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STMicroelectronics M58LW032D110N6
- Part No.:
- M58LW032D110N6
- Manufacturer:
- STMicroelectronics
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
M58LW032D110N6.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,643
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Product details
Overview
M58LW032D110N6 from STMicroelectronics is a 32 Mbit (4Mb x8 / 2Mb x16) uniform-block NOR Flash memory with single 2.7–3.6V supply, 110ns random read access, 16-word write buffer, and 100,000 program/erase cycles per block. It operates in TSOP56 package and supports CFI-compliant command interface for embedded boot code and firmware storage in industrial controllers.
For engineers reviewing the M58LW032D110N6 datasheet, M58LW032D110N6 pinout, M58LW032D110N6 application, or M58LW032D110N6 equivalent, key selection criteria include uniform 64KWord block architecture, VPEN-controlled erase/program enable, dual-mode STS (Ready/Busy or interrupt), byte/word organization select (BYTE), and CFI query support for host auto-configuration.
Technical Context
This device implements a JEDEC-standard Common Flash Interface (CFI) with on-chip Program/Erase Controller that automates timing-critical sequences for word programming, block erasure, suspend/resume, and status reporting. It uses asynchronous parallel bus protocol with three chip enables (E0/E1/E2) and supports both x8 and x16 data bus configurations via BYTE pin control.
The memory array is partitioned into 32 independent 1Mbit (128KByte) uniform blocks, each individually protectable via hardware lock bits and user-programmable 128-bit protection register. Erase and program operations are initiated by command sequences written to DQ lines, with completion signaled via Status Register (SR) bits or open-drain STS output in configurable Ready/Busy or pulse-interrupt mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (4Mb x8 or 2Mb x16 configuration) |
| Supply Voltage | 2.7–3.6V VDD/VDDQ - enables single-rail operation in 3V systems without level shifters |
| Random Read Access | 110ns - determines minimum instruction fetch latency in boot ROM applications |
| Write Buffer Size | 16 words - reduces average programming time per word to 12µs and frees CPU during multi-word writes |
| Block Erase Endurance | 100,000 cycles per block - supports field-upgradable firmware with long-term reliability |
| Block Architecture | 32 uniform 64KWord blocks - simplifies wear leveling and avoids partial-block fragmentation |
| Security Features | Hardware block protection + 128-bit OTP protection register - prevents unauthorized firmware overwrite or cloning |
Pinout & Package
Package: TSOP56 (14 × 20 mm, lead-free compliant). Pin functions validated per STMicroelectronics datasheet Rev 1 (August 2004), Figures 3 and 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | A0 used only in x8 mode for byte selection; A1–A21 define 22-bit address space (up to 4MB) |
| DQ0–DQ15 | Data I/O Bus | Bidirectional: carries commands, status, or data; latched on WE↑ or CE edge per JEDEC standard |
| E0, E1, E2 | Chip Enables | Three independent CE inputs allow bank decoding or hierarchical memory mapping in complex systems |
| G | Output Enable | Controls data bus tristate; required for read operations but not for command writes |
| W | Write Enable | Latches address/data on rising edge; primary control for command and data strobing |
| VPEN | Program/Erase Enable | Hardware gate: low = all program/erase disabled - critical for safety-critical firmware updates |
| STS | Status Output | Open-drain signal configurable as static Ready/Busy or pulsing end-of-operation interrupt |
| BYTE | Bus Width Select | High = x16 mode (A1 LSB); Low = x8 mode (A0 active) - enables flexible host interface design |
| RP | Reset/Power-Down | Active-low input: resets internal state or enters low-power mode (Auto Low Power active during idle reads) |
| VDD, VDDQ | Power Supplies | VDD = core logic; VDDQ = I/O drivers - separate rails reduce noise coupling in high-speed reads |
| VSS, VSSQ | GND Returns | Separate analog/digital ground pins minimize switching noise on data bus during fast transitions |
Key Features
| Feature | Design Value |
|---|---|
| CFI Compliance | JEDEC JESD68-defined query structure enables automatic host detection of geometry, timing, and command set |
| Program/Erase Suspend | Allows read or program in another block during ongoing erase/program - essential for real-time firmware patching |
| Uniform Block Architecture | All 32 blocks are identical 64KWord size - eliminates need for complex block management logic in bootloader |
| 128-bit Protection Register | 64-bit factory-unique ID + 64-bit user-programmable segment with lock capability - supports secure device binding |
| Auto Low Power Mode | Enters reduced-current state automatically during read bus inactivity - cuts standby power in battery-backed systems |
Applications
| Industrial PLC Firmware Storage | Automotive Body Control Module (BCM) |
|---|---|
|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers with field service requirements. IC Role / Device Role / Timing Role: Non-volatile boot memory holding executable code and configuration tables; accessed at power-on reset and during OTA update cycles. Use Value: Uniform 64KWord blocks simplify firmware partitioning; 100k-cycle endurance supports >10 years of scheduled updates; VPEN hardware lock prevents accidental corruption during brown-out conditions. |
Use Scenario: Holding calibrated sensor parameters and actuator control maps in automotive BCMs requiring ASIL-B compliance. IC Role / Device Role / Timing Role: CFI-compliant NOR Flash providing deterministic read latency (<110ns) for real-time calibration lookup during engine start-up. Use Value: Dual-mode STS output delivers interrupt-driven completion signaling for time-critical flash updates; 128-bit protection register enables VIN-based firmware binding. |
| Medical Diagnostic Equipment Boot ROM | Networking Equipment Configuration Storage |
|
Use Scenario: Secure boot image storage in FDA-cleared diagnostic imaging devices where firmware integrity is auditable. IC Role / Device Role / Timing Role: Primary boot memory mapped at reset vector; verified via hardware block protection and CFI signature before execution. Use Value: Hardware-enforced block protection ensures boot sector remains immutable unless VPEN is asserted; 32 independent blocks allow segregated storage of bootloader, OS, and application images. |
Use Scenario: Storing switch/router configuration profiles and firmware patches in carrier-grade Ethernet equipment. IC Role / Device Role / Timing Role: Parallel-interface Flash supporting fast page reads (90ns/25ns) for rapid configuration reload after failover events. Use Value: 16-word write buffer accelerates config save operations; suspend/resume capability allows background firmware validation while maintaining packet forwarding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL032N11TFI010 | 48-pin TSOP, 110ns read, 3V-only, no VPEN pin, CFI v1.3 | Lacks hardware program/erase gate; relies on software lock bits only | Select when VPEN hardware gating is unnecessary and CFI v1.3 compatibility suffices |
| MX29LV320EBTI-11G | 48-pin TSOP, 110ns read, 2.7–3.6V, no write buffer, 100k cycles | No 16-word buffer; slower effective programming; no suspend/resume capability | Select for cost-sensitive designs where firmware update concurrency is not required |
Compared with M58LW032D110N6, S29GL032N11TFI010 omits VPEN-based hardware security but offers broader CFI version support, while MX29LV320EBTI-11G sacrifices write buffer and suspend features for lower unit cost-making M58LW032D110N6 optimal for safety-critical, field-upgradable systems requiring deterministic control over erase/program activation.
Availability
M58LW032D110N6 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive BCM calibration map retention, and medical diagnostic boot ROM applications requiring stable component supply across extended product lifecycles.
Supply support for M58LW032D110N6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in microcontrollers, power management, and non-volatile memory for industrial, automotive, and consumer applications.
The M58LW032D belongs to ST's legacy parallel NOR Flash product line, designed specifically for reliable, high-integrity firmware and boot code storage in resource-constrained embedded systems with deterministic timing requirements.
FAQ
What is the function of the VPEN pin on M58LW032D110N6?
The VPEN (Program/Erase Enable) pin is an active-high hardware gate that must be driven high to permit any program or erase operation. When VPEN is low, all such operations are blocked regardless of command sequence - a critical safety feature preventing unintended firmware corruption during power transients or software faults.
How does the STS pin operate in Ready/Busy vs. Status mode?
The STS pin is configurable via Command Interface: in Ready/Busy mode, it outputs a static low signal during active program/erase and high otherwise; in Status mode, it pulses low for 50ns at completion of each operation, serving as a hardware interrupt to notify the host CPU without polling - reducing firmware overhead in real-time systems.
Can M58LW032D110N6 be used in x8 and x16 bus configurations on the same PCB layout?
Yes - the BYTE pin selects bus width: logic high configures x16 mode (A1 as LSB, DQ0–DQ15 active), logic low enables x8 mode (A0 as LSB, DQ0–DQ7 active). This allows single PCB design to support either microcontroller interface, provided address/data routing accommodates both modes and unused DQ lines are properly terminated.
What is the purpose of the 128-bit Protection Register?
The 128-bit Protection Register consists of two 64-bit segments: the first contains a factory-programmed unique device identifier (e.g., for secure provisioning), and the second is user-programmable for custom keys or flags. The user segment can be permanently locked, enabling cryptographic binding of firmware to specific hardware units without external secure elements.
M58LW032D110N6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP (14x20)
M58LW032D110N6 FAQ
1.How can I place an order for M58LW032D110N6 through Aetrix?
Please submit a Request for Quotation (RFQ) for M58LW032D110N6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M58LW032D110N6 reliable?
The price and inventory of M58LW032D110N6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M58LW032D110N6 is usually 5 days.
3.What payment methods are accepted for M58LW032D110N6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M58LW032D110N6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M58LW032D110N6?
M58LW032D110N6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M58LW032D110N6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M58LW032D110N6?
For technical support, including M58LW032D110N6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M58LW032D110N6 requirements.
6.How does Aetrix verify that M58LW032D110N6 is sourced from the original manufacturer or authorized distributors?
All M58LW032D110N6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M58LW032D110N6 meets industry standards.
7.What is the process for return or replacement of M58LW032D110N6?
All M58LW032D110N6 units undergo pre-shipment inspection (PSI). If there is an issue with M58LW032D110N6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M58LW032D110N6 part is unused and in its original packaging.
Return procedure for M58LW032D110N6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M58LW032D110N6 Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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