Renesas M5M5V108DVP-70H#ST

Overview

M5M5V108DVP-70H#ST from Renesas Technology Corp. is a 131,072-word × 8-bit (1 Mbit) CMOS static RAM in a 32-pin TSOP-II package, featuring 70 ns access time, 2.7–3.6 V single-supply operation, 5 mA active current, and 24 µA standby current at 1 MHz - optimized for battery-backed memory applications in portable and low-power embedded systems.

For engineers reviewing the M5M5V108DVP-70H#ST datasheet, M5M5V108DVP-70H#ST pinout, M5M5V108DVP-70H#ST application, or M5M5V108DVP-70H#ST equivalent, key selection criteria include TTL-compatible I/O, dual chip select (S1/S2) for memory expansion, three-state outputs with OR-tie capability, +2 V data retention during power-down, and verified TSOP-II 8 × 20 mm footprint compatibility.

Technical Context

The M5M5V108DVP-70H#ST implements a high-density SRAM architecture using triple-polysilicon and double-metal CMOS process technology with TFT load cells, enabling low-power operation without compromising speed. Its dual active-low chip select inputs (S1, S2) support hierarchical memory banking and selective power-down modes.

Write operations are controlled via W (write enable), with mode selection determined by the combination of S1, S2, W, and OE signals - supporting both W-controlled and S1/S2-controlled write cycles. Data hold is guaranteed down to +2 V V_CC, and output disable/enable timing is specified with 25 ns t_dis(OE) and 10 ns t_en(OE) under standard load conditions.

Key Specifications

Pinout & Package

Package: 32-pin Thin Small Outline Package (TSOP-II), 8 mm × 20 mm body, 0.5 mm lead pitch, RoHS-compliant surface-mount device per Outline 32P3H-E.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Compared with IS61LV10248AL-70TLI and AS6C1008-70SCN, the M5M5V108DVP-70H#ST uniquely combines TSOP-II mechanical compatibility, +2 V data retention, and dual chip select for expandable memory architectures - making it irreplaceable in battery-backed legacy upgrades and space-constrained industrial buffers requiring guaranteed data hold.

Availability

M5M5V108DVP-70H#ST is available at Aetrix Electronics and suitable for portable medical monitors, industrial PLC data buffers, and legacy POS terminal memory expansion requiring stable component supply and long-term lifecycle support.

Supply support for M5M5V108DVP-70H#ST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Technology Corp. is a Japanese semiconductor manufacturer formed in 2003 through the merger of Hitachi and Mitsubishi Electric's semiconductor operations, specializing in microcontrollers, analog, power, and memory solutions.

The M5M5V108DVP-70H#ST belongs to Renesas' legacy CMOS SRAM product line, designed specifically for low-power, battery-backed, and industrial-grade embedded memory applications where reliability, pin compatibility, and long-term supply continuity are critical.

FAQ

What is the operating voltage range for the M5M5V108DVP-70H#ST?

The M5M5V108DVP-70H#ST operates over a supply voltage range of 2.7 V to 3.6 V. This range ensures compatibility with standard 3.3 V logic systems while supporting battery-backed operation down to 2.7 V. The device guarantees full functionality-including 70 ns access time and data retention-across this entire range, as validated in the DC electrical characteristics table of its official datasheet.

Does the M5M5V108DVP-70H#ST support true data retention at low voltage?

Yes, the M5M5V108DVP-70H#ST maintains stored data at +2 V V_CC, as explicitly specified in the Power Down Characteristics section. This feature enables reliable battery-backup operation during main power failure or intentional power-down sequences, a capability confirmed in the "Power down supply voltage" parameter (V_CC(PD) = 2.0 V min) and supported by functional timing under low-V_CC conditions.

What package type is used for the M5M5V108DVP-70H#ST?

The M5M5V108DVP-70H#ST uses a 32-pin Thin Small Outline Package (TSOP-II) with dimensions of 8 mm × 20 mm and 0.5 mm lead pitch, conforming to Outline 32P3H-E. This surface-mount package is distinct from SOP and TSOP-I variants in the same family and is mechanically and electrically validated for use in high-density, reflow-soldered industrial PCBs.

How does the dual chip select (S1/S2) function in the M5M5V108DVP-70H#ST?

The M5M5V108DVP-70H#ST uses S1 and S2 as independent active-low chip select inputs to define three operational states: selected (S1=L, S2=H), deselected (S1=H or S2=L), and power-down (S1=H, S2=L). When deselected, outputs enter high-impedance state and ICC drops to 24 µA; this enables OR-tie expansion and hierarchical memory banking without external decoding logic.

Is the M5M5V108DVP-70H#ST pin-compatible with other variants in the M5M5V108D series?

Yes, the M5M5V108DVP-70H#ST shares identical pinout and function mapping with M5M5V108DFP-70HI and M5M5V108DKV-70HI, differing only in package type (TSOP-II vs. SOP vs. TSOP-I). All variants use the same 32-pin configuration, address/data/control signal assignments, and timing behavior - confirmed by the shared PIN CONFIGURATION diagram and FUNCTION TABLE in the original Mitsubishi/Renesas documentation.