Renesas M30082040108X0PSAY
- Part No.:
- M30082040108X0PSAY
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
M30082040108X0PSAY.pdf
- Description:
- IC RAM 8MBIT 108MHZ 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:4,390
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
M30082040108X0PSAY from Renesas is an 8Mb serial STT-MRAM non-volatile memory IC with QSPI interface, 108MHz SDR clock rate, 1.71–2.0V or 2.7–3.6V supply, industrial-plus temperature range (−40°C to +105°C), and 8-pad DFN (WSON) package. It serves as persistent SRAM replacement in real-time data logging and firmware storage.
For engineers reviewing the M30082040108X0PSAY datasheet, M30082040108X0PSAY pinout, M30082040108X0PSAY application, or M30082040108X0PSAY equivalent, key selection criteria include QSPI x4 timing compliance, hardware/software write protection, 256-byte augmented storage array, deep power-down latency (≤3 µs), and JEDEC reset support.
Technical Context
This MRAM uses 40nm pMTJ spin-transfer torque technology, enabling true random access with SRAM-compatible read/write timings and zero write latency penalty. It supports Execute-In-Place (XIP), eliminating command overhead for sequential reads.
The device implements dual protection: hardware write protect via WP# pin (active-low, no internal pull-up) and software-configurable block protection through status register bits BPSEL[2:0] and TBSEL. It offers two low-power states-Deep Power Down (IDPD ≤ 10 µA) and Hibernate-with full configuration retention and sub-450 µs wake-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 8 megabit (1,048,576 × 8-bit organization); supports full random read/write without erase cycles |
| Interface | Quad SPI (QPI, 4-4-4 mode); enables 4-line bidirectional data transfer at up to 108MHz SDR |
| Operating Voltage | 1.71V–2.00V or 2.70V–3.60V; dual-voltage compatibility simplifies integration into 1.8V or 3.3V systems |
| Temperature Range | Industrial Plus: −40°C to +105°C; qualified for extended thermal environments in factory automation and medical diagnostics |
| Endurance & Retention | Virtually unlimited write endurance (>10¹⁵ cycles) and >20-year data retention at 105°C per JEDEC spec |
| Power States | Deep Power Down (IDPD ≤ 10 µA) and Hibernate (IHBN ≤ 30 µA); both retain all register settings and memory contents |
| Augmented Storage | 256-byte user-programmable array with per-section (32B) write protection; isolated from main memory map |
Pinout & Package
Package: 8-pad DFN (WSON), 5.0 mm × 6.0 mm, wettable flank, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable; falling edge initiates instruction sequence; high puts device in standby (tri-state I/Os) |
| WP# / IO[2] | Bidirectional Data 2 / Hardware Write Protect | In SPI mode: active-low hardware lock for status register; in QPI mode: bidirectional data line; must be driven (no internal pull-up) |
| SI / IO[0] | Serial Input / Bidirectional Data 0 | In SPI: unidirectional command/address/data input; in QPI: bidirectional data line; latched on rising edge (SDR) or both edges (DDR) |
| CLK | Clock Input | Synchronous timing reference; supports SPI Mode 0 (CPOL=0, CPHA=0) and Mode 3 (CPOL=1, CPHA=1) |
| IO[3] | Bidirectional Data 3 | QPI-only data line; used for command/address/data in 4-4-4 transfers; can be tied to VCC if unused |
| SO / IO[1] | Serial Output / Bidirectional Data 1 | In SPI: unidirectional data output (falling-edge sampled); in QPI: bidirectional data line |
| VCC | Power Supply | Core and I/O supply; accepts 1.71–2.0V or 2.7–3.6V; requires local decoupling capacitor |
| VSS | Ground | Reference return for core and I/O circuits; must be connected to system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| QSPI x4 Interface | Enables 432 MB/s peak bandwidth (108 MHz × 4 lines) for high-throughput firmware updates and log streaming |
| Execute-In-Place (XIP) | Reduces random access latency by eliminating per-instruction command overhead; supports continuous burst reads |
| Hardware + Software Protection | WP# pin locks status register; configurable block protect (BPSEL[2:0]) and top/bottom select (TBSEL) prevent unintended writes |
| 256-Byte Augmented Storage | Independent 8-section (32B each) programmable area with individual write-lock capability for calibration data or security keys |
| JEDEC Reset Support | Standardized reset command (66h) ensures interoperability with host controllers expecting JEDEC-compliant non-volatile memories |
Applications
| Factory Automation | Medical Diagnostics |
|---|---|
Use Scenario: Real-time motion control PLCs require deterministic write persistence during power loss events. IC Role / Device Role / Timing Role: Non-volatile scratchpad memory storing encoder position history and fault logs with sub-100 ns write latency. Use Value: Eliminates supercapacitor backup circuitry while guaranteeing data integrity across 100% duty-cycle operation at 105°C ambient. | Use Scenario: Portable ultrasound devices capture time-critical imaging buffers between acquisitions. IC Role / Device Role / Timing Role: High-speed frame buffer with instant write-through capability and zero-latency read-after-write consistency. Use Value: Enables 30+ fps image capture without DRAM refresh overhead or Flash erase delays, meeting IEC 62304 Class C timing requirements. |
| Industrial Control And Monitoring | Data Switches And Routers |
Use Scenario: Remote RTU units log sensor telemetry over 10+ years without maintenance. IC Role / Device Role / Timing Role: Long-term event logger with timestamped records stored in protected memory sectors. Use Value: Achieves >20-year data retention at 85°C with no wear leveling or background garbage collection. | Use Scenario: Carrier-grade switches store boot images and configuration profiles with rapid failover. IC Role / Device Role / Timing Role: XIP-capable firmware storage enabling sub-millisecond boot from cold start. Use Value: Reduces boot time by 40% vs. parallel NOR Flash; supports secure firmware rollback via protected augmented storage sections. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial non-volatile memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors FM25V08-G | 8Mb F-RAM; 3.3V only; 40MHz max SPI clock; no QPI or XIP support | Limited to lower-bandwidth logging; lacks augmented storage and JEDEC reset | Choose for cost-sensitive, low-clock-rate systems where QPI/XIP are unnecessary |
| Infineon Technologies CY14B108N-ZSP25XI | 8Mb nvSRAM; 3.3V only; built-in lithium battery backup; 55ns async access | Requires external energy storage; larger footprint; no deep power-down mode | Choose when ultra-low read latency (<100ns) is mandatory and board space allows SOIC-28 |
Compared with FM25V08-G and CY14B108N-ZSP25XI, M30082040108X0PSAY delivers higher bandwidth via QPI x4, eliminates battery dependency, integrates configurable protection and augmented storage, and supports industrial-plus temperature operation in a compact 5×6mm DFN.
Availability
M30082040108X0PSAY is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial control applications requiring stable component supply, long-term lifecycle assurance, and guaranteed industrial-plus temperature performance.
Supply support for M30082040108X0PSAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The M30082040108X0PSAY belongs to Renesas' Persistent SRAM (P-SRAM) family, engineered to replace battery-backed SRAM and legacy Flash/NOR in mission-critical systems demanding instant write persistence, infinite endurance, and extended temperature reliability.
FAQ
What voltage ranges does the M30082040108X0PSAY support?
M30082040108X0PSAY supports two independent operating voltage ranges: 1.71V to 2.00V (1.8V nominal) and 2.70V to 3.60V (3.3V nominal). Both ranges are fully specified across the full industrial-plus temperature range (−40°C to +105°C). The device automatically adapts to the applied VCC level and does not require external voltage selection logic. This dual-voltage capability allows direct drop-in replacement in either 1.8V or 3.3V designs without redesigning power delivery networks.
Does the M30082040108X0PSAY support Quad SPI x4 mode?
Yes, M30082040108X0PSAY fully supports Quad SPI (QPI) 4-4-4 mode, using all four I/O pins (IO[0]–IO[3]) for command, address, and data transfer. In this mode, it achieves a maximum clock frequency of 108MHz in Single Data Rate (SDR), delivering up to 432 MB/s effective throughput. The device also supports Dual SPI and standard SPI modes, with automatic mode detection based on the initial instruction sequence.
How is write protection implemented on the M30082040108X0PSAY?
M30082040108X0PSAY implements dual-layer write protection: hardware-based via the WP# pin (active-low, must be driven), and software-based via status register bits (WP#EN, BPSEL[2:0], TBSEL). When WP#EN = 1 and WP# is low, the status register becomes read-only. Software protection allows selective locking of top/bottom memory blocks or individual 256KB sectors. Both schemes operate independently and can be combined for defense-in-depth data integrity.
What is the purpose of the 256-byte Augmented Storage Array in the M30082040108X0PSAY?
The 256-byte Augmented Storage Array in M30082040108X0PSAY is a physically separate, user-programmable memory region divided into eight 32-byte sections. Each section can be individually write-protected after programming. It is intended for storing critical non-volatile data such as calibration coefficients, security keys, or device-specific identifiers - data that must remain isolated from main memory operations and survive field firmware updates without risk of overwrite.
Does the M30082040108X0PSAY support Execute-In-Place (XIP)?
Yes, M30082040108X0PSAY supports Execute-In-Place (XIP) functionality. Once enabled via the XIP entry byte (0xAxh), the device executes sequential read commands without reissuing the opcode for each access. This reduces instruction overhead and improves effective read bandwidth - especially valuable for boot code execution or real-time firmware patching where deterministic latency is required.
M30082040108X0PSAY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 8Mbit
- Memory Organization:
- 2M x 4
- Memory Interface:
- -
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
M30082040108X0PSAY FAQ
1.How can I place an order for M30082040108X0PSAY through Aetrix?
Please submit a Request for Quotation (RFQ) for M30082040108X0PSAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M30082040108X0PSAY reliable?
The price and inventory of M30082040108X0PSAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M30082040108X0PSAY is usually 5 days.
3.What payment methods are accepted for M30082040108X0PSAY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M30082040108X0PSAY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M30082040108X0PSAY?
M30082040108X0PSAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M30082040108X0PSAY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M30082040108X0PSAY?
For technical support, including M30082040108X0PSAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M30082040108X0PSAY requirements.
6.How does Aetrix verify that M30082040108X0PSAY is sourced from the original manufacturer or authorized distributors?
All M30082040108X0PSAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M30082040108X0PSAY meets industry standards.
7.What is the process for return or replacement of M30082040108X0PSAY?
All M30082040108X0PSAY units undergo pre-shipment inspection (PSI). If there is an issue with M30082040108X0PSAY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M30082040108X0PSAY part is unused and in its original packaging.
Return procedure for M30082040108X0PSAY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M30082040108X0PSAY Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

