Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas M5M5V108DKV-70H#ST

Part No.:
M5M5V108DKV-70H#ST
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixM5M5V108DKV-70H#ST.pdf
Description:
SRAM 1M-BIT (128K X 8)
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:132,000

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

M5M5V108DKV-70H#ST from Renesas Technology Corp. is a 131,072-word × 8-bit (1 Mbit) CMOS static RAM with 70 ns access time, 2.7–3.6 V supply, 5 mA active current, and 24 µA standby current at 1 MHz - designed for battery-backed memory units in portable and low-power embedded systems.

For engineers reviewing the M5M5V108DKV-70H#ST datasheet, M5M5V108DKV-70H#ST pinout, M5M5V108DKV-70H#ST application, or M5M5V108DKV-70H#ST equivalent, this page delivers verified package mapping (32-pin TSOP, 8 × 13.4 mm), dual chip-select control (S1/S2), TTL-compatible I/O, three-state outputs with OR-tie capability, and +2 V data retention during power-down.

Technical Context

The M5M5V108DKV-70H#ST implements a high-density SRAM array using triple-polysilicon/double-metal CMOS process with TFT load cells, enabling low-power operation without refresh. Its dual chip-select architecture (S1 active-low, S2 active-high) supports hierarchical memory expansion and selective power-down.

Write operations are controlled via W (active-low), with latching on the trailing edge of W, S1, or S2 - whichever occurs first - requiring strict setup/hold timing. OE enables high-impedance output during bus contention, and data hold is guaranteed down to +2 V VCC, supporting seamless battery backup during main power loss.

Key Specifications

ParameterValue and Actual Design Meaning
Memory organization131,072 words × 8 bits (1,048,576-bit total)
Access time70 ns max - defines minimum read cycle interval for reliable data retrieval
Supply voltage2.7–3.6 V - compatible with 3.3 V logic systems and battery-backed operation
Active current5 mA max - enables low-power operation in active memory access mode
Standby current24 µA at 1 MHz - supports extended battery life in sleep/power-down states
Data retention voltage+2 V min - allows memory contents to be preserved during brownout or backup switching
Input/output compatibilityTTL-compatible - eliminates level-shifting requirements in legacy 5 V or mixed-voltage designs

Pinout & Package

Package: 32-pin Thin Small Outline Package (TSOP), 8 mm × 13.4 mm, lead pitch 0.5 mm - optimized for high-density surface-mount assembly and thermal reliability.

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address inputs17-bit address bus supporting full 131,072-word addressing
DQ1–DQ8Bi-directional data I/O8-bit common data bus with three-state output control via OE
S1, S2Chip select inputsS1 active-low / S2 active-high enable hierarchical memory banking and power-down control
WWrite enableActive-low write strobe; latches data on trailing edge with S1/S2 priority
OEOutput enableActive-low control of output drivers; prevents bus contention during writes
VCC, GNDPower supplySingle 2.7–3.6 V supply with dedicated ground pin for noise isolation
NCNo connectionPins 9 and 25 are unconnected - must remain floating per design

Key Features

FeatureDesign Value
Dual chip-select architecture (S1/S2)Enables selective bank disable and independent power-down of memory regions without external logic
+2 V data retentionGuarantees nonvolatile data hold during main power interruption - critical for battery-backup systems
TTL-compatible I/ODirect interface with legacy microcontrollers and FPGAs without level translation circuitry
Three-state outputs with OR-tie capabilitySupports wired-OR bus configurations for memory expansion and shared data bus topologies
Low 24 µA standby currentReduces quiescent power draw in always-on or sleep-mode applications such as real-time clocks and sensor buffers

Applications

Portable Medical Data LoggersIndustrial PLC Memory Buffers

Use Scenario: Battery-powered ECG or glucose monitor storing timestamped sensor readings between host uploads.

IC Role / Device Role / Timing Role: Nonvolatile SRAM buffer retaining data during AC power loss or battery swap.

Use Value: +2 V data retention ensures zero data loss during 2–3 second power transition; 24 µA standby extends 3.6 V Li-ion battery life to >6 months in sleep mode.

Use Scenario: Local I/O status caching in modular PLC backplanes with hot-swap capability.

IC Role / Device Role / Timing Role: Fast-access scratchpad memory for real-time I/O state mirroring and diagnostics.

Use Value: 70 ns access time enables sub-100 ns I/O update cycles; S1/S2 control allows dynamic bank isolation during module replacement.

Automotive Infotainment Boot ROM CachesLegacy Industrial HMI Controllers

Use Scenario: Storing boot firmware checksums and configuration flags in head-unit MCUs with limited internal SRAM.

IC Role / Device Role / Timing Role: External code/data cache supplementing internal MCU memory during cold start.

Use Value: TTL compatibility ensures plug-and-play integration with older 3.3 V ARM7/SH-3 controllers; 32-pin TSOP fits constrained PCB footprints.

Use Scenario: Replacing obsolete 27C512 EPROMs in aging CNC machine controllers requiring field-upgradable parameters.

IC Role / Device Role / Timing Role: Pin-compatible SRAM drop-in replacement for UV-erasable program storage with instant write capability.

Use Value: No wait-state insertion needed due to 70 ns timing; OE-controlled three-state outputs prevent bus conflicts during firmware updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61LV10248AL-70TQLISame density and speed (70 ns), but uses single active-low CE and separate WE/OE; no S1/S2 dual-select logic.Lacks hierarchical power-down control; requires external gating for bank isolation.Preferred when system uses standard CE/WE/OE control and does not require S1/S2-based memory partitioning.
AS6C1008-70ZIN70 ns access, 2.7–3.6 V, but only 10 µA standby current; no +2 V data retention spec.Lower standby draw, but unsuitable for battery-backup scenarios requiring sub-3 V hold.Select when ultra-low quiescent current is prioritized over data retention voltage margin.

Compared with IS61LV10248AL-70TQLI and AS6C1008-70ZIN, the M5M5V108DKV-70H#ST uniquely combines dual-select control for memory banking, +2 V data retention for robust backup, and TTL compatibility - making it optimal for legacy industrial and portable systems where power resilience and pin-level compatibility are critical.

Availability

M5M5V108DKV-70H#ST is available at Aetrix Electronics and suitable for portable medical devices, industrial PLCs, automotive infotainment modules, and legacy HMI controllers requiring stable component supply across long-lifecycle programs.

Supply support for M5M5V108DKV-70H#ST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Technology Corp. is a Japanese semiconductor manufacturer formed in 2003 through the merger of Hitachi and Mitsubishi Electric's semiconductor divisions, specializing in microcontrollers, analog, power, and memory solutions.

The M5M5V108DKV-70H#ST belongs to Renesas' legacy low-voltage CMOS SRAM product line, engineered for battery-backed, space-constrained embedded systems requiring high reliability and TTL interoperability.

FAQ

What is the operating voltage range for the M5M5V108DKV-70H#ST?

The M5M5V108DKV-70H#ST operates across a supply voltage range of 2.7 V to 3.6 V. This range ensures compatibility with standard 3.3 V logic systems while supporting battery-backed operation down to 2.7 V. The device guarantees data retention at +2 V, but functional operation (read/write) is only specified within the 2.7–3.6 V window per its DC electrical characteristics table.

Does the M5M5V108DKV-70H#ST support true dual chip-select operation with independent power-down?

Yes, the M5M5V108DKV-70H#ST implements true dual chip-select logic using S1 (active-low) and S2 (active-high). When S1 is high or S2 is low, the device enters non-selection mode with outputs in high-impedance and current reduced to standby level (24 µA). This enables selective bank disable and hierarchical memory expansion without external logic - a key differentiator from single-CE SRAMs.

What is the significance of the "+2 V data retention" specification for the M5M5V108DKV-70H#ST?

The +2 V data retention specification means the M5M5V108DKV-70H#ST maintains stored data even when VCC drops to +2 V - critical for battery-backup applications. During main power failure, a backup coin cell or capacitor can sustain VCC at ≥2 V, preserving memory contents until power resumes. This behavior is explicitly tested and guaranteed, unlike many SRAMs that lose data below 2.7 V.

Can the M5M5V108DKV-70H#ST be used as a direct replacement for older 5 V TTL SRAMs?

No - the M5M5V108DKV-70H#ST is not a direct replacement for 5 V TTL SRAMs. While its inputs and outputs are TTL-compatible (VIH = 2.2 V, VIL = 0.4 V), it requires a 2.7–3.6 V supply and cannot tolerate 5 V on any pin. It replaces 3.3 V-compatible predecessors like the M5M5V108DFP-70HI, not 5 V devices such as the 62256. System-level voltage rail validation is required before substitution.

What package type does the M5M5V108DKV-70H#ST use, and how does it differ from the DFP and DVP variants?

The M5M5V108DKV-70H#ST uses a 32-pin TSOP (Thin Small Outline Package) measuring 8 mm × 13.4 mm (Outline 32P3K-B). This differs from the DFP variant (32-pin SOP, 525 mil wide) and DVP variant (32-pin TSOP, 8 mm × 20 mm). All share identical pinout and functionality, but the KV variant's compact 13.4 mm length optimizes board space in dense portable designs - confirmed by Mitsubishi's outline drawings and package designation "KV".

M5M5V108DKV-70H#ST Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

M5M5V108DKV-70H#ST FAQ

1.How can I place an order for M5M5V108DKV-70H#ST through Aetrix?

Please submit a Request for Quotation (RFQ) for M5M5V108DKV-70H#ST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for M5M5V108DKV-70H#ST reliable?

The price and inventory of M5M5V108DKV-70H#ST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M5M5V108DKV-70H#ST is usually 5 days.

3.What payment methods are accepted for M5M5V108DKV-70H#ST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M5M5V108DKV-70H#ST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for M5M5V108DKV-70H#ST?

M5M5V108DKV-70H#ST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your M5M5V108DKV-70H#ST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M5M5V108DKV-70H#ST?

For technical support, including M5M5V108DKV-70H#ST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M5M5V108DKV-70H#ST requirements.

6.How does Aetrix verify that M5M5V108DKV-70H#ST is sourced from the original manufacturer or authorized distributors?

All M5M5V108DKV-70H#ST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M5M5V108DKV-70H#ST meets industry standards.

7.What is the process for return or replacement of M5M5V108DKV-70H#ST?

All M5M5V108DKV-70H#ST units undergo pre-shipment inspection (PSI). If there is an issue with M5M5V108DKV-70H#ST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M5M5V108DKV-70H#ST part is unused and in its original packaging.

Return procedure for M5M5V108DKV-70H#ST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

M5M5V108DKV-70H#ST Tags

  • M5M5V108DKV-70H#ST
  • M5M5V108DKV-70H#ST PDF
  • M5M5V108DKV-70H#ST Datasheet
  • M5M5V108DKV-70H#ST Specifications
  • M5M5V108DKV-70H#ST Images
  • Renesas
  • Renesas M5M5V108DKV-70H#ST
  • Buy M5M5V108DKV-70H#ST
  • M5M5V108DKV-70H#ST Price
  • M5M5V108DKV-70H#ST Distributor
  • M5M5V108DKV-70H#ST Supplier
  • M5M5V108DKV-70H#ST Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER