Renesas M5M5V108DKV-70H#ST
- Part No.:
- M5M5V108DKV-70H#ST
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
M5M5V108DKV-70H#ST.pdf
- Description:
- SRAM 1M-BIT (128K X 8)
- Quantity:
- Payment:

- Shipping:

Inventory:132,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
M5M5V108DKV-70H#ST from Renesas Technology Corp. is a 131,072-word × 8-bit (1 Mbit) CMOS static RAM with 70 ns access time, 2.7–3.6 V supply, 5 mA active current, and 24 µA standby current at 1 MHz - designed for battery-backed memory units in portable and low-power embedded systems.
For engineers reviewing the M5M5V108DKV-70H#ST datasheet, M5M5V108DKV-70H#ST pinout, M5M5V108DKV-70H#ST application, or M5M5V108DKV-70H#ST equivalent, this page delivers verified package mapping (32-pin TSOP, 8 × 13.4 mm), dual chip-select control (S1/S2), TTL-compatible I/O, three-state outputs with OR-tie capability, and +2 V data retention during power-down.
Technical Context
The M5M5V108DKV-70H#ST implements a high-density SRAM array using triple-polysilicon/double-metal CMOS process with TFT load cells, enabling low-power operation without refresh. Its dual chip-select architecture (S1 active-low, S2 active-high) supports hierarchical memory expansion and selective power-down.
Write operations are controlled via W (active-low), with latching on the trailing edge of W, S1, or S2 - whichever occurs first - requiring strict setup/hold timing. OE enables high-impedance output during bus contention, and data hold is guaranteed down to +2 V VCC, supporting seamless battery backup during main power loss.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory organization | 131,072 words × 8 bits (1,048,576-bit total) |
| Access time | 70 ns max - defines minimum read cycle interval for reliable data retrieval |
| Supply voltage | 2.7–3.6 V - compatible with 3.3 V logic systems and battery-backed operation |
| Active current | 5 mA max - enables low-power operation in active memory access mode |
| Standby current | 24 µA at 1 MHz - supports extended battery life in sleep/power-down states |
| Data retention voltage | +2 V min - allows memory contents to be preserved during brownout or backup switching |
| Input/output compatibility | TTL-compatible - eliminates level-shifting requirements in legacy 5 V or mixed-voltage designs |
Pinout & Package
Package: 32-pin Thin Small Outline Package (TSOP), 8 mm × 13.4 mm, lead pitch 0.5 mm - optimized for high-density surface-mount assembly and thermal reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address inputs | 17-bit address bus supporting full 131,072-word addressing |
| DQ1–DQ8 | Bi-directional data I/O | 8-bit common data bus with three-state output control via OE |
| S1, S2 | Chip select inputs | S1 active-low / S2 active-high enable hierarchical memory banking and power-down control |
| W | Write enable | Active-low write strobe; latches data on trailing edge with S1/S2 priority |
| OE | Output enable | Active-low control of output drivers; prevents bus contention during writes |
| VCC, GND | Power supply | Single 2.7–3.6 V supply with dedicated ground pin for noise isolation |
| NC | No connection | Pins 9 and 25 are unconnected - must remain floating per design |
Key Features
| Feature | Design Value |
|---|---|
| Dual chip-select architecture (S1/S2) | Enables selective bank disable and independent power-down of memory regions without external logic |
| +2 V data retention | Guarantees nonvolatile data hold during main power interruption - critical for battery-backup systems |
| TTL-compatible I/O | Direct interface with legacy microcontrollers and FPGAs without level translation circuitry |
| Three-state outputs with OR-tie capability | Supports wired-OR bus configurations for memory expansion and shared data bus topologies |
| Low 24 µA standby current | Reduces quiescent power draw in always-on or sleep-mode applications such as real-time clocks and sensor buffers |
Applications
| Portable Medical Data Loggers | Industrial PLC Memory Buffers |
|---|---|
Use Scenario: Battery-powered ECG or glucose monitor storing timestamped sensor readings between host uploads. IC Role / Device Role / Timing Role: Nonvolatile SRAM buffer retaining data during AC power loss or battery swap. Use Value: +2 V data retention ensures zero data loss during 2–3 second power transition; 24 µA standby extends 3.6 V Li-ion battery life to >6 months in sleep mode. | Use Scenario: Local I/O status caching in modular PLC backplanes with hot-swap capability. IC Role / Device Role / Timing Role: Fast-access scratchpad memory for real-time I/O state mirroring and diagnostics. Use Value: 70 ns access time enables sub-100 ns I/O update cycles; S1/S2 control allows dynamic bank isolation during module replacement. |
| Automotive Infotainment Boot ROM Caches | Legacy Industrial HMI Controllers |
Use Scenario: Storing boot firmware checksums and configuration flags in head-unit MCUs with limited internal SRAM. IC Role / Device Role / Timing Role: External code/data cache supplementing internal MCU memory during cold start. Use Value: TTL compatibility ensures plug-and-play integration with older 3.3 V ARM7/SH-3 controllers; 32-pin TSOP fits constrained PCB footprints. | Use Scenario: Replacing obsolete 27C512 EPROMs in aging CNC machine controllers requiring field-upgradable parameters. IC Role / Device Role / Timing Role: Pin-compatible SRAM drop-in replacement for UV-erasable program storage with instant write capability. Use Value: No wait-state insertion needed due to 70 ns timing; OE-controlled three-state outputs prevent bus conflicts during firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61LV10248AL-70TQLI | Same density and speed (70 ns), but uses single active-low CE and separate WE/OE; no S1/S2 dual-select logic. | Lacks hierarchical power-down control; requires external gating for bank isolation. | Preferred when system uses standard CE/WE/OE control and does not require S1/S2-based memory partitioning. |
| AS6C1008-70ZIN | 70 ns access, 2.7–3.6 V, but only 10 µA standby current; no +2 V data retention spec. | Lower standby draw, but unsuitable for battery-backup scenarios requiring sub-3 V hold. | Select when ultra-low quiescent current is prioritized over data retention voltage margin. |
Compared with IS61LV10248AL-70TQLI and AS6C1008-70ZIN, the M5M5V108DKV-70H#ST uniquely combines dual-select control for memory banking, +2 V data retention for robust backup, and TTL compatibility - making it optimal for legacy industrial and portable systems where power resilience and pin-level compatibility are critical.
Availability
M5M5V108DKV-70H#ST is available at Aetrix Electronics and suitable for portable medical devices, industrial PLCs, automotive infotainment modules, and legacy HMI controllers requiring stable component supply across long-lifecycle programs.
Supply support for M5M5V108DKV-70H#ST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Technology Corp. is a Japanese semiconductor manufacturer formed in 2003 through the merger of Hitachi and Mitsubishi Electric's semiconductor divisions, specializing in microcontrollers, analog, power, and memory solutions.
The M5M5V108DKV-70H#ST belongs to Renesas' legacy low-voltage CMOS SRAM product line, engineered for battery-backed, space-constrained embedded systems requiring high reliability and TTL interoperability.
FAQ
What is the operating voltage range for the M5M5V108DKV-70H#ST?
The M5M5V108DKV-70H#ST operates across a supply voltage range of 2.7 V to 3.6 V. This range ensures compatibility with standard 3.3 V logic systems while supporting battery-backed operation down to 2.7 V. The device guarantees data retention at +2 V, but functional operation (read/write) is only specified within the 2.7–3.6 V window per its DC electrical characteristics table.
Does the M5M5V108DKV-70H#ST support true dual chip-select operation with independent power-down?
Yes, the M5M5V108DKV-70H#ST implements true dual chip-select logic using S1 (active-low) and S2 (active-high). When S1 is high or S2 is low, the device enters non-selection mode with outputs in high-impedance and current reduced to standby level (24 µA). This enables selective bank disable and hierarchical memory expansion without external logic - a key differentiator from single-CE SRAMs.
What is the significance of the "+2 V data retention" specification for the M5M5V108DKV-70H#ST?
The +2 V data retention specification means the M5M5V108DKV-70H#ST maintains stored data even when VCC drops to +2 V - critical for battery-backup applications. During main power failure, a backup coin cell or capacitor can sustain VCC at ≥2 V, preserving memory contents until power resumes. This behavior is explicitly tested and guaranteed, unlike many SRAMs that lose data below 2.7 V.
Can the M5M5V108DKV-70H#ST be used as a direct replacement for older 5 V TTL SRAMs?
No - the M5M5V108DKV-70H#ST is not a direct replacement for 5 V TTL SRAMs. While its inputs and outputs are TTL-compatible (VIH = 2.2 V, VIL = 0.4 V), it requires a 2.7–3.6 V supply and cannot tolerate 5 V on any pin. It replaces 3.3 V-compatible predecessors like the M5M5V108DFP-70HI, not 5 V devices such as the 62256. System-level voltage rail validation is required before substitution.
What package type does the M5M5V108DKV-70H#ST use, and how does it differ from the DFP and DVP variants?
The M5M5V108DKV-70H#ST uses a 32-pin TSOP (Thin Small Outline Package) measuring 8 mm × 13.4 mm (Outline 32P3K-B). This differs from the DFP variant (32-pin SOP, 525 mil wide) and DVP variant (32-pin TSOP, 8 mm × 20 mm). All share identical pinout and functionality, but the KV variant's compact 13.4 mm length optimizes board space in dense portable designs - confirmed by Mitsubishi's outline drawings and package designation "KV".
M5M5V108DKV-70H#ST Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
M5M5V108DKV-70H#ST FAQ
1.How can I place an order for M5M5V108DKV-70H#ST through Aetrix?
Please submit a Request for Quotation (RFQ) for M5M5V108DKV-70H#ST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for M5M5V108DKV-70H#ST reliable?
The price and inventory of M5M5V108DKV-70H#ST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M5M5V108DKV-70H#ST is usually 5 days.
3.What payment methods are accepted for M5M5V108DKV-70H#ST?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for M5M5V108DKV-70H#ST transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for M5M5V108DKV-70H#ST?
M5M5V108DKV-70H#ST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your M5M5V108DKV-70H#ST order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for M5M5V108DKV-70H#ST?
For technical support, including M5M5V108DKV-70H#ST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M5M5V108DKV-70H#ST requirements.
6.How does Aetrix verify that M5M5V108DKV-70H#ST is sourced from the original manufacturer or authorized distributors?
All M5M5V108DKV-70H#ST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M5M5V108DKV-70H#ST meets industry standards.
7.What is the process for return or replacement of M5M5V108DKV-70H#ST?
All M5M5V108DKV-70H#ST units undergo pre-shipment inspection (PSI). If there is an issue with M5M5V108DKV-70H#ST, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M5M5V108DKV-70H#ST part is unused and in its original packaging.
Return procedure for M5M5V108DKV-70H#ST:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
M5M5V108DKV-70H#ST Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

