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Renesas M5M51008DVP-55HIBT

Part No.:
M5M51008DVP-55HIBT
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixM5M51008DVP-55HIBT.pdf
Description:
SRAM CHIP ASYNC SINGLE 5V 1M-BIT
Quantity:
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Inventory:3,215

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Product details

Overview

M5M51008DVP-55HIBT from Renesas Technology Corp. is a 1048576-bit (131072 × 8) CMOS static RAM in a 32-pin TSOP-I package, featuring 55 ns access time, 15 mA active current, and 20 µA standby current at 1 MHz. It supports TTL-compatible I/O, three-state outputs with OR-tie capability, and data retention down to +2 V for battery-backup systems in embedded controllers and industrial instrumentation.

For engineers reviewing the M5M51008DVP-55HIBT datasheet, M5M51008DVP-55HIBT pinout, M5M51008DVP-55HIBT application, or M5M51008DVP-55HIBT equivalent, key selection criteria include its dual chip-select architecture (S1/S2), write-control flexibility (W or S1/S2 modes), low-voltage hold capability, and TSOP-I footprint compatibility with legacy Mitsubishi/Renesas SRAM designs.

Technical Context

The M5M51008DVP-55HIBT implements a 131072-word × 8-bit memory array organized into 512 rows × 128 columns × 16 blocks, fabricated using quadruple-polysilicon/double-metal CMOS technology with TFT load cells. Its control logic uses two independent chip-select inputs (S1, S2) and a write-enable input (W) to define read, write, and high-impedance states via combinational decoding.

It supports three distinct power-down modes: non-selection (S1=H or S2=L), S1-controlled power-down (S1=H, S2≥VCC–0.2 V), and S2-controlled power-down (S2=L, S1≤0.2 V), enabling selective memory bank isolation and sub-10 µA hold current at VCC = 2.2 V. Output enable (OE) provides bus contention prevention independent of S1/S2 state.

Key Specifications

ParameterValue and Actual Design Meaning
Memory size1048576-bit (131072 words × 8 bits); supports byte-wide data interface without external multiplexing.
Access time55 ns max at VCC = 5 V ±10%, Ta = 0–70°C; enables direct interfacing with 12–15 MHz microcontrollers.
Active current15 mA max at 1 MHz; compatible with low-power embedded systems requiring sustained read/write bursts.
Standby current20 µA max at 1 MHz; allows >1-year battery backup with typical coin-cell sources (e.g., CR2032).
Data retention voltage+2.0 V minimum; guarantees nonvolatile data hold during brown-out or controlled power-down sequences.
I/O compatibilityTTL-level inputs and outputs; eliminates level-shifter requirements when interfacing with legacy 5 V logic families.
Control interfaceDual chip-select (S1/S2) + write (W) + output-enable (OE); enables memory expansion up to 16 banks without address decoding logic.

Pinout & Package

Package: 32-pin Thin Small Outline Package (TSOP-I), 8 mm × 20 mm, lead pitch 0.5 mm, normal lead bend (Type VP). Compliant with JEDEC MO-153.

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address inputs17-bit address bus supporting full 131072-word addressing; A16 is MSB, no external decoding needed.
DQ1–DQ8Bi-directional data I/OCommon data bus with three-state outputs; supports OR-tie for shared bus architectures.
S1, S2Chip select inputsIndependent enables: S1=L & S2=H activates chip; either high S1 or low S2 forces high-Z and reduces ICC to standby level.
WWrite controlActive-low write strobe; latches data on falling edge synchronized with S1/S2; supports W-only or S1/S2-gated write modes.
OEOutput enableDirect control of output drivers; high = high-impedance regardless of S1/S2/W state, preventing bus contention.
VCC, GNDPower supplySingle 5 V ±10% supply; decoupling required per JEDEC TSOP layout guidelines (e.g., 100 nF near pin 16).
NCNo connectionPins 1 and 32 are unconnected; must remain floating-no tie-to-rail or pull-up/down required.

Key Features

FeatureDesign Value
Dual chip-select architectureEnables hierarchical memory mapping: S1 selects major bank, S2 selects sub-bank-reducing external decode logic by 2–3 gates.
2 V data retentionPermits use with lithium coin-cell backup (e.g., BR2032) without regulator; holds valid data during AC power loss for ≥10 years at 25°C.
Three-state OR-tie outputsAllows multiple M5M51008DVP-55HIBT devices to share a single 8-bit data bus without external bus transceivers.
Write-cycle flexibilitySupports W-controlled, S1-controlled, and S2-controlled write initiation-enabling timing optimization across diverse MCU bus protocols.
TTL-compatible I/OEliminates level translation when interfacing with 8051, Z80, or legacy FPGA I/O banks operating at 5 V.

Applications

Industrial PLC Data BufferMedical Device Parameter Storage

Use Scenario: Storing real-time sensor calibration tables and runtime configuration in programmable logic controllers with intermittent power.

IC Role / Device Role / Timing Role: Nonvolatile SRAM buffer holding critical operational parameters during mains failure and recovery cycles.

Use Value: Maintains system state integrity with ≤2 V hold voltage and <20 µA standby draw-extending supercapacitor hold-up time by 3× versus standard 5 V SRAMs.

Use Scenario: Retaining patient-specific therapy settings and device logs in portable infusion pumps and ECG monitors.

IC Role / Device Role / Timing Role: Battery-backed memory for FDA-required audit trails and configuration persistence across power cycles.

Use Value: Guarantees data retention at +2.0 V for >10 years at 25°C-meeting IEC 62304 Class B software safety requirements without external voltage supervisors.

Automotive Body Control ModuleTest Equipment Firmware Cache

Use Scenario: Caching door lock status, lighting profiles, and mirror position in 12 V automotive BCMs subject to cold-cranking dips.

IC Role / Device Role / Timing Role: Low-voltage-hold SRAM interfaced directly to 5 V MCU I/O, surviving 2.5 V battery sags.

Use Value: Operates down to 2.2 V with <10 µA hold current-eliminating need for discrete LDO backup regulators in cost-sensitive modules.

Use Scenario: Accelerating firmware load times in automated test equipment by caching boot code and calibration constants.

IC Role / Device Role / Timing Role: High-speed (55 ns) SRAM acting as instruction/data cache between flash memory and ARM Cortex-M7 core.

Use Value: Reduces average instruction fetch latency by 65% versus direct flash access-improving test cycle throughput by 22%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61LV10248AL-10TLI10 ns faster access (45 ns), 3.3 V only, 32-pin TSOP-I same footprintRequires level-shifting for 5 V systems; unsuitable for battery-backup below 3.0 VSelect when migrating to 3.3 V platforms and higher speed is critical; verify OE timing compatibility with host controller.
AS6C1008-55PCNSame 55 ns speed, 5 V operation, but uses single CS# (no S1/S2), no 2 V hold capabilityLacks dual-select and low-voltage retention-requires external supervisor for backup scenariosChoose for simplified decode in new 5 V designs where memory expansion beyond 2 banks is unnecessary.

Compared with IS61LV10248AL-10TLI and AS6C1008-55PCN, the M5M51008DVP-55HIBT uniquely delivers 2 V data retention and dual-chip-select expansion in a drop-in 5 V TSOP-I package-making it irreplaceable for legacy industrial and medical systems requiring battery-backed reliability without redesign.

Availability

M5M51008DVP-55HIBT is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical device parameter storage, and automotive body control modules requiring stable component supply across extended product lifecycles.

Supply support for M5M51008DVP-55HIBT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Technology Corp. (now part of Renesas Electronics Corporation) is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.

The M5M51008DVP-55HIBT belongs to Renesas' legacy CMOS SRAM product line, designed specifically for high-reliability, battery-backed memory applications in cost-sensitive embedded systems requiring TTL compatibility and long-term obsolescence support.

FAQ

What is the minimum supply voltage required for data retention in the M5M51008DVP-55HIBT?

The M5M51008DVP-55HIBT guarantees data retention down to +2.0 V, as specified in the Power Down Characteristics section. At this voltage, the device maintains stored data indefinitely at 25°C with ICC(PD) ≤ 10 µA. This enables direct coin-cell backup without regulation-critical for medical and industrial applications where power integrity is mission-critical. The M5M51008DVP-55HIBT achieves this via optimized TFT load cell design and low-leakage CMOS process.

Does the M5M51008DVP-55HIBT support true 5 V TTL compatibility on all inputs and outputs?

Yes, the M5M51008DVP-55HIBT features fully TTL-compatible inputs (VIH = 2.4 V min, VIL = 0.8 V max) and outputs (VOH = 2.4 V min at IOH = –1.0 mA, VOL = 0.4 V max at IOL = 2.0 mA) at VCC = 5 V ±10%. This eliminates level-shifting components when interfacing with legacy 8051, Z80, or 5 V FPGA I/O banks. The M5M51008DVP-55HIBT meets these specs across its full operating temperature range (0–70°C).

How does the dual chip-select (S1/S2) architecture of the M5M51008DVP-55HIBT simplify memory expansion?

The M5M51008DVP-55HIBT uses S1 and S2 as independent chip-select inputs: activation requires S1 = L and S2 = H. Either S1 = H or S2 = L places the device in high-impedance standby with ICC ≤ 20 µA. This allows up to 16 devices to be daisy-chained using decoded address bits-e.g., A17/A18 driving S1/S2-eliminating external 3-to-8 decoders. The M5M51008DVP-55HIBT thus reduces board space and BOM count in multi-bank memory systems.

Can the M5M51008DVP-55HIBT be used in write-cycle modes other than W-controlled operation?

Yes, the M5M51008DVP-55HIBT supports three write initiation modes: W-controlled (W = L, S1 = L, S2 = H), S1-controlled (S1 = L, S2 = H, W = H), and S2-controlled (S1 = L, S2 = L, W = H). Each mode has distinct setup/hold timing-e.g., S2-controlled write requires tsu(S2) = 50 ns. This flexibility allows optimization for different MCU bus protocols. The M5M51008DVP-55HIBT's function table explicitly defines all valid combinations and their resulting ICC states.

Is the M5M51008DVP-55HIBT pinout compatible with other members of the M5M51008D family such as the M5M51008DRV-55HIBT?

Yes, the M5M51008DVP-55HIBT shares identical pinout and electrical specifications with M5M51008DRV-55HIBT and M5M51008DKV-55HIBT-all are 32-pin TSOP-I packages differing only in lead bend orientation (normal vs. reverse vs. compact). Pin functions (A0–A16, DQ1–DQ8, S1, S2, W, OE, VCC, GND, NC) are electrically and physically identical. The M5M51008DVP-55HIBT can be substituted for DRV/KV variants without PCB modification, provided solder profile matches TSOP-I reflow requirements.

M5M51008DVP-55HIBT Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

M5M51008DVP-55HIBT FAQ

1.How can I place an order for M5M51008DVP-55HIBT through Aetrix?

Please submit a Request for Quotation (RFQ) for M5M51008DVP-55HIBT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for M5M51008DVP-55HIBT reliable?

The price and inventory of M5M51008DVP-55HIBT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M5M51008DVP-55HIBT is usually 5 days.

3.What payment methods are accepted for M5M51008DVP-55HIBT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M5M51008DVP-55HIBT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for M5M51008DVP-55HIBT?

M5M51008DVP-55HIBT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your M5M51008DVP-55HIBT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M5M51008DVP-55HIBT?

For technical support, including M5M51008DVP-55HIBT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M5M51008DVP-55HIBT requirements.

6.How does Aetrix verify that M5M51008DVP-55HIBT is sourced from the original manufacturer or authorized distributors?

All M5M51008DVP-55HIBT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M5M51008DVP-55HIBT meets industry standards.

7.What is the process for return or replacement of M5M51008DVP-55HIBT?

All M5M51008DVP-55HIBT units undergo pre-shipment inspection (PSI). If there is an issue with M5M51008DVP-55HIBT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M5M51008DVP-55HIBT part is unused and in its original packaging.

Return procedure for M5M51008DVP-55HIBT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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