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Renesas M30082040054X0ISAR

Part No.:
M30082040054X0ISAR
Manufacturer:
Renesas
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixM30082040054X0ISAR.pdf
Description:
IC RAM 8MBIT 54MHZ 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,714

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Product details

Overview

M30082040054X0ISAR from Renesas is a 8Mb serial STT-MRAM (Spin-Transfer Torque Magnetoresistive RAM) with QSPI interface, 1.71–2.0V or 2.7–3.6V supply, industrial temperature range (−40°C to +85°C), and 8-pin SOIC package. It delivers SRAM-compatible read/write timing with non-volatility, enabling persistent data storage in real-time control systems.

For engineers reviewing the M30082040054X0ISAR datasheet, M30082040054X0ISAR pinout, M30082040054X0ISAR application, or M30082040054X0ISAR equivalent, key selection criteria include DDR/SDR QSPI timing at 54MHz, hardware/software write protection, 256-byte augmented storage array, JEDEC reset support, and industrial-grade thermal reliability.

Technical Context

The M30082040054X0ISAR implements a 40nm pMTJ STT-MRAM cell architecture with true random access, zero write latency penalty, and no wear leveling required. Its SPI controller supports QPI (4-4-4), DPI, and legacy SPI modes with configurable clock polarity/phase (Mode 0 or Mode 3).

It integrates dual power domains (1.8V/3.0V), hardware write protect (WP#), status register-based block protection (BP[2:0]), and two low-power states-Deep Power Down (IDPD = 10µA typical) and Hibernate (IHBN = 25µA)-with full configuration retention and sub-1µs wake-up.

Key Specifications

ParameterValue and Actual Design Meaning
Density8 Megabit (1,048,576 × 8-bit organization); enables compact firmware/data logging without external memory expansion.
InterfaceQuad SPI (QPI 4-4-4), Dual SPI, Single SPI; supports XIP for reduced instruction overhead in boot code execution.
Max Clock Frequency54MHz DDR (108MT/s effective); matches mid-tier microcontroller SPI peripherals without requiring overclocking.
Supply Voltage1.71–2.00V or 2.70–3.60V; dual-rail compatibility simplifies integration into mixed-voltage industrial PCBs.
Operating Temperature−40°C to +85°C (Industrial); validated for factory automation and medical diagnostics ambient conditions.
Endurance & RetentionVirtually unlimited write cycles (>10¹⁵) and >20-year data retention at 85°C; eliminates refresh management and lifetime estimation.
Package8-pin SOIC (5.2mm × 5.2mm); drop-in replacement for legacy SPI NOR/EEPROM in existing footprints.

Pinout & Package

8-pin SOIC (5.2mm × 5.2mm) package with standard JEDEC MS-012AC footprint and gull-wing leads. Compatible with reflow soldering and automated optical inspection (AOI).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable; must be asserted before any command; controls standby-to-active transition and power state sequencing.
WP# / IO[2]Write Protect Input / Bidirectional Data 2Hardware lock for status register when pulled low in Single SPI mode; serves as I/O[2] in Dual/Quad modes.
SI / IO[0]Serial Input / Bidirectional Data 0Command/address/data input in Single SPI; I/O[0] in Dual/Quad modes; latched on rising edge in SDR.
CLKClock InputSynchronous timing reference; supports both edges in DDR mode for doubled throughput; Mode 0/3 configurable.
IO[3]Bidirectional Data 3QPI/DPI data lane; tri-stated when unused; may be tied to VCC if not implemented in system design.
SO / IO[1]Serial Output / Bidirectional Data 1Data output in Single SPI (falling-edge sampled); I/O[1] in Dual/Quad modes; always outputs on falling clock edge.
VCCPower SupplyCore and I/O voltage rail; requires local 100nF decoupling per datasheet layout guidelines.
VSSGroundCommon return path for core and I/O; must be low-impedance connection to minimize noise coupling.

Key Features

FeatureDesign Value
STT-MRAM Technology40nm pMTJ cell enables zero write latency, no erase-before-write, and immunity to radiation-induced bit flips.
Augmented Storage Array256-byte user-programmable section with per-32-byte write protection-ideal for calibration data or secure keys.
JEDEC Reset SupportStandardized reset command (66h) ensures interoperability with host bootloaders and memory controllers compliant with JEDEC JESD252.
Hardware + Software ProtectionWP# pin + status register BP[2:0] bits allow layered security: hardware lock for critical registers, software granularity for memory blocks.
Low-Power StatesDeep Power Down (10µA) and Hibernate (25µA) preserve full configuration and memory content with <400µs wake-up latency.

Applications

Factory AutomationMultifunction Printers

Use Scenario: Real-time motion controller stores position offsets and tool calibration parameters across power cycles.

IC Role / Device Role / Timing Role: Non-volatile scratchpad memory holding runtime-critical configuration with µs-level read/write access.

Use Value: Eliminates battery-backed SRAM and avoids Flash wear-out during frequent parameter updates in servo tuning loops.

Use Scenario: Embedded print engine retains job queue metadata, toner level history, and firmware patch staging data.

IC Role / Device Role / Timing Role: Persistent buffer memory supporting concurrent job processing and background firmware validation.

Use Value: Enables atomic write of multi-field records without transaction rollback logic, reducing firmware complexity.

Industrial Control And MonitoringMedical Diagnostics

Use Scenario: PLC module logs sensor fault events and diagnostic timestamps during brownout conditions.

IC Role / Device Role / Timing Role: Event-logging memory with guaranteed write completion before power loss via fast write timing.

Use Value: Meets IEC 61508 SIL-2 requirements for deterministic non-volatile storage without backup capacitors.

Use Scenario: Portable ultrasound device stores last-calibrated transducer profiles and patient setup presets.

IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration store accessible only after authentication handshake.

Use Value: Supports HIPAA-compliant device personalization while preventing accidental overwrite of clinical settings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial non-volatile memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress Semiconductors FM25V08-G8Mb F-RAM; 3.0V-only supply; 40MHz max SPI clock; no QPI mode; 10¹⁴ endurance.Limited to 3.0V systems; lacks XIP and augmented storage; lower bandwidth in high-throughput logging.Select for cost-sensitive 3.0V designs where QPI and dual-voltage operation are unnecessary.
Winbond W25Q80DVSSIG8Mb SPI NOR Flash; 3.0V-only; 104MHz clock; requires sector erase; 100K program/erase cycles.Requires erase-before-write; higher latency for random writes; no true byte-write capability.Select only when legacy Flash compatibility is mandatory and write frequency is low (<100x/day).

Compared with FM25V08-G and W25Q80DVSSIG, the M30082040054X0ISAR provides broader voltage support, higher interface bandwidth in QPI mode, superior endurance, and integrated hardware/software protection-making it optimal for high-reliability industrial firmware and configuration storage.

Availability

M30082040054X0ISAR is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial control applications requiring stable component supply, long-term lifecycle assurance, and RoHS/REACH compliance.

Supply support for M30082040054X0ISAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.

The Mxxxx204 family was designed as Persistent SRAM (P-SRAM) replacements-delivering SRAM-like performance with Flash-like non-volatility for mission-critical data logging and firmware storage in harsh environments.

FAQ

What is the operating voltage range supported by the M30082040054X0ISAR?

The M30082040054X0ISAR supports two independent supply ranges: 1.71V to 2.00V (1.8V nominal) and 2.70V to 3.60V (3.0V nominal). Both ranges are fully specified across the industrial temperature range (−40°C to +85°C), and the device automatically adapts internal biasing-no external configuration is needed to switch between rails. This dual-voltage capability allows direct integration into mixed-signal systems without level-shifting circuitry.

Does the M30082040054X0ISAR support Quad SPI (QPI) mode, and what are its timing characteristics?

Yes, the M30082040054X0ISAR supports full Quad SPI (QPI) mode with 4-4-4 command-address-data transfer. In Double Data Rate (DDR) QPI mode, it achieves 54MHz clock frequency with 108MT/s effective throughput. All QPI instructions use both clock edges for data capture, and the device complies with JEDEC JESD252 for standardized reset and identification sequences-ensuring interoperability with modern MCU SPI controllers.

How does the Augmented Storage Array in the M30082040054X0ISAR differ from main memory, and how is it protected?

The M30082040054X0ISAR includes a dedicated 256-byte Augmented Storage Array physically separate from the 8Mb main MRAM array. It is divided into eight 32-byte sections, each independently programmable and write-protectable via status register bits. Protection can be set per-section using hardware WP# or software BP bits-enabling secure storage of calibration data, serial numbers, or cryptographic keys without risking corruption of operational memory.

What low-power states does the M30082040054X0ISAR support, and how quickly can it resume operation?

The M30082040054X0ISAR supports two ultra-low-power states: Deep Power Down (IDPD ≤ 10µA) and Hibernate (IHBN ≤ 25µA). Both retain full memory content and register configuration. Exit latency is ≤ 400µs for Deep Power Down and ≤ 450µs for Hibernate-verified across temperature and voltage corners. No reinitialization or register reload is required upon wake-up, preserving deterministic system response.

Is the M30082040054X0ISAR pin-compatible with standard SPI NOR Flash devices in SOIC-8 packages?

Yes, the M30082040054X0ISAR uses a standard 8-pin SOIC (MS-012AC) footprint identical to common SPI NOR Flash devices such as Winbond W25Q80DV and Macronix MX25L8006E. Pin assignments (CS#, WP#, SI, CLK, IO[3], SO, VCC, VSS) match JEDEC MO-012 pinout conventions. However, functional compatibility requires verifying host SPI controller support for QPI mode and MRAM-specific commands (e.g., Enter/Exit Hibernate).

M30082040054X0ISAR Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
RAM
Technology:
MRAM (Magnetoresistive RAM)
Memory Size:
8Mbit
Memory Organization:
2M x 4
Memory Interface:
-
Clock Frequency:
54 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

M30082040054X0ISAR FAQ

1.How can I place an order for M30082040054X0ISAR through Aetrix?

Please submit a Request for Quotation (RFQ) for M30082040054X0ISAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for M30082040054X0ISAR reliable?

The price and inventory of M30082040054X0ISAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M30082040054X0ISAR is usually 5 days.

3.What payment methods are accepted for M30082040054X0ISAR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M30082040054X0ISAR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for M30082040054X0ISAR?

M30082040054X0ISAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your M30082040054X0ISAR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M30082040054X0ISAR?

For technical support, including M30082040054X0ISAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M30082040054X0ISAR requirements.

6.How does Aetrix verify that M30082040054X0ISAR is sourced from the original manufacturer or authorized distributors?

All M30082040054X0ISAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M30082040054X0ISAR meets industry standards.

7.What is the process for return or replacement of M30082040054X0ISAR?

All M30082040054X0ISAR units undergo pre-shipment inspection (PSI). If there is an issue with M30082040054X0ISAR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M30082040054X0ISAR part is unused and in its original packaging.

Return procedure for M30082040054X0ISAR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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