Renesas M30082040108X0ISAR
- Part No.:
- M30082040108X0ISAR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
M30082040108X0ISAR.pdf
- Description:
- IC RAM 8MBIT SPI 108MHZ 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,638
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Product details
Overview
M30082040108X0ISAR from Renesas is an 8Mb serial STT-MRAM (Spin-Transfer Torque Magnetoresistive RAM) with QSPI interface, 108MHz SDR clock rate, 1.71–2.0V supply, and industrial temperature range (−40°C to +85°C). It delivers SRAM-compatible read/write timing with true non-volatility, enabling persistent data storage in real-time control systems without write latency penalties.
For engineers reviewing the M30082040108X0ISAR datasheet, M30082040108X0ISAR pinout, M30082040108X0ISAR application, or M30082040108X0ISAR equivalent, key selection criteria include its 8Mb density, 8-pad DFN (WSON) package, hardware/software write protection, 256-byte augmented storage array, and support for XIP (eXecute-In-Place) to reduce command overhead in deterministic embedded firmware.
Technical Context
The M30082040108X0ISAR implements a 40nm pMTJ STT-MRAM cell architecture, enabling virtually unlimited endurance (>1015 cycles) and 20-year data retention at 85°C. Its QSPI interface supports 1-4-4 command-address-data nomenclature and operates in SPI Mode 0 (CPOL=0, CPHA=0) for both SDR and DDR modes.
It integrates dual power states-Deep Power Down (IDPD, 3µs entry, 400µs exit) and Hibernate (IHBN, 3µs entry, 450µs exit)-with full configuration retention. The device features a dedicated 256-byte Augmented Storage Array segmented into eight 32-byte programmable/protectable sections, independent of main memory addressing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 8Mbit (1,048,576 × 8-bit organization) |
| Interface | Quad SPI (QPI, 4-4-4), SPI Mode 0 only; supports XIP for reduced instruction overhead |
| Max Clock Rate | 108MHz SDR (single-edge latching); no DDR mode supported per ordering code '0108' |
| Supply Voltage | 1.71V–2.00V - optimized for low-power 1.8V systems with tight regulation tolerance |
| Operating Temp | −40°C to +85°C (industrial grade); ensures reliability in factory automation and medical diagnostics |
| Endurance | >1015 write cycles - eliminates wear-leveling firmware overhead required in Flash/EEPROM |
| Data Retention | 20 years at 85°C - enables long-term data logging without periodic refresh or backup power |
Pinout & Package
Package: 8-pad DFN (WSON), 5.0mm × 6.0mm, moisture sensitivity level (MSL) 3, lead-free and RoHS/REACH compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable; falling edge initiates instruction sequence; high puts device in standby (tri-state I/Os) |
| WP# / IO[2] | Bidirectional I/O / Hardware Write Protect | In SPI mode: hardware lock for status register when WP#=low and SR[7]=1; in QPI: bidirectional data line IO[2] |
| SI / IO[0] | Input / Bidirectional Data 0 | In SPI: serial input; in QPI: bidirectional data line IO[0]; must be driven (no internal pull-up) |
| CLK | Clock Input | Provides synchronous timing; rising edge latches command/address in SDR; both edges used in DDR (not active for '0108' part) |
| IO[3] | Bidirectional Data 3 | QPI-only data line; tied to VCC if unused; no function in single-SPI mode |
| SO / IO[1] | Output / Bidirectional Data 1 | In SPI: serial output (data valid on falling edge); in QPI: bidirectional data line IO[1] |
| VCC | Power Supply | 1.71–2.00V core/I/O supply; requires local 100nF decoupling capacitor |
| VSS | Ground | Reference return for all signals and power; must be low-impedance connection |
Key Features
| Feature | Design Value |
|---|---|
| STT-MRAM Technology | 40nm pMTJ cell enables zero write latency, infinite endurance, and 20-year retention without backup power |
| Hardware + Software Protection | WP# pin + configurable block protect bits (BPSEL[2:0]) and top/bottom select (TBSEL) prevent unintended writes |
| Augmented Storage Array | 256-byte user-programmable space split into eight 32-byte sections, each independently write-protectable |
| eXecute-In-Place (XIP) | Reduces random access time by eliminating repeated command issuance during burst reads/writes |
| Low-Power States | Deep Power Down (3µs entry) and Hibernate (3µs entry) retain full configuration and data with sub-µA quiescent current |
Applications
| Factory Automation | Multifunction Printers |
|---|---|
Use Scenario: Real-time motion controller stores position history and calibration offsets across power cycles. IC Role / Device Role / Timing Role: Non-volatile scratchpad memory holding critical runtime parameters with µs-level write commit. Use Value: Eliminates supercapacitor or battery backup while guaranteeing data integrity after unexpected shutdown. | Use Scenario: Printer firmware stores job queue metadata, toner usage logs, and page counter values. IC Role / Device Role / Timing Role: Persistent parameter store accessed concurrently with print engine operations. Use Value: Enables instant resume after power loss without reinitializing print jobs or losing accounting data. |
| Industrial Control And Monitoring | Medical Diagnostics |
Use Scenario: PLC retains alarm history, sensor calibration coefficients, and safety interlock states. IC Role / Device Role / Timing Role: Deterministic non-volatile memory for safety-critical configuration and event logging. Use Value: Meets IEC 61508 SIL-2 requirements for data persistence without wear-out concerns. | Use Scenario: Ultrasound system stores patient exam settings, transducer profiles, and DICOM header templates. IC Role / Device Role / Timing Role: Fast-access persistent storage for imaging workflow state between sessions. Use Value: Ensures consistent image quality and regulatory-compliant audit trails without Flash erase delays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar MRAM memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress CY14B108L-ZSP25XI | 8Mb parallel-interface nvSRAM; 25ns access, 3.3V only; no QSPI or XIP support | Requires wider bus and higher voltage; unsuitable for space-constrained QSPI designs | Select only for legacy parallel-memory upgrades where board layout cannot accommodate serial interface |
| Everspin MR25H80DFM | 8Mb Quad SPI STT-MRAM; 1.8V, 108MHz SDR; identical pinout but different register map and protection scheme | Same physical footprint and electrical interface; requires firmware adaptation for status/config register access | Preferred for drop-in replacement where register-level compatibility is verified via application note AN-1029 |
Compared with CY14B108L-ZSP25XI, M30082040108X0ISAR reduces PCB area by 60% and supports modern low-voltage microcontrollers; versus MR25H80DFM, it offers identical performance but differs in augmented storage initialization and JEDEC reset behavior-requiring validation of boot-time register configuration.
Availability
M30082040108X0ISAR is available at Aetrix Electronics and suitable for factory automation, multifunction printers, and industrial control systems requiring stable component supply with guaranteed long-term availability and no obsolescence risk.
Supply support for M30082040108X0ISAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The M30082040108X0ISAR belongs to Renesas' Persistent SRAM (P-SRAM) product line, designed specifically to replace battery-backed SRAM and serial Flash in mission-critical industrial and medical systems demanding zero-latency non-volatility.
FAQ
What is the operating voltage range for M30082040108X0ISAR?
M30082040108X0ISAR operates from 1.71V to 2.00V. This narrow 1.8V nominal range ensures compatibility with modern ultra-low-power microcontrollers and eliminates need for level-shifting circuitry. Operation outside this range may cause undefined behavior or data corruption. The device does not support 3.3V operation - that variant is designated with suffix '3' (e.g., M30082040108X0ISAR3).
Does M30082040108X0ISAR support Double Data Rate (DDR) mode?
No, M30082040108X0ISAR does not support DDR mode. Its ordering code '0108' specifies Single Data Rate (SDR) operation at up to 108MHz, using rising-edge clock latching for commands and addresses, and falling-edge sampling for data output. DDR capability is reserved for parts with '0054' in the ordering string (e.g., M30082040054X0ISAR).
How is write protection implemented on M30082040108X0ISAR?
M30082040108X0ISAR implements dual-layer write protection: hardware-based via the WP# pin (enabled by Status Register bit SR[7]), and software-based via Block Protect bits BPSEL[2:0] and Top/Bottom select TBSEL in the same register. Both mechanisms can be used simultaneously to safeguard specific memory regions or the entire array, including the 256-byte Augmented Storage Array.
What is the purpose of the Augmented Storage Array in M30082040108X0ISAR?
The Augmented Storage Array is a dedicated 256-byte memory region divided into eight 32-byte sections, each independently programmable and write-protectable. It is used for storing critical firmware parameters, calibration data, or security keys separate from main memory - ensuring these values remain intact even during bulk erase or firmware updates targeting the primary 8Mb array.
Is M30082040108X0ISAR pin-compatible with other members of the Mxxxx204 family?
Yes, M30082040108X0ISAR shares identical 8-pad DFN (WSON) pinout and signal assignment with all Mxxxx204 variants - including M1004204, M3016204, and temperature/package variants. However, density, speed grade, and voltage grade differences require verification of timing parameters and register initialization sequences before substitution.
M30082040108X0ISAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 8Mbit
- Memory Organization:
- 2M x 4
- Memory Interface:
- SPI
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
M30082040108X0ISAR FAQ
1.How can I place an order for M30082040108X0ISAR through Aetrix?
Please submit a Request for Quotation (RFQ) for M30082040108X0ISAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M30082040108X0ISAR reliable?
The price and inventory of M30082040108X0ISAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M30082040108X0ISAR is usually 5 days.
3.What payment methods are accepted for M30082040108X0ISAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M30082040108X0ISAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M30082040108X0ISAR?
M30082040108X0ISAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M30082040108X0ISAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M30082040108X0ISAR?
For technical support, including M30082040108X0ISAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M30082040108X0ISAR requirements.
6.How does Aetrix verify that M30082040108X0ISAR is sourced from the original manufacturer or authorized distributors?
All M30082040108X0ISAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M30082040108X0ISAR meets industry standards.
7.What is the process for return or replacement of M30082040108X0ISAR?
All M30082040108X0ISAR units undergo pre-shipment inspection (PSI). If there is an issue with M30082040108X0ISAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M30082040108X0ISAR part is unused and in its original packaging.
Return procedure for M30082040108X0ISAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M30082040108X0ISAR Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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