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Renesas M30162040054X0ISAY

Part No.:
M30162040054X0ISAY
Manufacturer:
Renesas
Category:
Memory
Package:
8-SOIC (0.209", 5.30mm Width)
Datasheet:
AetrixM30162040054X0ISAY.pdf
Description:
IC RAM 16MBIT 54MHZ 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,543

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Product details

Overview

M30162040054X0ISAY from Renesas is a 16Mbit serial STT-MRAM non-volatile memory IC with QSPI interface, 54MHz DDR timing, industrial temperature range (−40°C to +85°C), and 8-pin SOIC package. It delivers SRAM-compatible read/write latency, zero write endurance limit, and data retention exceeding 20 years - deployed in factory automation controllers for real-time parameter logging without battery backup.

For engineers reviewing the M30162040054X0ISAY datasheet, M30162040054X0ISAY pinout, M30162040054X0ISAY application, or M30162040054X0ISAY equivalent, key selection criteria include its 1.71–2.0V/2.7–3.6V dual-voltage support, hardware/software write protection, 256-byte augmented storage array, and JEDEC Reset compliance - critical for deterministic boot and field-upgrade resilience in industrial edge nodes.

Technical Context

The M30162040054X0ISAY implements a 40nm pMTJ spin-transfer torque MRAM array with quad SPI (QPI) interface supporting 1-4-4 command-address-data nomenclature. Its architecture includes dedicated command/control logic, row/column decoders, and high-voltage generator enabling true random-access reads/writes at sub-100ns latency without erase cycles.

It supports both Single Data Rate (SDR) and Double Data Rate (DDR) modes on the same physical interface, with DDR operating at 54MHz using both clock edges for address/data transfer. The device integrates status, configuration, identification, and augmented storage registers mapped into separate address space - all accessible via standard SPI instructions including XIP (eXecute-In-Place) for reduced command overhead.

Key Specifications

Parameter Value and Actual Design Meaning
Density16Mbit (2M × 8) - supports full memory map addressing up to 0x1FFFFF, enabling firmware partitioning and large configuration storage
InterfaceQSPI (4-4-4) - enables 4-lane bidirectional data transfers, doubling throughput vs. standard SPI in high-bandwidth logging applications
Clock Speed54MHz DDR - achieves effective 108MB/s peak bandwidth with precise dual-edge sampling, reducing transaction time for burst writes
Operating Voltage1.71–2.00V or 2.70–3.60V - dual-rail compatibility allows direct integration into 1.8V microcontroller systems or legacy 3.3V industrial backplanes
Temperature Range−40°C to +85°C (Industrial) - validated for continuous operation in uncontrolled factory environments without thermal derating
Endurance & RetentionVirtually unlimited write cycles (>10¹⁵) and >20-year data retention - eliminates wear leveling firmware and enables direct register-mapped access
Package8-pin SOIC (5.2mm × 5.2mm) - drop-in replacement for legacy SPI NOR/EEPROM in existing PCB footprints with no layout change required

Pinout & Package

8-pin SOIC package (5.2mm × 5.2mm), RoHS-compliant, surface-mountable with standard reflow profile. Pin 1 marked by notch or dot; pin 1 corner located at bottom-left when viewed top-side with marking side up.

Pin/Terminal Circuit Role Design Meaning
1: CS#Chip Select InputActive-low enable signal; falling edge initiates instruction sequence; high state forces standby mode with tri-stated outputs
2: WP# / IO[2]Write Protect Input / Bidirectional Data 2Hardware write lock for status register when low (in SDR mode); serves as QSPI data lane IO[2] in quad mode
3: SI / IO[0]Serial Input / Bidirectional Data 0Command/address input in SDR; bidirectional lane IO[0] in dual/quad modes; tied to VCC if unused in SDR
4: CLKClock InputSynchronous timing reference; rising/falling edges sample command (SDR) or command/address/data (DDR)
5: IO[3]Bidirectional Data 3QSPI data lane for address/data in quad modes; must be pulled to VCC if unused in lower-width configurations
6: SO / IO[1]Serial Output / Bidirectional Data 1Data output in SDR; bidirectional lane IO[1] in dual/quad modes; always drives on falling clock edge
7: VCCPower SupplyCore and I/O supply; supports 1.71–2.0V or 2.7–3.6V ranges; requires local 100nF decoupling per datasheet
8: VSSGroundCommon return path for core and I/O circuits; must be low-impedance connection to system ground plane

Key Features

Feature Design Value
eXecute-In-Place (XIP)Enables sequential read bursts without repeated command overhead - cuts random access latency by ≥30% in firmware execution scenarios
Augmented Storage Array256-byte user-programmable section with per-block (32B) write protection - ideal for storing calibrated sensor offsets or secure keys independent of main array
JEDEC Reset SupportStandardized reset command (66h) restores device to known state without power cycle - essential for remote recovery in headless industrial gateways
Dual Power RangesSingle device supports both 1.8V and 3.3V systems - reduces BOM count and simplifies design reuse across product families
Deep Power Down ModeReduces current to <1µA while preserving all register states and memory contents - extends battery life in portable diagnostic equipment

Applications

Factory Automation Controller Medical Diagnostic Imaging Module

Use Scenario: Real-time logging of PLC motion profiles, sensor calibration history, and fault event timestamps during continuous 24/7 operation.

IC Role / Device Role / Timing Role: Non-volatile scratchpad memory replacing battery-backed SRAM; provides instant-write persistence with zero latency penalty on every write cycle.

Use Value: Eliminates battery maintenance, avoids data loss during unexpected power interruption, and supports deterministic 100ns write timing for synchronized multi-axis control loops.

Use Scenario: Storing DICOM header metadata, image acquisition parameters, and regulatory audit logs in portable ultrasound units with intermittent power.

IC Role / Device Role / Timing Role: Persistent configuration store interfaced directly to ARM Cortex-M7 MCU via QSPI; retains data through cold starts and deep sleep cycles.

Use Value: Ensures HIPAA-compliant traceability without external EEPROM, meets IEC 62304 software lifecycle requirements, and enables field-upgradable calibration tables.

Industrial Ethernet Switch Multifunction Printer Engine

Use Scenario: Holding MAC address tables, port VLAN assignments, and firmware update staging buffers in managed switches deployed in harsh electrical environments.

IC Role / Device Role / Timing Role: High-reliability configuration memory with hardware write protect (WP#) and block-level software protection - immune to EFT-induced corruption.

Use Value: Prevents network outages caused by corrupted switch tables; supports hot firmware patching with atomic sector updates and rollback capability.

Use Scenario: Storing print job queues, toner level history, and consumables authentication keys in high-volume office printers with frequent power cycling.

IC Role / Device Role / Timing Role: Dual-voltage (1.8V/3.3V) persistent memory co-located with print controller ASIC; accessed via XIP for fast job setup initialization.

Use Value: Reduces first-page-out time by 150ms vs. SPI NOR; enables secure consumables verification without external crypto IC; withstands >100k power cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial non-volatile memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress Semiconductors FM25V10-G1Mb F-RAM; 40MHz SPI; single 3.3V supply only; no QSPI or DDR modeLimited density and interface flexibility; lacks augmented storage array and JEDEC ResetSelect when cost sensitivity outweighs density needs and 3.3V-only operation is acceptable
Infineon Technologies CY14B108N-ZSP25XI8Mb nvSRAM; 25MHz parallel interface; requires external capacitor for auto-store; 3.3V onlyParallel bus increases pin count and layout complexity; no QSPI compatibility or deep power down modeSelect only for legacy parallel-bus designs requiring hardware auto-store on power loss

Compared with FM25V10-G and CY14B108N-ZSP25XI, the M30162040054X0ISAY offers 2× higher density than the F-RAM, 100% pin-compatible QSPI footprint versus the parallel nvSRAM, and unique features like XIP, augmented storage, and dual-voltage support - making it the optimal choice for new industrial designs prioritizing scalability, firmware agility, and power efficiency.

Availability

M30162040054X0ISAY is available at Aetrix Electronics and suitable for factory automation controllers, medical diagnostic imaging modules, and industrial Ethernet switches requiring stable component supply across extended product lifecycles.

Supply support for M30162040054X0ISAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.

The Mxxxx204 family was designed as Persistent SRAM (P-SRAM) replacements - delivering true non-volatility with SRAM-like performance for mission-critical industrial and medical systems where data integrity and deterministic timing are non-negotiable.

FAQ

What voltage ranges does the M30162040054X0ISAY support?

The M30162040054X0ISAY supports two independent operating voltage ranges: 1.71V to 2.00V for 1.8V systems and 2.70V to 3.60V for 3.3V systems. Both ranges are fully specified across the full industrial temperature range (−40°C to +85°C). The device automatically adapts internal regulation and timing - no external configuration is needed to switch between voltage domains. This dual-rail capability makes the M30162040054X0ISAY suitable for mixed-voltage designs without level-shifting circuitry.

Does the M30162040054X0ISAY require a battery or capacitor for data retention?

No, the M30162040054X0ISAY does not require any external energy storage for data retention. As a spin-transfer torque MRAM device, it retains data indefinitely (≥20 years) without power, eliminating batteries, supercapacitors, or backup power circuits. All memory contents - including main array, augmented storage, and configuration registers - persist through power loss, cold starts, and deep power down modes. This intrinsic non-volatility is fundamental to the MRAM technology used in the M30162040054X0ISAY.

What is the purpose of the Augmented Storage Array in the M30162040054X0ISAY?

The M30162040054X0ISAY includes a dedicated 256-byte Augmented Storage Array, physically and logically separate from the main 16Mbit memory. It is divided into eight 32-byte sections, each individually programmable and write-protectable via configuration bits. This area is commonly used to store immutable values such as calibration coefficients, cryptographic keys, or device-specific identifiers - ensuring they remain isolated from firmware updates or bulk memory operations performed on the main array.

Can the M30162040054X0ISAY operate in Quad SPI mode at 54MHz DDR?

Yes, the M30162040054X0ISAY fully supports Quad SPI (QPI) mode with Double Data Rate timing at 54MHz. In this configuration, the device uses all four I/O pins (IO[0]–IO[3]) for command, address, and data transfer on both rising and falling clock edges - achieving an effective throughput of 108MB/s. This mode is enabled via configuration register settings and requires host controller support for QPI instruction set and DDR clock edge sampling, as defined in the M30162040054X0ISAY datasheet.

How does hardware write protection work on the M30162040054X0ISAY?

Hardware write protection on the M30162040054X0ISAY is implemented via the WP# pin (Pin 2). When WP# is driven low and the WP#EN bit (SR[7]) in the Status Register is set to '1', the status register becomes read-only - preventing modification of protection settings, configuration bits, and memory array write enables. This pin-based lock operates independently of software protection and remains active even during power transitions, providing robust defense against accidental or malicious writes during system initialization or fault conditions.

M30162040054X0ISAY Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
8-SOIC (0.209", 5.30mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
RAM
Technology:
MRAM (Magnetoresistive RAM)
Memory Size:
16Mbit
Memory Organization:
4M x 4
Memory Interface:
-
Clock Frequency:
54 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

M30162040054X0ISAY FAQ

1.How can I place an order for M30162040054X0ISAY through Aetrix?

Please submit a Request for Quotation (RFQ) for M30162040054X0ISAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for M30162040054X0ISAY reliable?

The price and inventory of M30162040054X0ISAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M30162040054X0ISAY is usually 5 days.

3.What payment methods are accepted for M30162040054X0ISAY?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M30162040054X0ISAY transactions.

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4.How is shipping managed for M30162040054X0ISAY?

M30162040054X0ISAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your M30162040054X0ISAY order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M30162040054X0ISAY?

For technical support, including M30162040054X0ISAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M30162040054X0ISAY requirements.

6.How does Aetrix verify that M30162040054X0ISAY is sourced from the original manufacturer or authorized distributors?

All M30162040054X0ISAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M30162040054X0ISAY meets industry standards.

7.What is the process for return or replacement of M30162040054X0ISAY?

All M30162040054X0ISAY units undergo pre-shipment inspection (PSI). If there is an issue with M30162040054X0ISAY, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M30162040054X0ISAY part is unused and in its original packaging.

Return procedure for M30162040054X0ISAY:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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