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Renesas M5M5V5636GP-16I#BE

Part No.:
M5M5V5636GP-16I#BE
Manufacturer:
Renesas
Category:
Memory
Package:
-
Datasheet:
AetrixM5M5V5636GP-16I#BE.pdf
Description:
SRAM, 512KX36, 3.8NS
Quantity:
Payment:
Payment
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Shipping

Inventory:13,916

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Product details

Overview

M5M5V5636GP-16I#BE from Renesas Electronics is a 18-Mbit (524,288 × 36) synchronous SRAM optimized for high-bandwidth networking applications. It operates at 167 MHz with 3.8 ns access time, supports 3.3 V core/2.5 V or 3.3 V I/O supplies, and features fully registered pipelined I/O for zero-bus-turnaround operation in switches and routers.

For engineers reviewing the M5M5V5636GP-16I#BE datasheet, M5M5V5636GP-16I#BE pinout, M5M5V5636GP-16I#BE application, or M5M5V5636GP-16I#BE equivalent, this page delivers verified timing parameters, industrial-grade temperature support (–40°C to +85°C), burst mode control (linear/interleaved), individual byte write capability, and Snooze mode power-down behavior - all critical for deterministic memory subsystem design.

Technical Context

This SRAM implements synchronous, clock-driven operation with all address, data, and control inputs registered on the rising edge of CLK. Its architecture includes a 19-bit address register, linear/interleaved burst counter, four independent byte-write drivers, and output registers that eliminate external G# timing constraints.

It supports three chip enables (E1#, E2, E3#) for depth expansion, uses ADV to load or advance burst addresses, and employs CKE# to gate clock propagation. The LBO# pin statically selects burst order, while ZZ enables asynchronous snooze mode with 30 mA standby current.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density18,874,368-bit (524,288 words × 36 bits) - provides wide data path for packet buffering and table lookups
Access Time / Cycle Time3.8 ns / 6.0 ns at 167 MHz - enables sub-6 ns deterministic read latency in pipelined systems
Supply VoltagesVDD = 3.135–3.465 V; VDDQ = 2.375–2.625 V (2.5 V I/O) or 3.135–3.465 V (3.3 V I/O) - supports mixed-voltage system interfacing
Operating Temperature–40°C to +85°C - qualified for industrial networking environments without derating
Power ConsumptionICC1 = 380 mA max (active), ICC3/ICC4 = 30 mA (standby/snooze) - enables thermal management in dense switch fabric designs
Burst Mode ControlLBO# pin selects linear or interleaved burst order - determines address sequence for cache-line-aligned accesses
Byte Write CapabilityFour independent BWa#–BWd# signals - allows partial writes without read-modify-write cycles

Pinout & Package

Package: 100-pin TQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, industrial-grade thermal resistance (θJA = 28.18°C/W, still air).

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Synchronous Address Inputs19-bit registered address bus; A0/A1 set burst counter LSBs for linear/interleaved sequences
BWa#–BWd#Synchronous Byte Write EnablesActive-low per-byte controls; BWa# drives DQa/DQPa, BWb# drives DQb/DQPb, etc.
CLKClock InputRising-edge-triggered master clock; all synchronous inputs referenced to this edge
E1#, E2, E3#Synchronous Chip EnablesThree enables for depth expansion; E1# and E3# active-low, E2 active-high
ADVAddress Advance/LoadLOW loads new external address; HIGH advances internal burst counter and ignores W#
W#Read/Write ControlActive-low; sole determinant of cycle type when ADV is LOW; full-width write if all BW# are LOW
G#Asynchronous Output EnableActive-low; enables output drivers independently of clock - used for output timing control
ZZAsynchronous Snooze EnableActive-high; forces low-power standby with data retention and ignores all other inputs
LBO#Burst Mode ControlDC-operated pin; HIGH/NC = interleaved burst, LOW = linear burst - must remain static during operation
DQa–DQd, DQPa–DQPdSynchronous Data I/O36-bit data bus grouped into four 9-bit bytes (8 data + 1 parity); each byte has dedicated DQ and DQP pins
VDD, VSS, VDDQ, VSSQPower/Ground TerminalsSeparate core (VDD/VSS) and I/O (VDDQ/VSSQ) rails - enables voltage domain isolation and noise reduction
MCHMust Connect HighInternally pulled up; requires external connection to VDD for guaranteed logic HIGH
NCNo ConnectUnbonded pins; may be grounded but not driven

Key Features

FeatureDesign Value
Zero Bus Turnaround ArchitectureEliminates dead cycles between read/write transitions via pipelined register staging - critical for back-to-back packet processing
Individual Byte Write ControlFour independent BW# signals allow selective 9-bit writes without disturbing adjacent bytes - reduces bus contention in multi-protocol buffers
Linear and Interleaved Burst ModesLBO# pin selects burst order to match CPU/cache or network processor addressing patterns - avoids software remapping overhead
Low-Power Snooze Mode30 mA standby current with full data retention and asynchronous entry/exit - enables dynamic power gating in idle link periods
Three-Chip-Enable Depth ExpansionE1#, E2, E3# support modular memory stacking without external logic - simplifies scalable buffer design for multi-port switches

Applications

Layer 3 Switching BufferNetwork Processor Table Cache

Use Scenario: Storing forwarding information base (FIB) entries and adjacency tables in high-port-count enterprise switches.

IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic 3.8 ns read latency and burst-access capability for parallel table lookups.

Use Value: Enables line-rate packet forwarding at 167 MHz clock with zero-cycle turnaround between successive address reads.

Use Scenario: Acting as local instruction/data cache for network processors executing deep packet inspection and classification algorithms.

IC Role / Device Role / Timing Role: Wide 36-bit interface supports dual-word fetches; byte-write enables selective update of metadata fields without full-line writes.

Use Value: Reduces memory bandwidth pressure by 75% compared to full-word writes when updating flow state counters or TTL values.

Telecom Line Card Packet BufferOptical Transport Network (OTN) Framer FIFO

Use Scenario: Buffering variable-length Ethernet frames across rate-adapted interfaces in carrier-grade line cards.

IC Role / Device Role / Timing Role: Snooze mode (ZZ) activated during link idle periods to cut active current from 380 mA to 30 mA.

Use Value: Lowers average power per buffer bank by >90%, enabling higher port density within thermal limits.

Use Scenario: Implementing elastic store FIFOs in OTN framer ASICs handling 10G/40G serial data streams.

IC Role / Device Role / Timing Role: Linear burst mode (LBO# = LOW) matches sequential OTU frame payload addressing for seamless deserialization.

Use Value: Eliminates address generation logic in framer control state machines - reduces RTL complexity and timing closure effort.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-167AXC36-bit, 512K × 36, 167 MHz, 3.3 V only (no 2.5 V I/O option), 4.5 ns accessRequires 3.3 V I/O only; lacks separate VDDQ for mixed-voltage interfacingChoose when system uses uniform 3.3 V signaling and does not require 2.5 V compatibility
IS61WV51236BLL-167TQLI36-bit, 512K × 36, 167 MHz, 2.5 V core/I/O, no Snooze mode, 5 ns accessLower voltage operation but no ZZ power-down; higher standby current (50 mA vs. 30 mA)Choose for ultra-low-voltage systems where Snooze mode is unnecessary and thermal headroom is constrained

Compared with CY7C1362BV33-167AXC and IS61WV51236BLL-167TQLI, the M5M5V5636GP-16I#BE uniquely supports dual I/O voltage (2.5 V/3.3 V), Snooze mode with 30 mA standby, and zero-bus-turnaround architecture - making it optimal for thermally sensitive, mixed-signal networking hardware requiring deterministic latency and flexible voltage scaling.

Availability

M5M5V5636GP-16I#BE is available at Aetrix Electronics and suitable for high-end networking equipment, telecom infrastructure, and industrial embedded systems requiring stable component supply, long-lifecycle support, and industrial temperature qualification.

Supply support for M5M5V5636GP-16I#BE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.

The M5M5V5636GP-16I#BE belongs to Renesas' legacy high-performance synchronous SRAM product line, designed specifically for bandwidth-intensive networking applications including switches, routers, and network processors requiring low-latency, burst-capable memory with industrial reliability.

FAQ

What is the maximum operating frequency and corresponding access time for the M5M5V5636GP-16I#BE?

The M5M5V5636GP-16I#BE is rated for 167 MHz operation with a 3.8 ns access time (tKHQV) and 6.0 ns cycle time (tKHKH). These values are specified under industrial temperature conditions (–40°C to +85°C) and VDD = 3.135–3.465 V, VDDQ = 2.375–2.625 V (2.5 V I/O mode). The device also supports a 133 MHz / 4.2 ns variant (M5M5V5636GP-13I), but the M5M5V5636GP-16I#BE is the 167 MHz version.

Does the M5M5V5636GP-16I#BE support both 2.5 V and 3.3 V I/O interfaces?

Yes, the M5M5V5636GP-16I#BE supports dual I/O voltage operation via separate VDDQ and VSSQ pins. It accepts VDDQ = 2.375–2.625 V for 2.5 V I/O compatibility or VDDQ = 3.135–3.465 V for 3.3 V CMOS compatibility, while maintaining a fixed 3.3 V core supply (VDD). This flexibility allows direct interfacing with both 2.5 V and 3.3 V logic families without level shifters.

How does the Snooze mode (ZZ) function in the M5M5V5636GP-16I#BE, and what is its power impact?

The Snooze mode is activated by driving the ZZ pin HIGH, placing the M5M5V5636GP-16I#BE into a low-power standby state with full data retention. In this mode, all other inputs are ignored, and ICC4 is limited to 30 mA maximum. Recovery time (tZZREC) is 2 × tKHKH (12 ns at 167 MHz). This feature enables dynamic power management during link idle periods in networking hardware.

What burst modes does the M5M5V5636GP-16I#BE support, and how is selection implemented?

The M5M5V5636GP-16I#BE supports both linear and interleaved burst modes, selected by the DC-operated LBO# pin: HIGH or NC enables interleaved burst; LOW enables linear burst. The burst order affects internal address generation during consecutive accesses after an initial ADV-LOW load. LBO# must remain static during normal operation and is not sampled dynamically.

Can the M5M5V5636GP-16I#BE be used in depth-expanded memory configurations, and how many chip enables does it provide?

Yes, the M5M5V5636GP-16I#BE supports depth expansion using three dedicated chip enable signals: E1# (active-low), E2 (active-high), and E3# (active-low). These allow stacking multiple devices to increase total word count without external decoding logic. All three enables are synchronous and sampled only when ADV is LOW, ensuring coordinated activation across the expanded bank.

M5M5V5636GP-16I#BE Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

M5M5V5636GP-16I#BE FAQ

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Please submit a Request for Quotation (RFQ) for M5M5V5636GP-16I#BE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of M5M5V5636GP-16I#BE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for M5M5V5636GP-16I#BE is usually 5 days.

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Once your M5M5V5636GP-16I#BE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for M5M5V5636GP-16I#BE?

For technical support, including M5M5V5636GP-16I#BE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your M5M5V5636GP-16I#BE requirements.

6.How does Aetrix verify that M5M5V5636GP-16I#BE is sourced from the original manufacturer or authorized distributors?

All M5M5V5636GP-16I#BE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that M5M5V5636GP-16I#BE meets industry standards.

7.What is the process for return or replacement of M5M5V5636GP-16I#BE?

All M5M5V5636GP-16I#BE units undergo pre-shipment inspection (PSI). If there is an issue with M5M5V5636GP-16I#BE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The M5M5V5636GP-16I#BE part is unused and in its original packaging.

Return procedure for M5M5V5636GP-16I#BE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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