Renesas M30162040054X0PWAR
- Part No.:
- M30162040054X0PWAR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
M30162040054X0PWAR.pdf
- Description:
- IC RAM 16MBIT 54MHZ 8DFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,370
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
M30162040054X0PWAR from Renesas is a 16Mbit serial STT-MRAM non-volatile memory IC with QSPI interface, 54MHz DDR timing, 1.71–2.0V or 2.7–3.6V supply, industrial-plus temperature range (−40°C to +105°C), and 8-pad DFN (WSON) package. It serves as persistent SRAM replacement in real-time data logging and firmware storage applications requiring zero write latency and infinite endurance.
For engineers reviewing the M30162040054X0PWAR datasheet, M30162040054X0PWAR pinout, M30162040054X0PWAR application, or M30162040054X0PWAR equivalent, key selection criteria include its dual-voltage support, hardware/software write protection, 256-byte augmented storage array, JEDEC reset compliance, and compatibility with SPI Mode 0/3 in SDR/DDR configurations.
Technical Context
The M30162040054X0PWAR implements a 40nm pMTJ spin-transfer torque MRAM array with true random access, enabling simultaneous read/write without erase cycles. Its QSPI interface supports x4 I/O (1-4-4) command-address-data structure and executes instructions on both clock edges in DDR mode at 54MHz.
It integrates dedicated registers for status control, configuration (four registers), device identification (64-bit unique ID), user serial number (64-bit programmable), and augmented storage protection. Power management includes Deep Power Down (3µs entry, 400µs exit) and Hibernate modes with full configuration retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 16 Mbit (2 MByte) main memory array with 256-byte independent augmented storage array |
| Interface | Quad SPI (QPI, 4-4-4) supporting SDR up to 108MHz and DDR up to 54MHz |
| Supply Voltage | 1.71–2.00 V or 2.70–3.60 V - dual-rail operation enables direct integration into 1.8V or 3.3V systems |
| Operating Temp | −40°C to +105°C (industrial plus) - qualified for extended thermal environments in factory automation and medical diagnostics |
| Endurance & Retention | Virtually unlimited write cycles (>10¹⁵) and >20-year data retention at 105°C - eliminates wear leveling and refresh overhead |
| Write Protection | Hardware (WP# pin) and software (status register BPSEL/TBSEL bits) - enables selective block-level or top/bottom memory locking |
| Special Features | eXecute-In-Place (XIP) mode, JEDEC Reset support, 64-bit unique ID, user-programmable 64-bit serial number |
Pinout & Package
Package: 8-pad DFN (WSON), 5.0 mm × 6.0 mm, moisture sensitivity level 3, RoHS & REACH compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; falling edge initiates instruction sequence; high state places device in standby with tri-stated outputs |
| WP# / IO[2] | Bidirectional Write Protect / Data Line 2 | In SPI mode: hardware write protect for status register when WP# = low and WP#EN = 1; in QPI mode: bidirectional data lane for address/data transfer |
| SI / IO[0] | Serial Input / Data Line 0 | In SPI mode: unidirectional command/address/data input; in QPI mode: bidirectional data lane used for command transmission |
| CLK | Clock Input | Synchronous timing reference; rising edge latches commands in SDR/DDR; both edges used for address/data in DDR mode |
| IO[3] | Bidirectional Data Line 3 | QPI-only bidirectional I/O; carries command, address, or data depending on instruction phase; must be tied to VCC if unused |
| SO / IO[1] | Serial Output / Data Line 1 | In SPI mode: unidirectional data output on falling clock edge; in QPI mode: bidirectional data lane used for address/data |
| VCC | Power Supply | Core and I/O supply - accepts either 1.8V or 3.3V rail; requires local decoupling per datasheet layout guidelines |
| VSS | Ground | Common reference for core and I/O circuits; must be connected to system ground plane with low-inductance path |
Key Features
| Feature | Design Value |
|---|---|
| STT-MRAM Technology | 40nm pMTJ cell enables non-volatility with SRAM-like random read/write timing and no write latency penalty |
| Augmented Storage Array | 256-byte user-programmable section with per-32-byte write protection - ideal for storing calibration data or secure keys |
| Low-Power States | Deep Power Down (IDPD) and Hibernate (IHBN) reduce current to µA-level while preserving all register states and memory contents |
| JEDEC Reset Support | Standardized reset command (66h) restores default register values - simplifies system-level recovery and initialization sequences |
| Configurable Protection | Combination of hardware WP# pin and software-configurable block protect bits allows fine-grained, field-updatable memory lockdown |
Applications
| Factory Automation | Medical Diagnostics |
|---|---|
Use Scenario: Real-time logging of sensor readings, motion profiles, and PLC event timestamps during machine operation. IC Role / Device Role / Timing Role: Persistent SRAM replacement storing volatile operational data without battery backup or flash wear management. Use Value: Eliminates write latency and endurance limitations of NOR/NAND flash, enabling deterministic sub-100ns write cycles across full memory map. | Use Scenario: Storing calibrated imaging parameters, patient-specific settings, and diagnostic result history in portable ultrasound or MRI subsystems. IC Role / Device Role / Timing Role: Non-volatile configuration memory retaining critical setup data across power cycles and thermal excursions up to 105°C. Use Value: Guarantees >20-year data retention at elevated temperatures and survives repeated reflow cycles without data loss or register corruption. |
| Industrial Control | Data Switches |
Use Scenario: Firmware storage and runtime parameter caching in programmable logic controllers (PLCs) and distributed I/O modules. IC Role / Device Role / Timing Role: Execute-in-Place (XIP) capable memory enabling direct code execution from MRAM, reducing boot time and external RAM dependency. Use Value: Supports XIP mode with single-command burst reads, cutting instruction fetch latency by >40% versus legacy SPI flash in deterministic control loops. | Use Scenario: Storing routing tables, MAC address tables, and port configuration in enterprise-grade Ethernet switches and routers. IC Role / Device Role / Timing Role: High-reliability configuration store updated dynamically during network topology changes or firmware upgrades. Use Value: Withstands >10¹⁵ write cycles, enabling frequent table updates without degradation - unlike EEPROM or flash-based alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial non-volatile memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors FM25V10-G | 1 Mbit F-RAM; 40 MHz SPI; 2.0–3.6 V; SOIC-8 only; no DDR or QPI support | Limited density and interface bandwidth; lacks augmented storage and JEDEC reset | Select when ultra-low-power write energy (<150 pJ/bit) is prioritized over density and advanced features |
| Infineon Technologies CY14V104N-ZSP25XI | 4 Mbit nvSRAM; 25 MHz parallel interface; 3.3 V only; 44-pin TSOP; requires external capacitor for power-loss write-back | Parallel bus architecture increases PCB footprint and signal count; no serial QSPI compatibility | Select only for legacy parallel-memory designs where board redesign is prohibitive and density requirements are ≤4 Mbit |
Compared with FM25V10-G and CY14V104N-ZSP25XI, the M30162040054X0PWAR delivers 4× higher density than the F-RAM, supports modern QSPI DDR at 54MHz, operates across dual voltage rails, and includes integrated augmented storage and JEDEC reset - making it optimal for new industrial and medical designs requiring scalability and feature richness.
Availability
M30162040054X0PWAR is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial control applications requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.
Supply support for M30162040054X0PWAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The Mxxxx204 product line delivers persistent SRAM-class performance using STT-MRAM technology, targeting applications demanding instant-write non-volatility, extreme endurance, and seamless SPI/QSPI interoperability in harsh thermal environments.
FAQ
What voltage ranges does the M30162040054X0PWAR support?
The M30162040054X0PWAR supports two independent supply ranges: 1.71 V to 2.00 V and 2.70 V to 3.60 V. This dual-voltage capability allows direct integration into both 1.8 V and 3.3 V system designs without level-shifting circuitry. The device automatically adapts internal logic thresholds based on applied VCC, and all timing specifications remain valid across both ranges as confirmed in the official Renesas datasheet revision Feb.21.23.
Does the M30162040054X0PWAR support execute-in-place (XIP) functionality?
Yes, the M30162040054X0PWAR supports eXecute-In-Place (XIP) mode, allowing sequential instruction fetches without repeating the read command for each access. XIP is enabled by sending a special byte (Axh) after the address during a read sequence. This reduces command overhead and improves effective read bandwidth - a documented feature in Section 6 of the M30162040054X0PWAR datasheet, validated for both SDR and DDR QSPI modes.
How is write protection implemented on the M30162040054X0PWAR?
The M30162040054X0PWAR implements dual-layer write protection: hardware-based via the WP# pin (active-low, requires WP#EN bit set in Status Register) and software-based via configuration bits (BPSEL[2:0], TBSEL) in the Status Register. These mechanisms independently control write access to the main memory array and status register. The WP# pin has no internal pull-up and must be actively driven - a requirement explicitly stated in Table 2 of the M30162040054X0PWAR datasheet.
What is the purpose of the Augmented Storage Array in the M30162040054X0PWAR?
The Augmented Storage Array is a dedicated 256-byte memory region physically separate from the main 16 Mbit array, divided into eight 32-byte sections. Each section can be individually programmed and write-protected via the Augmented Storage Array Protection Register. It is intended for storing infrequently modified but mission-critical data such as calibration coefficients, security keys, or device-specific identifiers - a function confirmed in Sections 9 and 11.2 of the M30162040054X0PWAR datasheet.
Is the M30162040054X0PWAR compatible with standard SPI protocols?
Yes, the M30162040054X0PWAR is fully compatible with standard SPI protocols, supporting both SPI Mode 0 (CPOL = 0, CPHA = 0) and SPI Mode 3 (CPOL = 1, CPHA = 1). It operates in Single SPI (1-1-1), Dual SPI (1-2-2), and Quad SPI (1-4-4 or 4-4-4) configurations, with explicit timing definitions for command, address, and data phases in both SDR and DDR modes - all detailed in Tables 3 and 4 of the M30162040054X0PWAR datasheet.
M30162040054X0PWAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 16Mbit
- Memory Organization:
- 4M x 4
- Memory Interface:
- -
- Clock Frequency:
- 54 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DFN (5x6)
M30162040054X0PWAR FAQ
1.How can I place an order for M30162040054X0PWAR through Aetrix?
Please submit a Request for Quotation (RFQ) for M30162040054X0PWAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M30162040054X0PWAR reliable?
The price and inventory of M30162040054X0PWAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M30162040054X0PWAR is usually 5 days.
3.What payment methods are accepted for M30162040054X0PWAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M30162040054X0PWAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M30162040054X0PWAR?
M30162040054X0PWAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M30162040054X0PWAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M30162040054X0PWAR?
For technical support, including M30162040054X0PWAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M30162040054X0PWAR requirements.
6.How does Aetrix verify that M30162040054X0PWAR is sourced from the original manufacturer or authorized distributors?
All M30162040054X0PWAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M30162040054X0PWAR meets industry standards.
7.What is the process for return or replacement of M30162040054X0PWAR?
All M30162040054X0PWAR units undergo pre-shipment inspection (PSI). If there is an issue with M30162040054X0PWAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M30162040054X0PWAR part is unused and in its original packaging.
Return procedure for M30162040054X0PWAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M30162040054X0PWAR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

