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Renesas M5M51008DVP-55H#BT

Part No.:
M5M51008DVP-55H#BT
Manufacturer:
Renesas
Category:
Memory
Package:
32-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixM5M51008DVP-55H#BT.pdf
Description:
IC SRAM 1MBIT PARALLEL 32TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,512

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Product details

Overview

M5M51008DVP-55H#BT from Renesas Technology Corp. is a 1048576-bit (131072 × 8) CMOS static RAM in 32-pin TSOP-II (8 × 20 mm) package, featuring 55 ns access time, 15 mA active current, 20 µA standby current at 1 MHz, TTL-compatible I/O, and battery-backed data retention down to +2 V - deployed in embedded control modules requiring nonvolatile memory expansion with low-power hold capability.

For engineers reviewing the M5M51008DVP-55H#BT datasheet, M5M51008DVP-55H#BT pinout, M5M51008DVP-55H#BT application, or M5M51008DVP-55H#BT equivalent, key selection criteria include access timing under 55 ns, dual chip-select logic (S1/S2), three-state outputs with OR-tie support, and verified +2 V data retention during power-down - all critical for legacy industrial controller memory upgrades and battery-buffered data logging systems.

Technical Context

This SRAM implements a 21-bit address bus (A0–A16) supporting 131072-word addressing, with dual active-low chip select inputs (S1, S2) enabling hierarchical memory banking and seamless expansion without external decoding logic. Its write control uses W (write enable) in conjunction with S1/S2 to define three distinct operational modes: read, write, and high-impedance non-selection.

The device employs TFT load cells and quadruple-polysilicon/double-metal CMOS process technology to achieve low leakage and stable data hold at reduced VCC. Power-down operation is triggered by asserting S1 high or S2 low while maintaining VCC ≥ 2.2 V, reducing ICC to ≤10 µA and preserving contents at +2 V supply - confirmed per DC electrical specs and power-down timing diagrams.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization131072 words × 8 bits = 1048576 bits; supports byte-wide data interface with common I/O pins DQ1–DQ8
Access Time (max)55 ns at VCC = 5 V ±10%, Ta = 0–70°C; determines minimum read cycle time in synchronous bus designs
Active Supply Current15 mA at 1 MHz; defines thermal budget and regulator sizing for continuous read/write operation
Standby Current20 µA at 1 MHz; enables >1-year battery backup using CR2032 when VCC drops to +2 V
Data Retention Voltage+2.0 V minimum; validated for full data hold during brown-out or controlled power-down sequences
Input CompatibilityTTL-compatible inputs (VIL ≤ 0.8 V, VIH ≥ 2.4 V); eliminates level-shifter requirements in 5 V microcontroller systems
Output DriveThree-state CMOS outputs with OR-tie capability; allows direct bus connection of multiple devices without contention

Pinout & Package

Package: 32-pin Thin Small Outline Package (TSOP-II), 8 mm × 20 mm body, lead pitch 0.5 mm, normal lead bend (VP variant). Compliant with JEDEC MO-141AC outline 32P3H-E.

Pin/Terminal Circuit Role Design Meaning
A0–A16Address Inputs21-bit address bus; A16 is MSB; all inputs TTL-compatible; no internal latching
DQ1–DQ8Bi-directional Data I/OCommon data bus; high-impedance when OE = high or chip deselected via S1/S2
S1, S2Chip Select InputsActive-low dual CS; S1=L & S2=H enables read/write; either high/low disables chip and forces standby
WWrite Enable InputActive-low write strobe; write occurs on trailing edge of W when S1=L & S2=H
OEOutput Enable InputActive-low output control; overrides S1/S2 to force high-Z state and prevent bus contention
VCCPower Supply+5 V ±10% supply; supports data hold down to +2.0 V in power-down mode
GNDGround ReferenceSignal and power ground; decoupling capacitor required within 10 mm of pin
NCNo ConnectionPins 1 and 32 are unconnected; must remain floating - not tied to VCC or GND

Key Features

Feature Design Value
Dual Chip Select Logic (S1/S2)Enables hierarchical memory mapping and bank switching without external decode logic - reduces PCB gate count and routing complexity
+2 V Data RetentionValidated operation at VCC = +2.0 V in non-selected mode; supports battery-backed real-time clock and configuration storage
Three-State Outputs with OR-TieAllows parallel connection of multiple SRAMs on shared data bus; eliminates need for external bus transceivers
55 ns Access with TTL CompatibilityMeets timing requirements of legacy 8/16-bit microcontrollers (e.g., Z80, 80C88, 68000) without wait-state insertion
Low Standby Current (20 µA)Reduces quiescent power in always-on subsystems such as industrial HMI front-ends and sensor concentrators

Applications

Industrial PLC Memory Expansion Medical Device Data Logger

Use Scenario: Adding local program/data storage to programmable logic controllers with limited onboard RAM.

IC Role / Device Role / Timing Role: Byte-wide static RAM providing fast, deterministic read/write access for ladder logic execution buffers and I/O image tables.

Use Value: 55 ns access ensures zero-wait-state operation with 8-MHz Z80-based CPU cores; dual CS supports modular rack expansion up to 4 MB.

Use Scenario: Buffering patient vital sign samples during intermittent wireless transmission in portable ECG monitors.

IC Role / Device Role / Timing Role: Battery-backed SRAM holding 30 seconds of 12-bit waveform data during RF sleep cycles.

Use Value: Verified +2 V data retention enables CR2032 coin-cell backup for >2 years; 20 µA standby draws <1 µAh/hour.

Automotive Body Control Module Legacy Test Equipment Firmware Cache

Use Scenario: Storing calibration parameters and fault codes in nonvolatile memory within automotive BCMs lacking EEPROM.

IC Role / Device Role / Timing Role: External SRAM used with microcontroller's external memory interface for NV parameter storage with software-controlled power-down.

Use Value: Dual CS (S1/S2) allows isolation during CAN message processing; +2 V hold prevents data loss during ignition cycling.

Use Scenario: Caching FPGA configuration bitstreams and instrument firmware in aging automated test equipment.

IC Role / Device Role / Timing Role: High-reliability SRAM serving as boot-time instruction cache for 8051-based controller subsystems.

Use Value: TSOP-II package supports rework-friendly surface-mount assembly; 55 ns timing matches legacy 12-MHz bus clocks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV10248AL-10TLI10 ns faster access (45 ns), 3.3 V only, 32-pin TSOP-I; no +2 V hold capabilityRequires 3.3 V system redesign; unsuitable for battery-backup use casesSelect only if migrating to modern 3.3 V architecture with tighter timing budgets
AS6C1008-55PCNSame 55 ns speed and 5 V operation; 32-pin SOP (not TSOP); higher standby current (50 µA)Larger footprint; less suitable for space-constrained PCBs; no verified +2 V hold specPrefer for through-hole prototyping or where TSOP reflow is unavailable

Compared with IS61LV10248AL-10TLI and AS6C1008-55PCN, the M5M51008DVP-55H#BT uniquely combines 5 V operation, 55 ns timing, TSOP-II packaging, and guaranteed +2 V data retention - making it irreplaceable in legacy 5 V industrial and medical systems requiring battery-backed memory integrity.

Availability

M5M51008DVP-55H#BT is available at Aetrix Electronics and suitable for industrial PLC memory expansion, portable medical data loggers, and automotive body control modules requiring stable component supply across long-lifecycle production programs.

Supply support for M5M51008DVP-55H#BT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Technology Corp. was formed in 2003 through the merger of Hitachi and Mitsubishi Electric's semiconductor operations, specializing in microcontrollers, analog, logic, and memory solutions for industrial and automotive markets.

The M5M51008D series belongs to Renesas' legacy CMOS SRAM product line, designed specifically for 5 V embedded systems needing reliable, low-power, pin-compatible memory upgrades with battery backup capability.

FAQ

What is the minimum operating voltage for data retention in M5M51008DVP-55H#BT?

The M5M51008DVP-55H#BT guarantees full data retention at +2.0 V supply when placed in standby mode (S1 high or S2 low). This is validated per DC electrical characteristics and power-down timing specs in the original Mitsubishi datasheet Ver. 1.1. Operation below +2.0 V risks data loss; the device is not rated for sub-2 V hold. M5M51008DVP-55H#BT achieves this via optimized TFT load cell design and low-leakage CMOS process.

Does M5M51008DVP-55H#BT support true 5 V TTL compatibility on all inputs and outputs?

Yes, M5M51008DVP-55H#BT features fully TTL-compatible inputs (VIL ≤ 0.8 V, VIH ≥ 2.4 V) and outputs (VOH ≥ 2.4 V at IOH = –1.0 mA, VOL ≤ 0.4 V at IOL = 2 mA), eliminating level shifters in 5 V systems. This is explicitly confirmed in the DC Electrical Characteristics table for Ta = 0–70°C and VCC = 5 V ±10%. M5M51008DVP-55H#BT maintains these levels across its full industrial temperature range.

How does the dual chip select (S1/S2) logic function in M5M51008DVP-55H#BT?

In M5M51008DVP-55H#BT, the device activates only when S1 = L and S2 = H; any other combination (S1 = H, S2 = L, or both high/both low) places the SRAM in high-impedance standby mode with ICC ≤ 20 µA. This enables hierarchical memory banking - e.g., S2 selects a memory bank, S1 selects a device within it. The function table and timing diagrams confirm that S1/S2 control both access and power state. M5M51008DVP-55H#BT requires no external decoding logic for multi-chip configurations.

What is the maximum clock frequency supported for continuous read/write cycling with M5M51008DVP-55H#BT?

M5M51008DVP-55H#BT does not use a clock input; it is an asynchronous SRAM. Its maximum effective throughput is governed by access time (55 ns) and cycle time (tCR = 70 ns for -55H grade). At 5 V, sustained random read/write rates up to ~14.3 MHz are achievable (1 / 70 ns). The 1 MHz reference in standby current specs reflects test condition, not operational limit. M5M51008DVP-55H#BT performance is constrained only by board-level signal integrity and timing margins.

Is M5M51008DVP-55H#BT RoHS compliant and lead-free?

M5M51008DVP-55H#BT is a pre-RoHS-era device manufactured prior to 2003 under Mitsubishi Electric specifications; it contains lead in solder terminations and die attach. Renesas does not list this part as RoHS-compliant in current databases. For new designs requiring RoHS compliance, consider modern alternatives like ISSI IS61LV10248AL. M5M51008DVP-55H#BT remains available for legacy repair and long-lifecycle industrial programs where exemptions apply.

M5M51008DVP-55H#BT Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
32-TFSOP (0.724", 18.40mm Width)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM
Memory Size:
1Mbit
Memory Organization:
128K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
55ns
Access Time:
55 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-TSOP

M5M51008DVP-55H#BT FAQ

1.How can I place an order for M5M51008DVP-55H#BT through Aetrix?

Please submit a Request for Quotation (RFQ) for M5M51008DVP-55H#BT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for M5M51008DVP-55H#BT reliable?

The price and inventory of M5M51008DVP-55H#BT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M5M51008DVP-55H#BT is usually 5 days.

3.What payment methods are accepted for M5M51008DVP-55H#BT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M5M51008DVP-55H#BT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for M5M51008DVP-55H#BT?

M5M51008DVP-55H#BT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your M5M51008DVP-55H#BT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M5M51008DVP-55H#BT?

For technical support, including M5M51008DVP-55H#BT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M5M51008DVP-55H#BT requirements.

6.How does Aetrix verify that M5M51008DVP-55H#BT is sourced from the original manufacturer or authorized distributors?

All M5M51008DVP-55H#BT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M5M51008DVP-55H#BT meets industry standards.

7.What is the process for return or replacement of M5M51008DVP-55H#BT?

All M5M51008DVP-55H#BT units undergo pre-shipment inspection (PSI). If there is an issue with M5M51008DVP-55H#BT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M5M51008DVP-55H#BT part is unused and in its original packaging.

Return procedure for M5M51008DVP-55H#BT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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