Renesas M5M5V5636GP-16I#BE
- Part No.:
- M5M5V5636GP-16I#BE
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- -
- Datasheet:
-
M5M5V5636GP-16I#BE.pdf
- Description:
- SRAM, 512KX36, 3.8NS
- Quantity:
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Product details
Overview
M5M5V5636GP-16I#BE from Renesas Electronics is a 18-Mbit (524,288 × 36) synchronous SRAM optimized for high-bandwidth networking applications. It operates at 167 MHz with 3.8 ns access time, supports 3.3 V core/2.5 V or 3.3 V I/O supplies, and features fully registered pipelined I/O for zero-bus-turnaround operation in switches and routers.
For engineers reviewing the M5M5V5636GP-16I#BE datasheet, M5M5V5636GP-16I#BE pinout, M5M5V5636GP-16I#BE application, or M5M5V5636GP-16I#BE equivalent, this page delivers verified timing parameters, industrial-grade temperature support (–40°C to +85°C), burst mode control (linear/interleaved), individual byte write capability, and Snooze mode power-down behavior - all critical for deterministic memory subsystem design.
Technical Context
This SRAM implements synchronous, clock-driven operation with all address, data, and control inputs registered on the rising edge of CLK. Its architecture includes a 19-bit address register, linear/interleaved burst counter, four independent byte-write drivers, and output registers that eliminate external G# timing constraints.
It supports three chip enables (E1#, E2, E3#) for depth expansion, uses ADV to load or advance burst addresses, and employs CKE# to gate clock propagation. The LBO# pin statically selects burst order, while ZZ enables asynchronous snooze mode with 30 mA standby current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18,874,368-bit (524,288 words × 36 bits) - provides wide data path for packet buffering and table lookups |
| Access Time / Cycle Time | 3.8 ns / 6.0 ns at 167 MHz - enables sub-6 ns deterministic read latency in pipelined systems |
| Supply Voltages | VDD = 3.135–3.465 V; VDDQ = 2.375–2.625 V (2.5 V I/O) or 3.135–3.465 V (3.3 V I/O) - supports mixed-voltage system interfacing |
| Operating Temperature | –40°C to +85°C - qualified for industrial networking environments without derating |
| Power Consumption | ICC1 = 380 mA max (active), ICC3/ICC4 = 30 mA (standby/snooze) - enables thermal management in dense switch fabric designs |
| Burst Mode Control | LBO# pin selects linear or interleaved burst order - determines address sequence for cache-line-aligned accesses |
| Byte Write Capability | Four independent BWa#–BWd# signals - allows partial writes without read-modify-write cycles |
Pinout & Package
Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, industrial-grade thermal resistance (θJA = 28.18°C/W, still air).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Synchronous Address Inputs | 19-bit registered address bus; A0/A1 set burst counter LSBs for linear/interleaved sequences |
| BWa#–BWd# | Synchronous Byte Write Enables | Active-low per-byte controls; BWa# drives DQa/DQPa, BWb# drives DQb/DQPb, etc. |
| CLK | Clock Input | Rising-edge-triggered master clock; all synchronous inputs referenced to this edge |
| E1#, E2, E3# | Synchronous Chip Enables | Three enables for depth expansion; E1# and E3# active-low, E2 active-high |
| ADV | Address Advance/Load | LOW loads new external address; HIGH advances internal burst counter and ignores W# |
| W# | Read/Write Control | Active-low; sole determinant of cycle type when ADV is LOW; full-width write if all BW# are LOW |
| G# | Asynchronous Output Enable | Active-low; enables output drivers independently of clock - used for output timing control |
| ZZ | Asynchronous Snooze Enable | Active-high; forces low-power standby with data retention and ignores all other inputs |
| LBO# | Burst Mode Control | DC-operated pin; HIGH/NC = interleaved burst, LOW = linear burst - must remain static during operation |
| DQa–DQd, DQPa–DQPd | Synchronous Data I/O | 36-bit data bus grouped into four 9-bit bytes (8 data + 1 parity); each byte has dedicated DQ and DQP pins |
| VDD, VSS, VDDQ, VSSQ | Power/Ground Terminals | Separate core (VDD/VSS) and I/O (VDDQ/VSSQ) rails - enables voltage domain isolation and noise reduction |
| MCH | Must Connect High | Internally pulled up; requires external connection to VDD for guaranteed logic HIGH |
| NC | No Connect | Unbonded pins; may be grounded but not driven |
Key Features
| Feature | Design Value |
|---|---|
| Zero Bus Turnaround Architecture | Eliminates dead cycles between read/write transitions via pipelined register staging - critical for back-to-back packet processing |
| Individual Byte Write Control | Four independent BW# signals allow selective 9-bit writes without disturbing adjacent bytes - reduces bus contention in multi-protocol buffers |
| Linear and Interleaved Burst Modes | LBO# pin selects burst order to match CPU/cache or network processor addressing patterns - avoids software remapping overhead |
| Low-Power Snooze Mode | 30 mA standby current with full data retention and asynchronous entry/exit - enables dynamic power gating in idle link periods |
| Three-Chip-Enable Depth Expansion | E1#, E2, E3# support modular memory stacking without external logic - simplifies scalable buffer design for multi-port switches |
Applications
| Layer 3 Switching Buffer | Network Processor Table Cache |
|---|---|
Use Scenario: Storing forwarding information base (FIB) entries and adjacency tables in high-port-count enterprise switches. IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic 3.8 ns read latency and burst-access capability for parallel table lookups. Use Value: Enables line-rate packet forwarding at 167 MHz clock with zero-cycle turnaround between successive address reads. | Use Scenario: Acting as local instruction/data cache for network processors executing deep packet inspection and classification algorithms. IC Role / Device Role / Timing Role: Wide 36-bit interface supports dual-word fetches; byte-write enables selective update of metadata fields without full-line writes. Use Value: Reduces memory bandwidth pressure by 75% compared to full-word writes when updating flow state counters or TTL values. |
| Telecom Line Card Packet Buffer | Optical Transport Network (OTN) Framer FIFO |
Use Scenario: Buffering variable-length Ethernet frames across rate-adapted interfaces in carrier-grade line cards. IC Role / Device Role / Timing Role: Snooze mode (ZZ) activated during link idle periods to cut active current from 380 mA to 30 mA. Use Value: Lowers average power per buffer bank by >90%, enabling higher port density within thermal limits. | Use Scenario: Implementing elastic store FIFOs in OTN framer ASICs handling 10G/40G serial data streams. IC Role / Device Role / Timing Role: Linear burst mode (LBO# = LOW) matches sequential OTU frame payload addressing for seamless deserialization. Use Value: Eliminates address generation logic in framer control state machines - reduces RTL complexity and timing closure effort. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-167AXC | 36-bit, 512K × 36, 167 MHz, 3.3 V only (no 2.5 V I/O option), 4.5 ns access | Requires 3.3 V I/O only; lacks separate VDDQ for mixed-voltage interfacing | Choose when system uses uniform 3.3 V signaling and does not require 2.5 V compatibility |
| IS61WV51236BLL-167TQLI | 36-bit, 512K × 36, 167 MHz, 2.5 V core/I/O, no Snooze mode, 5 ns access | Lower voltage operation but no ZZ power-down; higher standby current (50 mA vs. 30 mA) | Choose for ultra-low-voltage systems where Snooze mode is unnecessary and thermal headroom is constrained |
Compared with CY7C1362BV33-167AXC and IS61WV51236BLL-167TQLI, the M5M5V5636GP-16I#BE uniquely supports dual I/O voltage (2.5 V/3.3 V), Snooze mode with 30 mA standby, and zero-bus-turnaround architecture - making it optimal for thermally sensitive, mixed-signal networking hardware requiring deterministic latency and flexible voltage scaling.
Availability
M5M5V5636GP-16I#BE is available at Aetrix Electronics and suitable for high-end networking equipment, telecom infrastructure, and industrial embedded systems requiring stable component supply, long-lifecycle support, and industrial temperature qualification.
Supply support for M5M5V5636GP-16I#BE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The M5M5V5636GP-16I#BE belongs to Renesas' legacy high-performance synchronous SRAM product line, designed specifically for bandwidth-intensive networking applications including switches, routers, and network processors requiring low-latency, burst-capable memory with industrial reliability.
FAQ
What is the maximum operating frequency and corresponding access time for the M5M5V5636GP-16I#BE?
The M5M5V5636GP-16I#BE is rated for 167 MHz operation with a 3.8 ns access time (tKHQV) and 6.0 ns cycle time (tKHKH). These values are specified under industrial temperature conditions (–40°C to +85°C) and VDD = 3.135–3.465 V, VDDQ = 2.375–2.625 V (2.5 V I/O mode). The device also supports a 133 MHz / 4.2 ns variant (M5M5V5636GP-13I), but the M5M5V5636GP-16I#BE is the 167 MHz version.
Does the M5M5V5636GP-16I#BE support both 2.5 V and 3.3 V I/O interfaces?
Yes, the M5M5V5636GP-16I#BE supports dual I/O voltage operation via separate VDDQ and VSSQ pins. It accepts VDDQ = 2.375–2.625 V for 2.5 V I/O compatibility or VDDQ = 3.135–3.465 V for 3.3 V CMOS compatibility, while maintaining a fixed 3.3 V core supply (VDD). This flexibility allows direct interfacing with both 2.5 V and 3.3 V logic families without level shifters.
How does the Snooze mode (ZZ) function in the M5M5V5636GP-16I#BE, and what is its power impact?
The Snooze mode is activated by driving the ZZ pin HIGH, placing the M5M5V5636GP-16I#BE into a low-power standby state with full data retention. In this mode, all other inputs are ignored, and ICC4 is limited to 30 mA maximum. Recovery time (tZZREC) is 2 × tKHKH (12 ns at 167 MHz). This feature enables dynamic power management during link idle periods in networking hardware.
What burst modes does the M5M5V5636GP-16I#BE support, and how is selection implemented?
The M5M5V5636GP-16I#BE supports both linear and interleaved burst modes, selected by the DC-operated LBO# pin: HIGH or NC enables interleaved burst; LOW enables linear burst. The burst order affects internal address generation during consecutive accesses after an initial ADV-LOW load. LBO# must remain static during normal operation and is not sampled dynamically.
Can the M5M5V5636GP-16I#BE be used in depth-expanded memory configurations, and how many chip enables does it provide?
Yes, the M5M5V5636GP-16I#BE supports depth expansion using three dedicated chip enable signals: E1# (active-low), E2 (active-high), and E3# (active-low). These allow stacking multiple devices to increase total word count without external decoding logic. All three enables are synchronous and sampled only when ADV is LOW, ensuring coordinated activation across the expanded bank.
M5M5V5636GP-16I#BE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
M5M5V5636GP-16I#BE FAQ
1.How can I place an order for M5M5V5636GP-16I#BE through Aetrix?
Please submit a Request for Quotation (RFQ) for M5M5V5636GP-16I#BE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of M5M5V5636GP-16I#BE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M5M5V5636GP-16I#BE is usually 5 days.
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5.How can I obtain technical support or documentation for M5M5V5636GP-16I#BE?
For technical support, including M5M5V5636GP-16I#BE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M5M5V5636GP-16I#BE requirements.
6.How does Aetrix verify that M5M5V5636GP-16I#BE is sourced from the original manufacturer or authorized distributors?
All M5M5V5636GP-16I#BE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M5M5V5636GP-16I#BE meets industry standards.
7.What is the process for return or replacement of M5M5V5636GP-16I#BE?
All M5M5V5636GP-16I#BE units undergo pre-shipment inspection (PSI). If there is an issue with M5M5V5636GP-16I#BE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The M5M5V5636GP-16I#BE part is unused and in its original packaging.
Return procedure for M5M5V5636GP-16I#BE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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