STMicroelectronics M58LW032D110ZA6
- Part No.:
- M58LW032D110ZA6
- Manufacturer:
- STMicroelectronics
- Category:
- Memory
- Package:
- 64-TBGA
- Datasheet:
-
M58LW032D110ZA6.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 64TBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,761
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Product details
Overview
M58LW032D110ZA6 from STMicroelectronics is a 32 Mbit (4Mb × 8 / 2Mb × 16) uniform-block NOR Flash memory with 2.7–3.6 V single-supply operation, 110 ns random read access, 16-word write buffer, and 100,000 program/erase cycles per block. It implements JEDEC-standard command interface and CFI compliance for embedded firmware storage in industrial controllers and telecom baseband modules.
For engineers reviewing the M58LW032D110ZA6 datasheet, M58LW032D110ZA6 pinout, M58LW032D110ZA6 application, or M58LW032D110ZA6 equivalent, key selection criteria include uniform 64 KWord block architecture, VPEN-controlled erase/program enable, dual-mode STS (Ready/Busy or interrupt), byte/word organization select (BYTE), and TBGA64 lead-free package compatibility with automated SMT assembly.
Technical Context
This device uses an on-chip Program/Erase Controller to execute JEDEC-compliant commands-including Block Erase, Word/Byte Program, Write Buffer Load, and Protection Register programming-without external timing control. All operations are managed via command sequences written to DQ lines under enabled chip select (E0–E2) and write enable (W) conditions.
It supports suspend/resume for both program and erase operations, enabling concurrent background erase with foreground read in another block. The 128-bit Protection Register includes factory-programmed 64-bit unique ID and user-programmable 64-bit segment with OTP-level protection, enabling secure boot code locking and field firmware authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mbit (4Mb × 8 or 2Mb × 16 configuration) |
| Supply Voltage | 2.7–3.6 V VDD/VDDQ - enables single-rail power design without level shifters |
| Random Read Access | 110 ns - determines minimum instruction fetch latency in microcontroller boot ROM applications |
| Write Buffer Size | 16 words - reduces average programming time to 12 µs/word and frees CPU during multi-word writes |
| Block Architecture | 32 uniform 64 KWord (128 KByte) blocks - allows deterministic wear leveling and partial firmware updates |
| Endurance | 100,000 program/erase cycles per block - supports field-upgradable firmware with >10-year service life at 27 cycles/day |
| Security Features | VPEN pin gating + block-level protection + 128-bit OTP protection register - prevents unauthorized reprogramming and cloning |
Pinout & Package
TBGA64 (10 × 13 mm, 1 mm pitch, 8 × 8 ball array) package compliant with JEDEC J-STD-020B and RoHS. Lead-free finish suitable for Pb-free reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | A0 used only in x8 mode for byte selection; A1–A21 define 22-bit address space (up to 4 MB) |
| DQ0–DQ15 | Data I/O | Bidirectional bus carrying commands, status, or data; latched on W↑ or CE edge |
| E0, E1, E2 | Chip Enables | Three independent CE inputs supporting multi-chip addressing and hierarchical memory decoding |
| G | Output Enable | Controls output drivers during read; high-Z when deasserted to prevent bus contention |
| W | Write Enable | Latches address/data on rising edge; initiates command execution when CE and BYTE are valid |
| BYTE | Bus Width Select | High = x16 mode (A1 LSB); Low = x8 mode (A0 LSB) - configures data path width at power-up |
| VPEN | Program/Erase Enable | Hardware gate: low = all program/erase commands ignored - critical for secure boot lockdown |
| STS | Status Output | Open-drain signal configurable as Ready/Busy (static) or interrupt pulse (edge-triggered end-of-operation) |
| RP | Reset/Power-Down | Pull-low resets internal state; hold low enters ultra-low-power mode (IPD ≤ 1 µA) |
| VDD / VDDQ | Core & I/O Supplies | Separate 2.7–3.6 V supplies allow independent noise filtering and voltage scaling for core vs. interface |
| VSS / VSSQ | Core & I/O Grounds | Split ground planes reduce switching noise coupling into sensitive analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Uniform Block Architecture | 32 identical 128 KByte blocks enable predictable erase scheduling and simplified FTL mapping |
| Command Interface Compliance | JEDEC JESD68 and Common Flash Interface (CFI) v1.3 - ensures interoperability with standard flash drivers and BIOS implementations |
| Program/Erase Suspend | Interruptible erase (to read/program other blocks) and interruptible program (to read other blocks) - enables real-time system responsiveness |
| Auto Low Power Mode | Enters sub-1 µA standby automatically after bus inactivity during read - reduces idle power in battery-backed systems |
| Protection Register Security | Factory-unique 64-bit ID + user-writable 64-bit OTP segment with lock bits - supports cryptographic key binding and anti-counterfeiting |
Applications
| Industrial PLC Firmware Storage | Telecom Baseband Code Memory |
|---|---|
Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers deployed in factory automation environments with wide temperature ranges and EMI exposure. IC Role / Device Role / Timing Role: Non-volatile boot ROM and runtime parameter store; accessed via parallel bus during cold start and field update cycles. Use Value: Uniform 128 KByte blocks allow atomic firmware patching without full image reload; 100K-cycle endurance supports >15 years of scheduled updates. | Use Scenario: Holding DSP firmware and calibration tables in 3G/4G baseband processors where rapid code loading and secure update verification are required. IC Role / Device Role / Timing Role: X16-configured instruction memory mapped into ARM9 or DSP address space; accessed with 110 ns read latency for deterministic boot timing. Use Value: VPEN-gated erase/program prevents accidental corruption during power transients; CFI query enables automatic driver initialization. |
| Medical Diagnostic Equipment Boot ROM | Automotive Infotainment System Flash |
Use Scenario: Secure boot loader storage in FDA-cleared imaging devices requiring traceable firmware integrity and tamper-resistant update mechanisms. IC Role / Device Role / Timing Role: Primary boot ROM with hardware-enforced protection register lock; verified at power-on reset before loading application code. Use Value: 128-bit OTP protection register binds firmware signature to unique device ID, satisfying IEC 62304 security requirements. | Use Scenario: Storing navigation map data and UI assets in automotive head units operating across -40°C to +105°C ambient with vibration and thermal cycling. IC Role / Device Role / Timing Role: Parallel-connected x8 flash providing burst-read capability for graphics asset streaming; TBGA64 package withstands mechanical shock. Use Value: Auto Low Power mode cuts quiescent current during display sleep states; lead-free TBGA meets AEC-Q200 stress test requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL032N11TFI010 | 48-pin TSOP package; 90 ns read; no VPEN pin; uses RESET# instead of RP for power-down | Lacks hardware-program-erase gating; requires software-based block lock management | Select when VPEN hardware disable is not required and TSOP footprint is preferred |
| MX29LV320ETXBI-90G | 48-pin TSOP; 90 ns read; 3 V-only supply (no 2.7 V min); lacks CFI support and write buffer | No standardized query interface; slower sequential programming due to no buffer | Select for cost-sensitive legacy designs where CFI and suspend features are unused |
Compared with S29GL032N11TFI010 and MX29LV320ETXBI-90G, M58LW032D110ZA6 uniquely combines VPEN hardware gating, CFI compliance, and 16-word write buffer in a compact TBGA64 package-making it optimal for new designs requiring secure, high-throughput firmware storage with minimal board area.
Availability
M58LW032D110ZA6 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom baseband code memory, medical diagnostic equipment boot ROM, and automotive infotainment system flash requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for M58LW032D110ZA6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, memories, power ICs, and sensors for industrial, automotive, and consumer markets.
The M58LW032D belongs to ST's legacy parallel NOR Flash product line, engineered specifically for reliable, secure, and high-speed firmware storage in resource-constrained embedded systems requiring deterministic timing and long-term data retention.
FAQ
What is the function of the BYTE pin on M58LW032D110ZA6?
The BYTE pin selects between x8 and x16 data bus configurations: logic high enables x16 mode (A1 is LSB), while logic low enables x8 mode (A0 is LSB). This setting is sampled at power-up and determines how the 32 Mbit array is organized-either as 4 Mb × 8 or 2 Mb × 16-impacting address decoding and software driver initialization.
How does the VPEN pin enhance security in M58LW032D110ZA6?
VPEN is a hardware-enable input that must be driven high to permit any program or erase operation. When held low, all such commands are ignored-even if correctly sequenced-preventing accidental or malicious firmware modification during power transitions or system faults. This provides a physical layer of protection complementary to block-level software locks.
Can M58LW032D110ZA6 operate with VDD and VDDQ at different voltages?
No. Per datasheet Section "VDD Supply Voltage" and "VDDQ Supply Voltage", both VDD and VDDQ must be supplied within the same 2.7–3.6 V range and are internally monitored for tracking. Applying different voltages violates absolute maximum ratings and may cause undefined behavior or latch-up due to internal level-shifter biasing constraints.
What is the purpose of the STS pin's dual-mode configuration?
The STS pin can be configured via the Configure STS command as either Ready/Busy (static high/low indicating P/E controller state) or Status (pulse output signaling completion of program/erase). In Status mode, it serves as a hardware interrupt to offload polling overhead from the host CPU-critical for real-time systems where deterministic response latency is required.
M58LW032D110ZA6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 64-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-TBGA (10x13)
M58LW032D110ZA6 FAQ
1.How can I place an order for M58LW032D110ZA6 through Aetrix?
Please submit a Request for Quotation (RFQ) for M58LW032D110ZA6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M58LW032D110ZA6 reliable?
The price and inventory of M58LW032D110ZA6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M58LW032D110ZA6 is usually 5 days.
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Once your M58LW032D110ZA6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M58LW032D110ZA6?
For technical support, including M58LW032D110ZA6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M58LW032D110ZA6 requirements.
6.How does Aetrix verify that M58LW032D110ZA6 is sourced from the original manufacturer or authorized distributors?
All M58LW032D110ZA6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M58LW032D110ZA6 meets industry standards.
7.What is the process for return or replacement of M58LW032D110ZA6?
All M58LW032D110ZA6 units undergo pre-shipment inspection (PSI). If there is an issue with M58LW032D110ZA6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M58LW032D110ZA6 part is unused and in its original packaging.
Return procedure for M58LW032D110ZA6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M58LW032D110ZA6 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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