Renesas M30162040108X0PWAR
- Part No.:
- M30162040108X0PWAR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
M30162040108X0PWAR.pdf
- Description:
- IC RAM 16MBIT 108MHZ 8DFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,457
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
M30162040108X0PWAR from Renesas is a 16Mbit serial STT-MRAM non-volatile memory IC with QSPI interface, 108MHz SDR clock speed, 1.71–2.0V supply voltage, and industrial-plus temperature range (−40°C to +105°C). It delivers SRAM-compatible read/write timing, zero write latency, and persistent data retention without backup power-used in real-time industrial control logging and firmware storage.
For engineers reviewing the M30162040108X0PWAR datasheet, M30162040108X0PWAR pinout, M30162040108X0PWAR application, or M30162040108X0PWAR equivalent, key selection criteria include QSPI x4 interface compatibility, 108MHz SDR timing compliance, hardware/software write protection support, 256-byte augmented storage array usage, and DFN-8 (WSON) package integration into space-constrained embedded systems.
Technical Context
The M30162040108X0PWAR implements a 40nm pMTJ spin-transfer torque MRAM array with quad SPI (QPI: 4-4-4) interface supporting both SDR and DDR modes. Its architecture includes dedicated command/address/data buffers, status/configuration registers, and dual power domains for VCC (1.8V core/I/O) and VSS.
It features eXecute-In-Place (XIP) mode to eliminate per-access command overhead, Deep Power Down (3µs entry, 400µs exit) and Hibernate (3µs entry, 450µs exit) low-power states with full configuration retention, and hardware-based WP# pin plus software-configurable block protection via Status Register BPSEL bits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 16 Mbit (2 MByte) main memory array - supports firmware image storage and runtime parameter logging without wear-out concerns. |
| Interface | Quad SPI (QPI, 4-4-4) - enables 4-bit parallel data transfer on address and data phases, doubling bandwidth vs. standard SPI. |
| Max Clock Speed | 108 MHz in Single Data Rate mode - achieves up to 54 MB/s effective read throughput with no wait states. |
| Supply Voltage | 1.71 V – 2.00 V - compatible with modern 1.8V logic families and low-power microcontrollers. |
| Operating Temp | −40°C to +105°C (Industrial Plus) - qualified for under-hood automotive ECUs and factory-floor PLCs. |
| Endurance | Virtually unlimited (>10¹⁵ cycles) - eliminates refresh management and wear-leveling firmware overhead. |
| Data Retention | 20+ years at +105°C - ensures long-term reliability in unpowered storage applications like black-box event logs. |
Pinout & Package
Package: 8-pad DFN (WSON), 5.0 mm × 6.0 mm, wettable flank, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; must fall before first instruction; controls standby/active power state transition. |
| WP# / IO[2] | Bidirectional I/O or Hardware Write Protect | In SPI mode: input-only write protect; when asserted low with WP#EN=1, locks status register; in QPI mode: bidirectional data line IO[2]. |
| SI / IO[0] | Serial Input or Bidirectional Data 0 | In SPI: unidirectional command/address/data input; in QPI: bidirectional data line IO[0] for 4-line transfers. |
| CLK | Clock Input | Synchronous timing reference; rising edge latches commands in SDR/DDR; both edges used for address/data in DDR mode. |
| IO[3] | Bidirectional Data 3 | QPI-only data line; required for 4-line address/data transfer; must be pulled high if unused in SPI mode. |
| SO / IO[1] | Serial Output or Bidirectional Data 1 | In SPI: unidirectional data output on falling clock edge; in QPI: bidirectional data line IO[1]. |
| VCC | Power Supply | 1.71–2.00 V core and I/O supply; requires local 100 nF decoupling capacitor per datasheet layout guidance. |
| VSS | Ground | Common return path for core and I/O circuits; must be low-impedance connection to PCB ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| eXecute-In-Place (XIP) | Enables continuous burst reads without repeated command issuance - reduces average access latency by >30% in firmware execution scenarios. |
| Augmented Storage Array | 256-byte user-programmable section with per-32-byte write protection - ideal for storing calibration coefficients or secure keys independent of main array. |
| Hardware + Software Protection | WP# pin + Status Register BPSEL[2:0] and TBSEL bits - allows hierarchical locking of top/bottom memory blocks and serial number registers. |
| JEDEC Reset Support | Standard reset command (66h) restores default register values - simplifies system recovery after brownout or watchdog timeout events. |
| Deep Power Down Mode | Reduces ICC to <1 µA while retaining all memory contents and register settings - extends battery life in always-on monitoring nodes. |
Applications
| Factory Automation | Medical Diagnostics |
|---|---|
Use Scenario: Real-time logging of sensor readings and machine cycle timestamps in PLC-controlled assembly lines. IC Role / Device Role / Timing Role: Non-volatile scratchpad memory for deterministic, low-latency write capture during motion control sequences. Use Value: Eliminates write buffering and flash wear leveling, enabling sub-microsecond write commits and guaranteed data persistence across power loss. |
Use Scenario: Storing calibrated transducer coefficients and patient-specific configuration profiles in portable ultrasound units. IC Role / Device Role / Timing Role: Secure, tamper-resistant configuration storage with hardware write protect and unique ID verification. Use Value: Prevents accidental overwrites via WP# pin and supports traceability through 64-bit unique ID and programmable serial number. |
| Industrial Control And Monitoring | Data Switches And Routers |
Use Scenario: Firmware update staging and rollback storage in remote RTU gateways operating in harsh outdoor environments. IC Role / Device Role / Timing Role: High-reliability code storage with XIP capability for fast boot and fail-safe dual-image switching. Use Value: Enables instant firmware validation and atomic swap without external RAM or complex bootloader logic. |
Use Scenario: Storing routing tables and MAC address tables in carrier-grade Ethernet switches requiring zero-downtime updates. IC Role / Device Role / Timing Role: Low-latency, high-endurance memory for dynamic table updates synchronized with packet forwarding pipelines. Use Value: Supports >1 million table modifications per second with no degradation over 15+ years of field operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial non-volatile memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress Semiconductors FM25V16-G | 16Mb F-RAM; 3.3V only (2.7–3.6V); max 40MHz SPI; no QPI or XIP support | Limited to lower-speed control interfaces; lacks augmented storage and JEDEC reset | Choose for legacy 3.3V systems where ultra-low write energy is critical and bandwidth <20MB/s suffices. |
| Infineon Technologies CY14B116N-ZSP25XI | 16Mb nvSRAM; 3.3V only; built-in lithium battery backup; 25ns async access; no serial interface | Requires board-level backup power design; incompatible with SPI host controllers | Choose only when deterministic nanosecond-level random access is mandatory and board space permits coin-cell integration. |
Compared with FM25V16-G and CY14B116N-ZSP25XI, the M30162040108X0PWAR uniquely combines 108MHz QSPI bandwidth, 1.8V operation, XIP, and augmented storage in a single 5×6mm DFN package-making it optimal for next-generation industrial edge nodes requiring high-speed, maintenance-free non-volatility.
Availability
M30162040108X0PWAR is available at Aetrix Electronics and suitable for factory automation, medical diagnostics, and industrial control applications requiring stable component supply, long-term lifecycle assurance, and RoHS/REACH compliance.
Supply support for M30162040108X0PWAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The M30162040108X0PWAR belongs to Renesas' Persistent SRAM (P-SRAM) family, designed specifically to replace battery-backed SRAM and legacy NOR/NAND flash in mission-critical embedded systems demanding instant-write, infinite endurance, and wide-temperature operation.
FAQ
What is the exact memory density and organization of the M30162040108X0PWAR?
The M30162040108X0PWAR provides 16 Mbit (2,097,152 bits) of main memory organized as 2,097,152 × 1, accessible via 24-bit addressing (000000h–1FFFFFh). It also includes a separate 256-byte Augmented Storage Array mapped at 000000h–0000FFh, divided into eight 32-byte programmable and individually protectable sections.
Does the M30162040108X0PWAR support both Single Data Rate and Double Data Rate SPI modes?
The M30162040108X0PWAR supports Single Data Rate (SDR) mode at up to 108 MHz, but does not support Double Data Rate (DDR) operation at 54 MHz. Its ordering code "0108" explicitly denotes the 108 MHz SDR variant; DDR-capable versions use "0054" in the part number and are distinct SKUs.
What package type and footprint does the M30162040108X0PWAR use?
The M30162040108X0PWAR uses an 8-pad DFN (WSON) package measuring 5.0 mm × 6.0 mm with wettable flanks. Pinout matches industry-standard 8-pin SOIC but in a smaller, thermally enhanced leadless format-compatible with reflow soldering and automated optical inspection.
How does the write protection mechanism work on the M30162040108X0PWAR?
The M30162040108X0PWAR implements dual-layer write protection: hardware-based via the WP# pin (active-low, requires WP#EN bit = 1 in Status Register), and software-based via Status Register BPSEL[2:0] and TBSEL bits to lock top/bottom memory blocks. The Augmented Storage Array supports per-section write protection independent of main array settings.
Is the M30162040108X0PWAR compatible with standard Quad SPI controllers?
Yes-the M30162040108X0PWAR fully complies with JEDEC JESD251 QPI standards and supports standard Quad SPI instructions including Read Quad IO (6Bh), Write Quad IO (32h), and Quad Page Program (38h). It operates in QPI mode (4-4-4) with all four I/O lines active for command, address, and data phases.
M30162040108X0PWAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 16Mbit
- Memory Organization:
- 4M x 4
- Memory Interface:
- -
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DFN (5x6)
M30162040108X0PWAR FAQ
1.How can I place an order for M30162040108X0PWAR through Aetrix?
Please submit a Request for Quotation (RFQ) for M30162040108X0PWAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M30162040108X0PWAR reliable?
The price and inventory of M30162040108X0PWAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M30162040108X0PWAR is usually 5 days.
3.What payment methods are accepted for M30162040108X0PWAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M30162040108X0PWAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M30162040108X0PWAR?
M30162040108X0PWAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M30162040108X0PWAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M30162040108X0PWAR?
For technical support, including M30162040108X0PWAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M30162040108X0PWAR requirements.
6.How does Aetrix verify that M30162040108X0PWAR is sourced from the original manufacturer or authorized distributors?
All M30162040108X0PWAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M30162040108X0PWAR meets industry standards.
7.What is the process for return or replacement of M30162040108X0PWAR?
All M30162040108X0PWAR units undergo pre-shipment inspection (PSI). If there is an issue with M30162040108X0PWAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M30162040108X0PWAR part is unused and in its original packaging.
Return procedure for M30162040108X0PWAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M30162040108X0PWAR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

