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STMicroelectronics M40Z300WMQ6F

Part No.:
M40Z300WMQ6F
Manufacturer:
STMicroelectronics
Category:
Supervisors
Package:
16-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixM40Z300WMQ6F.pdf
Description:
IC SUPERVISOR 1 CHANNEL 16SO
Quantity:
Payment:
Payment
Shipping:
Shipping

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Product details

Overview

M40Z300WMQ6F from STMicroelectronics is a 3.0 V to 3.6 V non-volatile SRAM supervisor IC that converts up to eight low-power SRAMs into NVRAMs using integrated power-switching and precision voltage monitoring. It features dual-threshold power-fail detection (VPFD = 2.5 V–2.7 V or 2.8 V–3.0 V), open-drain RST and BL outputs, and four conditioned chip-enable outputs (E1CON–E4CON) with ≤12 ns propagation delay. Used in industrial data loggers requiring battery-backed memory retention during brownouts.

For engineers reviewing the M40Z300WMQ6F datasheet, M40Z300WMQ6F pinout, M40Z300WMQ6F application, or M40Z300WMQ6F equivalent, this page delivers verified technical context, real-world timing behavior, battery-switchover thresholds, decoder truth table mapping, and validated alternatives for legacy NVRAM system redesigns.

Technical Context

The M40Z300WMQ6F implements a two-input A/B decoder to generate four independent conditioned chip-enable signals (E1CON–E4CON), enabling control of up to eight SRAMs when two devices operate in parallel. Its internal comparator monitors VCC against factory-trimmed VPFD thresholds selected via THS pin tied to VSS or VOUT.

During power failure, it forces E1CON–E4CON inactive within tWPT (≤10 µs), disconnects VCC from VOUT at VSO (~2.4 V), and switches to lithium battery supply (B+, B−) to maintain SRAM data retention. The RST output remains low for tREC (120 ms max) after VCC recovers above VPFD to ensure microprocessor stabilization.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 2.7 V to 3.6 V - Supports 3.3 V systems with margin for rail droop during transient load.
VPFD Threshold 2.5 V–2.7 V (THS = VOUT) or 2.8 V–3.0 V (THS = VSS) - Configurable brownout detection for write-protection activation.
Propagation Delay ≤12 ns (at 5.0 V, CL = 100 pF) - Ensures SRAM access timing compliance even with fast CE-driven cycles.
RST Pulse Width tREC ≤ 120 ms - Guarantees sufficient reset hold time for microcontroller power-rail stabilization post-recovery.
BL Detection Voltage ≈2.5 V - Triggers open-drain battery-low alert before SRAM data integrity is compromised.
Supply Current 2 mA (typ), 4 mA (max) - Enables low-quiescent operation in always-on data logger standby mode.
Operating Temp –40 °C to +85 °C (Grade 6) - Validated for industrial environments without derating.

Pinout & Package

Package: 16-lead SOIC (SO16, MQ suffix), body width 150 mils; supports direct connection to external user-supplied lithium battery via dedicated B+ and B− pins (pins 9 and 8 respectively for M40Z300W).

Pin/Terminal Circuit Role Design Meaning
1 (A) Decoder input A Selects one of four SRAM chip-enable outputs (E1CON–E4CON) per truth table logic.
2 (RST) Open-drain reset output Asserts low for ≥120 ms after VCC rises above VPFD to synchronize MCU boot sequence.
3 (B) Battery select input Enables battery monitoring circuitry; must be pulled high during normal operation.
4 (E1CON) Conditioned chip-enable output 1 Active-low signal mirroring E input during valid VCC; forced inactive during power fail.
5 (E) Chip-enable input Primary enable signal from host controller; drives all four conditioned outputs when stable.
6 (E2CON) Conditioned chip-enable output 2 Second decoded CE output; timing-matched to E1CON for synchronous SRAM control.
7 (E3CON) Conditioned chip-enable output 3 Third decoded CE output; shares same tWPT and switchover behavior as E1CON/E2CON.
8 (VSS) Ground Reference node for all digital and analog circuitry; B− must connect here only for M40Z300W.
9 (B−) Negative battery terminal Direct connection point for external Li-cell negative terminal; isolated from VSS in M40Z300W.
10 (NC) No connect Internally unconnected; must remain floating or grounded per layout guidelines.
11 (VOUT) Regulated output voltage Supplies SRAM VCC during backup; sourced from battery when VCC < VSO (~2.4 V).
12 (VCC) Main supply input Accepts 2.7–3.6 V; powers internal logic and enables battery monitoring only when nominal.
13 (M40Z300W BL) Open-drain battery-low output Asserts low when battery voltage drops below ~2.5 V; requires external pull-up to VCC.
14 (THS) Threshold select input Configures VPFD range: tie to VSS for 2.8–3.0 V, tie to VOUT for 2.5–2.7 V.
15 (E4CON) Conditioned chip-enable output 4 Fourth decoded CE output; completes full 2-to-4 decode set for quad-SRAM control.
16 (B+) Positive battery terminal Direct connection point for external Li-cell positive terminal; supplies VOUT during backup.

Key Features

Feature Design Value
Configurable VPFD selection Two discrete threshold ranges (2.5–2.7 V / 2.8–3.0 V) via single THS pin, eliminating external resistor networks.
Four conditioned CE outputs E1CON–E4CON provide synchronized, glitch-free chip-enable signals with guaranteed tWPT ≤10 µs during brownout.
Integrated battery switchover Automatic VCC-to-battery transition at VSO ≈2.4 V ensures uninterrupted SRAM VCC without external FETs or diodes.
Periodic battery health check Factory-programmed 24-hour interval monitoring detects end-of-life batteries while preserving data integrity during main power.
Reset timing guarantee RST remains asserted for tREC ≤120 ms after VCC recovery, meeting ARM Cortex-M and PIC reset hold requirements.

Applications

Industrial Data Logger Medical Device Memory Backup

Use Scenario: Continuous sensor sampling in remote environmental monitors powered by intermittent solar/battery sources.

IC Role / Device Role / Timing Role: NVRAM supervisor providing automatic SRAM write-protection and battery switchover during VCC dropout events lasting seconds to minutes.

Use Value: Prevents corruption of calibration tables and timestamped readings during brownouts; extends field deployment life by eliminating manual battery replacement cycles.

Use Scenario: Patient vital sign recorders requiring tamper-proof, long-term storage of ECG waveforms and therapy logs.

IC Role / Device Role / Timing Role: Battery-backed memory controller ensuring SRAM data retention during AC power loss or battery swap without host intervention.

Use Value: Meets IEC 62304 Class C software safety requirements by guaranteeing data integrity across power transitions and battery low warnings.

Point-of-Sale Terminal Smart Meter Firmware Storage

Use Scenario: Transaction logging in retail terminals where unexpected power loss must not erase pending sales records.

IC Role / Device Role / Timing Role: Real-time SRAM protector asserting E1CON–E4CON within 10 µs of VCC falling below VPFD to freeze memory state.

Use Value: Eliminates need for EEPROM wear-leveling algorithms; reduces firmware complexity and improves transaction commit reliability.

Use Scenario: Utility smart meters storing tariff schedules, consumption history, and firmware patches in volatile SRAM.

IC Role / Device Role / Timing Role: Dual-role supervisor managing both power-fail write-protection and periodic battery health verification every 24 hours.

Use Value: Enables 10+ year field life with single lithium cell; BL output triggers proactive meter maintenance before data loss occurs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NVRAM supervisor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MAX6900 Single-chip solution with integrated 32-kbit EEPROM; no external SRAM support; lacks multi-SRAM decode capability. Used where embedded EEPROM suffices and SRAM expansion is unnecessary; no support for 8-SRAM parallel configuration. Select when board space is constrained and data volume fits within on-chip EEPROM; not suitable for high-bandwidth SRAM buffering.
DS1230Y 5 V-only operation (4.5–5.5 V); no 3 V variant; uses external capacitor-based power-fail detection instead of precision comparator. Legacy 5 V systems only; requires larger external components for VPFD setting and lacks programmable BL threshold. Choose only for drop-in replacement in existing 5 V designs; incompatible with 3.3 V rails and fails to meet modern low-voltage brownout specs.

Compared with M40Z300WMQ6F, MAX6900 eliminates external SRAM but sacrifices scalability and speed, while DS1230Y lacks 3 V support and precision VPFD tuning-making M40Z300WMQ6F the sole option for new 3.3 V industrial NVRAM designs requiring multi-SRAM coordination and battery health telemetry.

Availability

M40Z300WMQ6F is available at Aetrix Electronics and suitable for industrial data loggers, medical device memory backup, point-of-sale terminals, and smart meter firmware storage requiring stable component supply despite its "not recommended for new design" status.

Supply support for M40Z300WMQ6F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, and analog/mixed-signal devices for industrial, automotive, and consumer markets.

M40Z300WMQ6F belongs to ST's legacy NVRAM supervisor product line, engineered specifically to convert standard LP-SRAMs into robust, battery-backed memory subsystems for mission-critical data retention in brownout-prone environments.

FAQ

What is the function of the THS pin on M40Z300WMQ6F?

The THS (Threshold Select) pin configures the power-fail detection voltage (VPFD) range: tying THS to VSS selects 2.8 V–3.0 V, while tying it to VOUT selects 2.5 V–2.7 V. This dual-threshold capability allows precise brownout response tuning without external components, matching system-level rail tolerance requirements.

Can M40Z300WMQ6F support more than four SRAMs?

Yes-by placing two M40Z300WMQ6F devices in parallel with identical A/B decoder inputs, up to eight SRAMs can be controlled. Each device drives four conditioned chip-enable outputs (E1CON–E4CON), and the two sets operate synchronously under shared E and decoder signals per Figure 5 in the datasheet.

How does the battery-low (BL) pin behave during power-up versus periodic checks?

During power-up, BL asserts immediately if battery voltage is below ~2.5 V, indicating potential data integrity risk. During the scheduled 24-hour check, BL assertion signals end-of-life but does not compromise data since VCC is present; replacement is required before next backup event to maintain retention capability.

Is the M40Z300WMQ6F compatible with 2.7 V operation?

Yes-the device is fully specified from 2.7 V to 3.6 V per Table 4 and Table 6. At 2.7 V, VPFD remains within the 2.5 V–2.7 V range (THS = VOUT), and all DC/AC parameters including ICC (max 4 mA) and VOL (0.4 V) are guaranteed across the full temperature range (–40 °C to +85 °C).

M40Z300WMQ6F Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
16-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Type:
Simple Reset/Power-On Reset
Number of Voltages Monitored:
1
Voltage - Threshold:
2.6V
Output:
Open Drain or Open Collector
Reset:
Active Low
Reset Timeout:
-
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SO

M40Z300WMQ6F FAQ

1.How can I place an order for M40Z300WMQ6F through Aetrix?

Please submit a Request for Quotation (RFQ) for M40Z300WMQ6F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for M40Z300WMQ6F reliable?

The price and inventory of M40Z300WMQ6F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M40Z300WMQ6F is usually 5 days.

3.What payment methods are accepted for M40Z300WMQ6F?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M40Z300WMQ6F transactions.

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4.How is shipping managed for M40Z300WMQ6F?

M40Z300WMQ6F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your M40Z300WMQ6F order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M40Z300WMQ6F?

For technical support, including M40Z300WMQ6F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M40Z300WMQ6F requirements.

6.How does Aetrix verify that M40Z300WMQ6F is sourced from the original manufacturer or authorized distributors?

All M40Z300WMQ6F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M40Z300WMQ6F meets industry standards.

7.What is the process for return or replacement of M40Z300WMQ6F?

All M40Z300WMQ6F units undergo pre-shipment inspection (PSI). If there is an issue with M40Z300WMQ6F, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M40Z300WMQ6F part is unused and in its original packaging.

Return procedure for M40Z300WMQ6F:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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