STMicroelectronics M74HCT02RM13TR

Overview

M74HCT02RM13TR from STMicroelectronics is a high-speed CMOS quad 2-input NOR gate in TSSOP-14 package, featuring 15 ns typical propagation delay at 4.5 V, ±4 mA symmetrical output drive, TTL-compatible input thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V), and 1 µA max quiescent ICC at 25°C - used for logic-level translation and combinational control in industrial timing and interface circuits.

For engineers reviewing the M74HCT02RM13TR datasheet, M74HCT02RM13TR pinout, M74HCT02RM13TR application, or M74HCT02RM13TR equivalent, key selection criteria include guaranteed 4.5–5.5 V operation, -55°C to +125°C extended temperature range, balanced tPLH/tPHL delays, 10 pF input capacitance, and TSSOP-14 footprint compatibility with space-constrained PCB layouts.

Technical Context

The M74HCT02RM13TR implements four independent 2-input NOR gates using silicon gate C2MOS technology with three-stage buffered outputs, enabling high noise immunity and stable rail-to-rail switching. Its input protection circuitry includes diodes for ESD and transient voltage suppression, and its symmetrical output impedance ensures matched rise/fall times under load.

Designed for direct interfacing between HCMOS, TTL, and NMOS systems, it operates across full industrial and extended temperature ranges (-55°C to +125°C) with guaranteed DC and AC performance at 4.5–5.5 V supply, supporting reliable logic decision-making in mixed-technology digital subsystems.

Key Specifications

Pinout & Package

TSSOP-14 (Thin Shrink Small Outline Package), 4.9 × 6.4 mm body, 0.65 mm pitch, exposed pad not present, JEDEC MO-153 compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad 2-input NOR gate applications.

Compared with SN74HCT02DR and 74VHC02FT, the M74HCT02RM13TR uniquely combines TSSOP-14 miniaturization, -55°C to +125°C qualification, and proven robustness in safety-critical industrial interfaces - making it optimal where thermal resilience and PCB area are jointly constrained.

Availability

M74HCT02RM13TR is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, automotive body control modules, medical infusion pump safety logic, and avionics display sequencing requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for M74HCT02RM13TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and consumer markets.

The M74HCT02 belongs to ST's high-speed HCT logic family, engineered specifically for seamless interoperability between TTL, NMOS, and CMOS systems in harsh-environment control applications.

FAQ

Is M74HCT02RM13TR pin-compatible with standard 74-series 02 devices?

Yes - it is fully pin- and function-compatible with the 74HCT02, including identical TSSOP-14 pinout (1Y–4Y, 1A–4B, VCC, GND), identical truth table, and matching DC/AC electrical behavior. No layout changes are required when upgrading from legacy 74HCT02 variants in TSSOP-14.

What is the maximum capacitive load this device can drive reliably?

The M74HCT02RM13TR is characterized for CL = 50 pF in AC testing, and its 4 mA output drive supports loads up to 75 pF while maintaining tPLH/tPHL ≤ 36 ns over temperature. For loads exceeding 50 pF, add series termination or reduce trace length to avoid ringing and timing violations.

Does this part support 3.3 V operation?

No - the M74HCT02RM13TR is specified only for 4.5 V to 5.5 V operation. At 3.3 V, VIH/VIL thresholds and output drive strength fall outside guaranteed specifications. For 3.3 V systems, consider ST's 74VHC02 or 74LVC02 families instead.

Are there any special PCB layout recommendations for TSSOP-14?

Yes - maintain 0.2 mm solder mask dams between pins, use thermal relief for VCC/GND pads, place 100 nF X7R ceramic decoupling capacitors within 2 mm of pins 7 and 14, and avoid routing high-speed signals under the package to minimize crosstalk and ground bounce.