µs (IHBN). These modes enable energy harvesting and battery-powered applications where standby current and wake latency are critical.
M30042040108X0PWAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 4Mbit
- Memory Organization:
- 1M x 4
- Memory Interface:
- -
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DFN (5x6)
M30042040108X0PWAR FAQ
1.How can I place an order for M30042040108X0PWAR through Aetrix?
Please submit a Request for Quotation (RFQ) for M30042040108X0PWAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M30042040108X0PWAR reliable?
The price and inventory of M30042040108X0PWAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M30042040108X0PWAR is usually 5 days.
3.What payment methods are accepted for M30042040108X0PWAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M30042040108X0PWAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M30042040108X0PWAR?
M30042040108X0PWAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M30042040108X0PWAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M30042040108X0PWAR?
For technical support, including M30042040108X0PWAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M30042040108X0PWAR requirements.
6.How does Aetrix verify that M30042040108X0PWAR is sourced from the original manufacturer or authorized distributors?
All M30042040108X0PWAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M30042040108X0PWAR meets industry standards.
7.What is the process for return or replacement of M30042040108X0PWAR?
All M30042040108X0PWAR units undergo pre-shipment inspection (PSI). If there is an issue with M30042040108X0PWAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M30042040108X0PWAR part is unused and in its original packaging.
Return procedure for M30042040108X0PWAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M30042040108X0PWAR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

