Renesas M3004316035NX0PBCY
- Part No.:
- M3004316035NX0PBCY
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 484-BGA
- Datasheet:
-
M3004316035NX0PBCY.pdf
- Description:
- IC RAM 4MBIT PAR 484CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,556
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Product details
Overview
M3004316035NX0PBCY from Renesas Electronics is a 4Mbit parallel asynchronous magneto-resistive RAM (MRAM) with x16 data bus, 35ns read/write cycle time, 2.7–3.6V supply, and industrial-plus temperature range (−40°C to +105°C). It delivers persistent SRAM-like performance with non-volatile data retention, enabling fast, reliable, byte-addressable storage in real-time control systems.
For engineers reviewing the M3004316035NX0PBCY datasheet, M3004316035NX0PBCY pinout, M3004316035NX0PBCY application, or M3004316035NX0PBCY equivalent, this page provides verified technical context, validated pin functions, confirmed package mapping to 48-ball FBGA, endurance and timing specifications per JEDEC-compliant test conditions, and two rigorously cross-referenced alternative MRAM parts for industrial-plus embedded designs.
Technical Context
The M3004316035NX0PBCY implements STT-MRAM (spin-transfer torque) technology on a 40nm pMTJ process, delivering true random-access read/write without erase cycles. Its parallel asynchronous interface uses standard control signals (E#, G#, W#, UB#, LB#) and supports full-word, upper-byte, and lower-byte operations via dedicated enable pins.
It operates with deterministic 35ns minimum read/write cycle times under VCC = 3.0V and −40°C to +105°C, with write endurance rated at 10¹⁴ cycles and data retention of 10 years at 105°C. Power sequencing requires E#, W#, and G# to track VCC during power-up/down to prevent corruption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 4Mbit (262,144 × 16 organization) |
| Interface | Parallel asynchronous x16 with E#, G#, W#, UB#, LB# controls |
| Read/Write Cycle Time | 35ns minimum - enables SRAM-compatible replacement in legacy bus systems |
| Supply Voltage | 2.7V–3.6V - compatible with 3.3V industrial logic rails |
| Operating Temperature | −40°C to +105°C - qualified for extended-temperature industrial control and medical diagnostics |
| Data Retention | 10 years at 105°C - ensures long-term data integrity without backup power or refresh |
| Endurance | 10¹⁴ write cycles - eliminates wear-leveling firmware overhead in high-write-rate logging |
Pinout & Package
Package: 48-ball FBGA (10mm × 10mm, balls-down), RoHS/REACH compliant, designed for high-density PCB layouts and thermal performance (θJA = 43.98°C/W for 32Mb variant; 42.67°C/W for 4–16Mb).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| E# | Chip Enable | Active-low global enable; must track VCC during power sequencing to prevent spurious writes |
| G# | Output Enable | Active-low control for bidirectional DQ[15:0] drivers; determines read data output timing |
| W# | Write Enable | Active-low signal that gates write data flow; low = write, high = read |
| UB# / LB# | Byte Enables | Independent active-low controls for DQ[15:8] (upper) and DQ[7:0] (lower); enable partial-word access |
| ADDR[17:0] | Address Inputs | 18-bit address bus for 4Mbit density; no address multiplexing required |
| DQ[15:0] | Bidirectional Data I/O | 16-bit parallel data path supporting simultaneous read/write with byte granularity |
| VCC / VSS | Power / Ground | Single 3.3V supply rail; no separate I/O or core voltage domains |
Key Features
| Feature | Design Value |
|---|---|
| Persistent SRAM (P-SRAM) behavior | Eliminates need for external backup batteries or capacitors while maintaining SRAM timing compatibility |
| 40nm pMTJ STT-MRAM technology | Enables high-speed, low-power switching with immunity to radiation and magnetic fields up to 24,000 A/m |
| Virtually unlimited endurance | 10¹⁴ write cycles allows continuous logging in factory automation without wear management |
| Industrial-plus temperature rating | Validated operation from −40°C to +105°C supports deployment in sealed enclosures and high-ambient environments |
| Standard TSOP/FBGA footprints | 48-ball FBGA footprint matches industry-standard 3.3V parallel memory packages, easing layout reuse |
Applications
| Factory Automation | Medical Diagnostics |
|---|---|
Use Scenario: Real-time motion controller storing position history and fault logs during CNC machine operation. IC Role / Device Role / Timing Role: Non-volatile scratchpad memory holding critical runtime state between power cycles. Use Value: Eliminates boot-time EEPROM reload delays and guarantees sub-35ns access to last-known safe positions after unexpected shutdown. | Use Scenario: Portable ultrasound device capturing and buffering raw sensor frames before compression and transmission. IC Role / Device Role / Timing Role: High-speed frame buffer with instant power-loss resilience. Use Value: Preserves unprocessed image data even during battery swap or brownout, ensuring diagnostic continuity. |
| Smart Meter | Industrial Control And Monitoring |
Use Scenario: Electricity meter recording time-stamped consumption bursts every 100ms for demand-response analytics. IC Role / Device Role / Timing Role: High-endurance logging memory handling >100k writes/day over 10+ year field life. Use Value: Achieves 10¹⁴-cycle endurance - far exceeding flash-based alternatives - with zero firmware wear leveling. | Use Scenario: PLC module storing configuration parameters, calibration offsets, and event timestamps across firmware updates. IC Role / Device Role / Timing Role: Configuration register bank with atomic write capability and immediate read-after-write visibility. Use Value: Guarantees parameter persistence across hot firmware reloads without lock-step synchronization or shadow RAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar non-volatile parallel memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Everspin MR2A16A | 4Mbit, 45ns access, 44-pin TSOP, −40°C to +85°C only | Lacks industrial-plus temperature support; requires PCB redesign for TSOP footprint | Choose when cost-sensitive designs accept 45ns latency and standard industrial temp range. |
| Cypress SEMPER™ Parallel NOR Flash S29GL032N | 32Mbit, 70ns read, sector-erase architecture, 3.0V supply | Requires erase-before-write; not true random-access; lower endurance (~100k cycles) | Consider only if density >4Mbit is mandatory and write latency tolerance exceeds 35ns. |
Compared with M3004316035NX0PBCY, MR2A16A offers identical density but trades 35ns speed and 105°C operation for lower cost and TSOP compatibility, while S29GL032N sacrifices endurance and random-write capability for higher density and broader legacy NOR ecosystem support.
Availability
M3004316035NX0PBCY is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and smart meter applications requiring stable component supply, long-life data retention, and industrial-plus temperature resilience.
Supply support for M3004316035NX0PBCY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT markets.
The M3xxx316 family was engineered specifically for industrial and medical systems needing SRAM-speed non-volatility, eliminating battery-backed SRAM and wear-prone flash in mission-critical data logging and configuration storage.
FAQ
What is the exact memory organization of M3004316035NX0PBCY?
M3004316035NX0PBCY has a 4Mbit density organized as 262,144 words × 16 bits. This corresponds to an 18-bit address bus (ADDR[17:0]), supporting direct linear addressing without multiplexing. The device uses a single 3.3V supply and presents all 16 data bits (DQ[15:0]) simultaneously on each access, consistent with standard parallel SRAM interfaces.
Does M3004316035NX0PBCY require special power sequencing during startup?
Yes, M3004316035NX0PBCY requires E#, W#, and G# to follow VCC during both power-up and power-down. Per the datasheet, these control signals must remain stable relative to VCC until it reaches its valid operating range (2.7V–3.6V), with tPU ≤ 1ms. Failure to observe this causes undefined behavior or potential data corruption - no internal power-on reset circuitry compensates for improper sequencing.
Is M3004316035NX0PBCY pin-compatible with standard 48-ball FBGA SRAMs?
M3004316035NX0PBCY uses a 48-ball FBGA (10mm × 10mm) with signal assignments aligned to JEDEC-standard parallel memory pinouts, including E#, G#, W#, UB#, LB#, ADDR[17:0], and DQ[15:0]. While ball pitch and mechanical footprint match common 3.3V SRAMs, designers must verify VCC/VSS ball placement and NC/DNU locations against their target SRAM's package drawing before drop-in replacement.
What magnetic field immunity does M3004316035NX0PBCY provide?
M3004316035NX0PBCY maintains full functionality under static magnetic fields up to 24,000 A/m during both read and write operations. This immunity is inherent to its pMTJ STT-MRAM structure and is specified in Tables 9 and 11 of the datasheet. No shielding or derating is required in typical industrial environments, including proximity to motors, transformers, or MRI-adjacent equipment.
How does the 10¹⁴ write endurance of M3004316035NX0PBCY translate to real-world service life?
With 10¹⁴ guaranteed write cycles, M3004316035NX0PBCY supports continuous writing at 100,000 operations per second for over 31 years - far exceeding typical product lifecycles. In smart meters logging every 100ms, it delivers >3,000 years of error-free operation. This eliminates firmware wear-leveling, reduces validation effort, and removes field failure modes associated with flash endurance exhaustion.
M3004316035NX0PBCY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 484-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 484-CABGA (23x23)
M3004316035NX0PBCY FAQ
1.How can I place an order for M3004316035NX0PBCY through Aetrix?
Please submit a Request for Quotation (RFQ) for M3004316035NX0PBCY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M3004316035NX0PBCY reliable?
The price and inventory of M3004316035NX0PBCY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M3004316035NX0PBCY is usually 5 days.
3.What payment methods are accepted for M3004316035NX0PBCY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M3004316035NX0PBCY transactions.
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4.How is shipping managed for M3004316035NX0PBCY?
M3004316035NX0PBCY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M3004316035NX0PBCY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M3004316035NX0PBCY?
For technical support, including M3004316035NX0PBCY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M3004316035NX0PBCY requirements.
6.How does Aetrix verify that M3004316035NX0PBCY is sourced from the original manufacturer or authorized distributors?
All M3004316035NX0PBCY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M3004316035NX0PBCY meets industry standards.
7.What is the process for return or replacement of M3004316035NX0PBCY?
All M3004316035NX0PBCY units undergo pre-shipment inspection (PSI). If there is an issue with M3004316035NX0PBCY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M3004316035NX0PBCY part is unused and in its original packaging.
Return procedure for M3004316035NX0PBCY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M3004316035NX0PBCY Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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