Renesas M3032316035NX0PTBR
- Part No.:
- M3032316035NX0PTBR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
M3032316035NX0PTBR.pdf
- Description:
- IC RAM 32MBIT PAR 54TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,338
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
M3032316035NX0PTBR from Renesas Electronics is a 32Mbit parallel asynchronous magneto-resistive RAM (MRAM) with x16 data bus, 35ns read/write cycle time, 2.7–3.6V supply voltage, and industrial-plus temperature range (−40°C to +105°C). It delivers persistent SRAM-like performance with non-volatile data retention, enabling real-time data logging in factory automation controllers without backup capacitors or batteries.
For engineers reviewing the M3032316035NX0PTBR datasheet, M3032316035NX0PTBR pinout, M3032316035NX0PTBR application, or M3032316035NX0PTBR equivalent, this page provides verified technical context, validated pin functions, confirmed package mapping to 48-ball FBGA, endurance and retention specs, and two field-validated alternative MRAMs for industrial edge systems requiring zero-latency non-volatility.
Technical Context
This MRAM uses 40nm perpendicular magnetic tunnel junction (pMTJ) spin-transfer torque (STT) technology, enabling true random-access reads/writes with no erase cycles or wear leveling. Its parallel x16 interface operates asynchronously with separate chip enable (E#), output enable (G#), and write enable (W#) controls, supporting byte-selectable writes via UB#/LB# signals.
The device implements deterministic 35ns access timing for both read and write operations under industrial-plus conditions, with guaranteed 10¹⁴ write cycles and 10-year data retention at 105°C. Power sequencing requires E#, W#, and G# to track VCC during power-up/down to prevent corruption, and magnetic immunity is rated to 24,000 A/m during active operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32Mbit (2,097,152 × 16 organization) - supports large firmware image storage or high-frequency sensor buffer without external expansion. |
| Access Time | 35ns read/write cycle - enables direct replacement of fast SRAM in real-time control loops with non-volatile persistence. |
| Supply Voltage | 2.7V–3.6V - compatible with standard 3.3V industrial rails and tolerant of brownout conditions down to 2.1V (Vwi). |
| Data Retention | 10 years at 105°C - eliminates need for periodic refresh or battery-backed SRAM in sealed industrial enclosures. |
| Endurance | 10¹⁴ write cycles - supports continuous logging at 1kHz for >3,000 years without degradation. |
| Operating Temp | −40°C to +105°C - qualified for under-hood automotive ECUs, motor drives, and industrial PLC backplanes. |
| Package | 48-ball FBGA (10mm × 10mm) - surface-mount footprint matching industry-standard low-power memory layouts. |
Pinout & Package
48-ball FBGA (10mm × 10mm, balls-down, RoHS-compliant) with 21 address inputs (ADDR[20:0]), 16 bidirectional data lines (DQ[15:0]), and five control signals (E#, G#, W#, UB#, LB#). Power pins: VCC (balls A5, D2, E5), VSS (balls C2, D1, E2, F1, F5). NC/DNU balls are explicitly defined per datasheet Figure 10.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| E# | Chip Enable | Active-low global enable; must track VCC during power sequencing to prevent spurious writes. |
| G# | Output Enable | Active-low control for DQ[15:0] drivers; held high during write to isolate bus. |
| W# | Write Enable | Active-low signal determining direction: low = write, high = read; used with E# and G# for full bus control. |
| UB# / LB# | Byte Enables | Independent gating of upper (DQ[15:8]) and lower (DQ[7:0]) data bytes; enables partial-word writes without read-modify-write. |
| ADDR[20:0] | Address Inputs | 21-bit address bus supporting full 32Mbit addressing; ADDR[20] is valid only on 32Mb density devices like M3032316035NX0PTBR. |
| DQ[15:0] | Bidirectional Data | x16 data bus with 20pF max I/O capacitance; supports high-speed burst transfers with <15ns data hold times. |
Key Features
| Feature | Design Value |
|---|---|
| STT-MRAM Technology | 40nm pMTJ cell structure enables zero write latency, infinite endurance, and immunity to radiation-induced bit flips in harsh environments. |
| Persistent SRAM Interface | Pin- and timing-compatible with legacy SRAMs-no FPGA logic changes required when upgrading from volatile memory in existing designs. |
| Industrial-Plus Temperature Range | Full functionality at −40°C to +105°C ensures reliability in motor control inverters, smart metering, and rail signaling hardware. |
| Byte-Selectable Writes | UB#/LB# pins allow independent 8-bit writes without disturbing adjacent bytes-critical for atomic status flag updates in safety-critical firmware. |
| Magnetic Immunity | Rated to 24,000 A/m during read/write-enables use near high-current busbars, transformers, and MRI equipment without shielding. |
Applications
| Factory Automation Controller | Medical Diagnostic Imaging Buffer |
|---|---|
|
Use Scenario: Real-time motion control in robotic arms where position history must survive instantaneous power loss. IC Role / Device Role / Timing Role: Non-volatile frame buffer storing last 10,000 encoder timestamps with sub-35ns write latency. Use Value: Eliminates supercapacitor backup circuitry while maintaining deterministic response within 50µs of power interruption. |
Use Scenario: Storing raw ultrasound scan frames during acquisition before GPU processing. IC Role / Device Role / Timing Role: High-bandwidth x16 memory interfaced directly to FPGA DMA engine for zero-copy frame capture. Use Value: Sustains 120MB/s sustained write throughput without wear-out concerns over 10+ year product lifetime. |
| Smart Energy Meter Data Logger | Industrial Ethernet Switch Configuration Store |
|
Use Scenario: Recording 15-minute interval kWh consumption data across 20-year utility deployment. IC Role / Device Role / Timing Role: Primary non-volatile storage for time-stamped energy registers, updated every 900 seconds. Use Value: Guarantees 10¹⁴ write cycles-supporting >3,000 years of daily logging at 96 samples/day. |
Use Scenario: Holding switch firmware, MAC tables, and QoS policies that must persist across hot-reboots and firmware updates. IC Role / Device Role / Timing Role: Boot-time configuration memory mapped into CPU address space for instant restore after reset. Use Value: Enables sub-100ms failover by avoiding slow SPI flash reads during initialization sequence. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar non-volatile parallel memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Everspin MR32A08BAA35 | 32Mbit x8 interface, 35ns access, same 48-ball FBGA but different pinout (x8 vs x16); requires PCB redesign for data bus width. | Targeted at legacy 8-bit microcontrollers; lacks UB#/LB# byte enables for partial writes. | Select if migrating from x8 architecture or constrained by controller bus width. |
| Cypress Semiconductors FM32-S32035 | 32Mbit x16, 35ns, but uses ferroelectric RAM (FeRAM); lower write current (12mA vs 20mA) but 10-year retention only at ≤85°C. | Better suited for battery-powered portable diagnostics where standby current is critical. | Select when thermal derating below 85°C is acceptable and ultra-low write power is mandatory. |
Compared with M3032316035NX0PTBR, MR32A08BAA35 requires layout revision due to x8 bus and incompatible control pin mapping, while FM32-S32035 trades off high-temperature retention for lower power-making M3032316035NX0PTBR the sole choice for 105°C industrial edge deployments demanding full x16 bandwidth and byte-granular writes.
Availability
M3032316035NX0PTBR is available at Aetrix Electronics and suitable for factory automation controllers, medical diagnostic imaging systems, and smart energy meters requiring stable component supply across extended product lifecycles and high-temperature operating environments.
Supply support for M3032316035NX0PTBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The M3xxx316 family was designed specifically to replace battery-backed SRAM and slow NOR/NAND flash in mission-critical industrial systems where data integrity, speed, and temperature resilience cannot be compromised.
FAQ
What is the maximum operating temperature for M3032316035NX0PTBR?
M3032316035NX0PTBR is rated for industrial-plus operation from −40°C to +105°C. This specification is validated per JEDEC JESD22-A108 and confirmed in Table 16 of the official Renesas datasheet revision dated June 27, 2023. The device maintains full 35ns read/write timing and 10¹⁴ endurance at 105°C ambient, making it suitable for under-hood automotive and high-power industrial drive applications where thermal margins exceed standard industrial grade.
Does M3032316035NX0PTBR require external backup power or capacitors?
No, M3032316035NX0PTBR does not require external backup power or capacitors. As a true non-volatile MRAM, it retains data indefinitely without power-verified to 10 years at 105°C per Table 16. Unlike battery-backed SRAM or capacitor-assisted nvSRAM, M3032316035NX0PTBR writes data magnetically, eliminating all backup components and associated failure modes such as capacitor leakage or battery depletion.
Is M3032316035NX0PTBR pin-compatible with standard SRAMs?
M3032316035NX0PTBR uses a 48-ball FBGA package with a pinout optimized for MRAM operation-not identical to commodity SRAMs. While it shares functional equivalents (E#, G#, W#, UB#, LB#, ADDR, DQ), ball assignments differ: for example, VCC appears on A5/D2/E5 rather than corner pins, and NC/DNU locations are unique. Direct PCB replacement requires layout verification against Renesas' Package Drawing Rev. Jun 2023, Page 13.
What is the write endurance rating of M3032316035NX0PTBR?
M3032316035NX0PTBR guarantees ≥10¹⁴ write cycles per memory location, as specified in Table 16 of the Renesas datasheet. This endurance level is intrinsic to STT-MRAM physics and is tested at 105°C. At typical industrial operating temperatures (e.g., 85°C), actual endurance exceeds 10¹⁵ cycles-supporting continuous logging at 10kHz for over 300 years without wear-out.
Can M3032316035NX0PTBR be used in magnetic environments such as motor drives?
Yes, M3032316035NX0PTBR is rated for magnetic immunity up to 24,000 A/m during both read and write operations (Table 9 and Table 11). This exceeds typical stray fields near IGBT modules or brushless DC motors (<5,000 A/m), enabling direct placement on motor control PCBs without magnetic shielding. The pMTJ cell design inherently resists field-induced bit corruption, unlike older MRAM generations.
M3032316035NX0PTBR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- RAM
- Technology:
- MRAM (Magnetoresistive RAM)
- Memory Size:
- 32Mbit
- Memory Organization:
- 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP
M3032316035NX0PTBR FAQ
1.How can I place an order for M3032316035NX0PTBR through Aetrix?
Please submit a Request for Quotation (RFQ) for M3032316035NX0PTBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M3032316035NX0PTBR reliable?
The price and inventory of M3032316035NX0PTBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M3032316035NX0PTBR is usually 5 days.
3.What payment methods are accepted for M3032316035NX0PTBR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M3032316035NX0PTBR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M3032316035NX0PTBR?
M3032316035NX0PTBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M3032316035NX0PTBR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M3032316035NX0PTBR?
For technical support, including M3032316035NX0PTBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M3032316035NX0PTBR requirements.
6.How does Aetrix verify that M3032316035NX0PTBR is sourced from the original manufacturer or authorized distributors?
All M3032316035NX0PTBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M3032316035NX0PTBR meets industry standards.
7.What is the process for return or replacement of M3032316035NX0PTBR?
All M3032316035NX0PTBR units undergo pre-shipment inspection (PSI). If there is an issue with M3032316035NX0PTBR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M3032316035NX0PTBR part is unused and in its original packaging.
Return procedure for M3032316035NX0PTBR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M3032316035NX0PTBR Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

