STMicroelectronics M40Z300WMH6F
- Part No.:
- M40Z300WMH6F
- Manufacturer:
- STMicroelectronics
- Category:
- Supervisors
- Package:
- 28-SOIC (0.350", 8.89mm Width) with SNAPHAT Sockets
- Datasheet:
-
M40Z300WMH6F.pdf
- Description:
- IC SUPERVISOR 1 CHANNEL 28SOH
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
M40Z300WMH6F from STMicroelectronics is a 3.0 V to 3.6 V non-volatile RAM (NVRAM) supervisor IC that converts low-power SRAMs into battery-backed memory by managing power-fail detection, automatic write-protection, and seamless VCC-to-battery switchover. It supports up to eight SRAMs via dual-device parallel decoding, features open-drain RST and BL outputs, and delivers ≤12 ns chip enable propagation delay. Used in industrial data loggers requiring persistent memory during brownouts.
For engineers reviewing the M40Z300WMH6F datasheet, M40Z300WMH6F pinout, M40Z300WMH6F application, or M40Z300WMH6F equivalent, key selection criteria include VPFD threshold select (THS), VSO switchover voltage, tWPT write-protect timing, battery low monitoring interval, and SOIC-16 package compatibility with external lithium cell connections.
Technical Context
The M40Z300WMH6F implements precision voltage monitoring using an internal reference and comparator to detect VCC out-of-tolerance conditions below VPFD (2.5 V–2.7 V when THS = VOUT). Upon detection, it forces E1CON–E4CON inactive within tWPT (≤10 µs) to unconditionally write-protect attached SRAMs.
It integrates a bidirectional power switch that disconnects VCC and connects the external battery to VOUT at VSO (≈2.3 V), sustaining SRAM data retention at VOHB ≥ 2.0 V. The 2-input A/B decoder enables independent control of four SRAMs per device, scalable to eight with parallel placement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.7 V to 3.3 V - Supports 3.0 V system rails with ±10% tolerance margin. |
| VPFD (THS = VOUT) | 2.5 V to 2.7 V - Power-fail detection threshold ensuring early SRAM write-protection before data corruption. |
| VSO | ≈2.3 V - Switchover voltage where internal switch transfers SRAM supply from VCC to battery. |
| tWPT | ≤10 µs - Maximum time to assert write-protection after VCC falls below VPFD(min). |
| Chip Enable Propagation Delay | ≤12 ns - Ensures minimal latency between E input and E1CON–E4CON output during normal operation. |
| BL Monitoring Interval | ≥24 hours - Factory-programmed periodic battery voltage check to flag end-of-life condition. |
| IBAT (Typical) | 1.5 µA - Quiescent current drawn from battery during data retention mode, enabling multi-year backup. |
Pinout & Package
Package: 16-lead SOIC (SO16/MQ), body width 150 mils, RoHS-compliant lead-free finish. Designed for direct connection to external lithium battery via dedicated B+ and B– pins (pins 9 and 8 respectively); B– must not be tied to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A) | Decoder input A | Selects one of four SRAM chip enable outputs (E1CON–E4CON) in conjunction with B. |
| 2 (RST) | Open-drain reset output | Asserts low for tREC (120 ms max) after VCC rises above VPFD to stabilize microprocessor on power-up. |
| 3 (B) | Battery positive connection | Direct anode connection point for external lithium cell; supplies VOUT during backup mode. |
| 4 (E1CON) | Conditioned chip enable output 1 | Active-low output mirroring E input during normal operation; forced high during power fail for write-protection. |
| 5 (E) | Chip enable input | Primary enable signal from host controller; controls E1CON–E4CON behavior unless power fault occurs. |
| 6 (E2CON) | Conditioned chip enable output 2 | Second decoded CE output; follows E with same timing and protection logic as E1CON. |
| 7 (E3CON) | Conditioned chip enable output 3 | Third decoded CE output; enables third SRAM with identical fault-handling behavior. |
| 8 (VSS) | Ground | System ground reference; B– must be connected to battery negative terminal only-not to this pin. |
| 9 (B–) | Battery negative connection | Dedicated cathode connection for external lithium cell; isolated from VSS to prevent leakage paths. |
| 10 (NC) | No connect | Internally unconnected; must remain floating or grounded per layout best practice. |
| 11 (VOUT) | Regulated supply output | Delivers stabilized voltage to SRAM VCC pin; sourced from VCC (normal) or B+ (backup mode). |
| 12 (VCC) | Main supply input | Primary 2.7–3.3 V system rail; powers internal circuitry and feeds VOUT until switchover. |
| 13 (M40Z300W BL) | Battery low indicator | Open-drain output asserted low when battery voltage drops below ~2.5 V; requires external pull-up. |
| 14 (THS) | Threshold select input | Configures VPFD range: tied to VSS selects 2.8–3.0 V; tied to VOUT selects 2.5–2.7 V. |
| 15 (E4CON) | Conditioned chip enable output 4 | Fourth decoded CE output; completes full 4-SRAM decode set with A/B inputs. |
| 16 (VOUT) | Secondary VOUT pin | Redundant VOUT connection for improved current delivery or PCB routing flexibility. |
Key Features
| Feature | Design Value |
|---|---|
| Automatic write-protection on VCC fault | Guarantees SRAM data integrity within ≤10 µs of VCC falling below VPFD(min), eliminating need for software intervention. |
| Dual-threshold VPFD selection | THS pin configures either 2.8–3.0 V or 2.5–2.7 V detection window-enabling precise alignment with system brownout margins. |
| Integrated battery switchover | Seamless transition from VCC to external lithium cell at ≈2.3 V without glitch or hold-time violation on VOUT. |
| 24-hour battery health monitoring | Automated periodic BL assertion confirms battery voltage ≥2.5 V, supporting predictive maintenance in unattended systems. |
| Four-channel decoded CE outputs | E1CON–E4CON allow independent control of four SRAMs using only two address lines (A/B), reducing MCU GPIO usage. |
Applications
| Industrial Data Logger | Medical Device Memory Backup |
|---|---|
|
Use Scenario: Continuous sensor sampling in remote environmental monitors with intermittent power. IC Role / Device Role / Timing Role: NVRAM supervisor enforcing write-protection and battery switchover during grid brownouts or battery depletion. Use Value: Preserves timestamped measurement history across power cycles without EEPROM wear-out or firmware overhead. |
Use Scenario: Patient parameter storage in portable diagnostic equipment operating on rechargeable main battery. IC Role / Device Role / Timing Role: Real-time SRAM-to-NVRAM conversion with <10 µs fault response and 24-hour battery health verification. Use Value: Eliminates risk of clinical data loss during unexpected shutdown while enabling long-term battery life via ultra-low IBAT (1.5 µA). |
| Avionics Black Box Recorder | Smart Meter Firmware Retention |
|
Use Scenario: Crash-protected flight data recording in aircraft subsystems exposed to wide thermal and voltage transients. IC Role / Device Role / Timing Role: Precision VPFD monitoring (2.5–2.7 V) combined with Schottky-clamped VCC protection against negative spikes. Use Value: Meets DO-160 Section 22 surge immunity requirements while guaranteeing SRAM data retention down to 2.0 V. |
Use Scenario: Utility meter firmware and tariff tables stored in low-power SRAM with tamper-resistant backup. IC Role / Device Role / Timing Role: Dual-device parallel decoding supporting eight SRAM banks for secure, segmented memory architecture. Use Value: Enables cryptographic key isolation and firmware versioning across multiple SRAM blocks without additional address decoding logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NVRAM supervisor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX6900 | Single-supply 3.3 V operation; no THS-selectable VPFD; fixed 2.63 V threshold; lacks A/B decoder. | Supports only one SRAM per device; no multi-SRAM decode capability; requires external logic for expansion. | Choose when system uses only one SRAM and requires simpler, fixed-threshold supervision without decode logic. |
| DS1230Y | 5 V-only operation (4.75–5.25 V); integrated lithium battery; no external B+/B– pins; 28-pin DIP package. | Not pin-compatible; incompatible with 3.0 V systems; no support for user-replaceable battery or SNAPHAT-style modularity. | Choose only for legacy 5 V designs requiring fully integrated battery solution and DIP mounting. |
Compared with MAX6900 and DS1230Y, the M40Z300WMH6F uniquely combines 3.0 V operation, field-replaceable battery interface, programmable VPFD, and 4-SRAM decode in a compact SO16 package-making it optimal for space-constrained, multi-SRAM embedded systems requiring long-term data retention and serviceability.
Availability
M40Z300WMH6F is available at Aetrix Electronics and suitable for industrial data loggers, medical device memory backup, avionics black box recorders, and smart meter firmware retention requiring stable component supply and long-lifecycle support.
Supply support for M40Z300WMH6F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, microcontroller, power, and memory solutions for industrial, automotive, and consumer markets.
The M40Z300WMH6F belongs to ST's NVRAM supervisor product line, engineered specifically to convert standard low-power SRAMs into robust, battery-backed non-volatile memory subsystems for mission-critical data retention in harsh or unreliable power environments.
FAQ
What is the function of the THS pin on the M40Z300WMH6F?
The THS (Threshold Select) pin configures the power-fail detection voltage (VPFD) range: when tied to VSS, VPFD is 2.8 V–3.0 V; when tied to VOUT, VPFD is 2.5 V–2.7 V. This allows precise alignment with system brownout thresholds and ensures write-protection triggers before SRAM data retention fails. THS must be hard-wired to either VSS or VOUT-floating is not permitted.
Can the M40Z300WMH6F support more than four SRAMs?
Yes-two M40Z300WMH6F devices can be placed in parallel using shared A/B decoder inputs and separate E1CON–E4CON outputs to control up to eight SRAMs. Each device drives four unique CE lines, and the dual-device configuration maintains independent power-fail response and battery switchover per SRAM group.
Why must B– be isolated from VSS on the M40Z300WMH6F?
B– is the dedicated cathode connection for the external lithium battery and must not be tied to VSS to prevent parasitic discharge paths through internal protection circuitry. Connecting B– to VSS violates the absolute maximum rating for pin voltage and risks premature battery depletion, especially during backup mode when VCC is absent and internal leakage paths dominate.
How does the BL (Battery Low) pin behave during power-up versus periodic monitoring?
During power-up, BL asserts immediately if battery voltage is <2.5 V-indicating potential data integrity risk. During periodic 24-hour checks, BL assertion signals end-of-life but does not compromise data since VCC remains active. In both cases, BL is open-drain and requires a pull-up resistor to VCC; replacement must occur with VCC applied to reinitialize monitoring.
M40Z300WMH6F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 28-SOIC (0.350", 8.89mm Width) with SNAPHAT Sockets
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- Simple Reset/Power-On Reset
- Number of Voltages Monitored:
- 1
- Voltage - Threshold:
- 2.6V
- Output:
- Open Drain or Open Collector
- Reset:
- Active Low
- Reset Timeout:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-SOH
M40Z300WMH6F FAQ
1.How can I place an order for M40Z300WMH6F through Aetrix?
Please submit a Request for Quotation (RFQ) for M40Z300WMH6F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M40Z300WMH6F reliable?
The price and inventory of M40Z300WMH6F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M40Z300WMH6F is usually 5 days.
3.What payment methods are accepted for M40Z300WMH6F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M40Z300WMH6F transactions.
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4.How is shipping managed for M40Z300WMH6F?
M40Z300WMH6F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M40Z300WMH6F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M40Z300WMH6F?
For technical support, including M40Z300WMH6F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M40Z300WMH6F requirements.
6.How does Aetrix verify that M40Z300WMH6F is sourced from the original manufacturer or authorized distributors?
All M40Z300WMH6F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M40Z300WMH6F meets industry standards.
7.What is the process for return or replacement of M40Z300WMH6F?
All M40Z300WMH6F units undergo pre-shipment inspection (PSI). If there is an issue with M40Z300WMH6F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M40Z300WMH6F part is unused and in its original packaging.
Return procedure for M40Z300WMH6F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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