STMicroelectronics M30LW128D110N6
- Part No.:
- M30LW128D110N6
- Manufacturer:
- STMicroelectronics
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
M30LW128D110N6.pdf
- Description:
- IC FLASH 128MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,518
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Product details
Overview
M30LW128D from STMicroelectronics is a 128 Mbit stacked flash memory composed of two 64 Mbit M58LW064D dies in a single package, supporting x8/x16 bus width (TSOP56/TBGA64) or fixed x16 (LFBGA88), with 2.7–3.6 V VDD supply, 110 ns random read access, and uniform 128-block (64 KWord/block) architecture for embedded code/data storage in industrial controllers and telecom baseband modules.
For engineers reviewing the M30LW128D datasheet, M30LW128D pinout, M30LW128D application, or M30LW128D equivalent, key selection considerations include block-level erase suspend/resume capability, CFI-compliant command interface, 100,000 program/erase cycles per block, and dual VDD/VDDQ supply separation for I/O voltage flexibility in mixed-signal systems.
Technical Context
This device implements a stacked-die architecture integrating two independent M58LW064D flash arrays sharing a unified command interface and status register. It supports JEDEC-standard Common Flash Interface (CFI) for host compatibility and includes an on-chip Program/Erase Controller (P/E.C.) that automates timing-critical sequences for write buffer programming and block erasure.
The memory features dual-supply operation: VDD (2.7–3.6 V) powers core logic and erase/program functions, while VDDQ (1.8–VDD) independently supplies I/O buffers-enabling interoperability with 1.8 V or 3.3 V microprocessor buses. Block protection is non-volatile and restored at power-up, with hardware VPEN gating all program/erase operations when low.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (two 64 Mbit arrays), organized as 128 uniform blocks × 64 KWord (x16) or 128 KByte (x8) |
| Supply Voltage | VDD = 2.7–3.6 V for core logic; VDDQ = 1.8–VDD for I/O buffers-supports mixed-voltage system interfacing |
| Access Time | 110 ns random read; 25 ns page mode read-enables high-throughput firmware execution in boot memory applications |
| Write Buffer | 16-word buffer with 16 µs effective word programming time-reduces CPU wait states during firmware updates |
| Endurance | 100,000 program/erase cycles per block-ensures long-term reliability in field-upgradable embedded devices |
| Interface Standard | JEDEC Common Flash Interface (CFI)-guarantees plug-and-play compatibility with standard flash-aware BIOS/bootloaders |
| Protection | 128-bit non-volatile protection register + per-block software lock/unlock-prevents accidental overwrite of critical bootloader or calibration data |
Pinout & Package
Available in TSOP56 (14 × 20 mm), TBGA64 (10 × 13 mm, 1 mm pitch), and LFBGA88 (8 × 10 mm, 0.8 mm pitch) packages. TSOP56 and TBGA64 support x8/x16 configuration with BYTE pin and STS output; LFBGA88 supports x16 only and omits BYTE and STS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 (TSOP/TBGA); A0–A22 (LFBGA) | Address Inputs | 24-bit address bus (x8 mode) or 23-bit (x16 mode); A0 is LSB in x8, A1 is LSB in x16-enables full 128 Mbit addressing |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus (x16) or lower 8 bits used (x8)-configurable for bandwidth vs. pin count trade-off |
| E | Chip Enable | Active-low chip select; internally manages both stacked dies-eliminates need for external decode logic in multi-chip configurations |
| W, G | Write/Output Enable | Standard asynchronous control signals-compatible with legacy microprocessor bus timing requirements |
| VPEN | Program/Erase Enable | Hardware gate for all program/erase operations; must be high to initiate commands-critical safety interlock against unintended writes |
| STS | Status Output | Open-drain Ready/Busy or pulse-mode status signal (TSOP/TBGA only)-provides interrupt-capable feedback without polling overhead |
| BYTE | Bus Width Select | High = x16 mode; low = x8 mode (TSOP/TBGA only)-dynamically configures data path width at system power-up |
| RP | Reset/Power-Down | Active-low input resets P/E.C. state machine and enters low-power standby-enables deterministic recovery after brown-out events |
Key Features
| Feature | Design Value |
|---|---|
| Stacked Dual-Die Architecture | Two 64 Mbit M58LW064D arrays in one package-doubles density without increasing PCB footprint or signal routing complexity |
| Program/Erase Suspend | Interruptible erase or program to service read/write requests in other blocks-enables real-time data logging during firmware update |
| 16-Word Write Buffer | Reduces average programming time by >70% vs. single-word writes-minimizes CPU stall time during field firmware upgrades |
| Non-Volatile Block Protection | Each block retains protection state across power cycles-ensures bootloader integrity remains enforced after cold restart |
| CFI Query Support | Standardized geometry and command set identification via Read Query command-enables automatic driver initialization in OS bootloaders |
Applications
| Industrial PLC Firmware Storage | Telecom Baseband Code Memory |
|---|---|
|
Use Scenario: Storing firmware and configuration tables in programmable logic controllers operating in harsh factory environments with frequent power cycling. IC Role / Device Role / Timing Role: Non-volatile boot memory providing fast random read access for instruction fetch and reliable block-erase capability for over-the-air updates. Use Value: 100,000 erase cycles and non-volatile block protection ensure 10+ years of field upgrade reliability without risk of bootloader corruption. |
Use Scenario: Holding DSP firmware and protocol stacks in 3G/4G baseband processors requiring concurrent read during background erase of obsolete parameter sets. IC Role / Device Role / Timing Role: High-bandwidth x16 flash memory with suspend/resume-enables uninterrupted real-time signal processing during memory maintenance. Use Value: 25 ns page read and program suspend allow >95% CPU utilization during firmware patching, avoiding service interruption. |
| Medical Imaging System Boot ROM | Automotive Infotainment Head Unit Storage |
|
Use Scenario: Secure boot image storage in MRI/CT scanner control units where regulatory compliance mandates tamper-resistant firmware integrity. IC Role / Device Role / Timing Role: CFI-compliant flash with 128-bit user-programmable protection register-enforces hardware-enforced read/write lockdown of certified binaries. Use Value: Manufacturer-locked first 64 bits + user-lockable second 64 bits meet IEC 62304 traceability and anti-tampering requirements. |
Use Scenario: Storing navigation maps and UI assets in automotive head units subject to wide temperature (-40°C to +105°C) and vibration stress. IC Role / Device Role / Timing Role: Dual-supply (VDD/VDDQ) flash enabling stable 1.8 V I/O interfacing with application processors while maintaining 3.3 V core robustness. Use Value: Independent VDDQ regulation prevents I/O noise coupling into core logic-reducing uncorrectable bit errors under EMI stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S | 128 Mbit, 3.0 V single-supply (no VDDQ separation), 90 ns read, no suspend/resume | Lacks program/erase suspend; requires tighter VDD tolerance (2.7–3.6 V not supported) | Prefer for cost-sensitive designs where concurrent read/write is unnecessary and 1.8 V I/O compatibility is not required |
| MX29LV128DB | 128 Mbit, 3.0 V single-supply, 70 ns read, CFI-compliant, no write buffer | No 16-word buffer; slower effective programming; no VPEN hardware gate | Choose when maximum read speed is prioritized over programming efficiency and hardware write protection is managed externally |
Compared with S29GL128S and MX29LV128DB, the M30LW128D uniquely combines dual-supply I/O flexibility, hardware VPEN gating, and suspend/resume-making it optimal for safety-critical or real-time embedded systems requiring guaranteed firmware update atomicity and mixed-voltage interoperability.
Availability
M30LW128D is available at Aetrix Electronics and suitable for industrial PLCs, telecom baseband modules, medical imaging controllers, and automotive infotainment head units requiring stable component supply across extended product lifecycles.
Supply support for M30LW128D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in microcontrollers, power management, and non-volatile memory solutions for industrial, automotive, and consumer applications.
The M30LW128D belongs to ST's M30LW series of high-reliability stacked flash memories, designed specifically for embedded systems demanding high-density, field-upgradable, and electrically robust code storage in space-constrained platforms.
FAQ
What is the function of the VPEN pin, and what happens if it is left unconnected?
The VPEN (Program/Erase Enable) pin is a hardware safety interlock: it must be driven high to permit any program or erase command execution. If left floating or pulled low, all such operations are blocked-even valid command sequences will be ignored. STMicroelectronics specifies VPEN must be actively driven high via external logic or pull-up resistor; no internal pull-up exists. This design prevents accidental memory corruption during power transients or initialization glitches.
Does the M30LW128D support true x8/x16 bus width selection, and how is it configured?
Yes-x8/x16 mode is selected dynamically via the BYTE pin (high = x16, low = x8) on TSOP56 and TBGA64 packages. In x16 mode, A0 is don't-care and A1 becomes the LSB; in x8 mode, A0 is LSB. The LFBGA88 package fixes x16 operation and omits the BYTE pin entirely. Address mapping and DQ pin usage automatically adapt-no external address decoding or bus multiplexing is required.
How does the STS (Status) pin operate, and why is it unavailable on LFBGA88?
STS is an open-drain output configurable as Ready/Busy (static level) or Status Pulse (edge-triggered end-of-operation). It serves as a hardware interrupt to offload CPU polling. STS is omitted on LFBGA88 due to ball count constraints and the package's target use in space-optimized, high-integration designs where status is typically read via software polling of the Status Register-trade-off favoring footprint reduction over interrupt latency.
Can the protection register be reprogrammed after initial setup, and what locks it permanently?
The 128-bit protection register has two 64-bit segments: the first is factory-programmed by STMicroelectronics (non-user-accessible), the second is user-programmable. Once the user segment's lock bit is set via Protection Register Program Command, further writes to that segment are disabled until next power cycle-but the lock state itself persists across power cycles. Permanent locking requires external hardware control of VPEN and RP pins to prevent unauthorized unlock attempts.
M30LW128D110N6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 128Mbit
- Memory Organization:
- 8M x 8 x 2, 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 110ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
M30LW128D110N6 FAQ
1.How can I place an order for M30LW128D110N6 through Aetrix?
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5.How can I obtain technical support or documentation for M30LW128D110N6?
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6.How does Aetrix verify that M30LW128D110N6 is sourced from the original manufacturer or authorized distributors?
All M30LW128D110N6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M30LW128D110N6 meets industry standards.
7.What is the process for return or replacement of M30LW128D110N6?
All M30LW128D110N6 units undergo pre-shipment inspection (PSI). If there is an issue with M30LW128D110N6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M30LW128D110N6 part is unused and in its original packaging.
Return procedure for M30LW128D110N6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M30LW128D110N6 Tags

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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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Microchip Technology

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Microchip Technology
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STMicroelectronics

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Microchip Technology

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Microchip Technology

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Microchip Technology

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Microchip Technology
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