STMicroelectronics M74HCT541RM13TR

Overview

M74HCT541RM13TR from STMicroelectronics is a non-inverting octal bus buffer with 3-state outputs, designed for TTL-compatible digital interfacing in industrial control and embedded system backplanes. It features 14 ns typical propagation delay at 4.5 V, ±6 mA symmetrical output drive, and dual enable inputs (G1/G2) for high-impedance control. Its TSSOP-20 package supports dense PCB layouts with input/output separation.

For engineers reviewing the M74HCT541RM13TR datasheet, M74HCT541RM13TR pinout, M74HCT541RM13TR application, or M74HCT541RM13TR equivalent, key selection criteria include 3-state timing behavior, TTL-level input compatibility (VIH ≥ 2.0 V, VIL ≤ 0.8 V), output drive capability under 6 mA load, and operating temperature range up to +125°C.

Technical Context

The device implements an AND-gated 3-state control logic: both G1 and G2 must be low for active output; either high forces all eight Yn outputs into high-impedance. Input protection diodes and C2MOS silicon gate technology ensure robust ESD tolerance and low static power.

It operates within 4.5–5.5 V supply range and supports full industrial temperature range (−55°C to +125°C). Propagation delays tPLH/tPHL are balanced (14 ns typ.), and output transition times (tTLH/tTHL) are specified at 6–12 ns (CL = 50 pF), enabling reliable use in synchronous bus systems.

Key Specifications

Pinout & Package

TSSOP-20 package: 6.5 mm × 4.4 mm body, 0.65 mm pitch, 1.2 mm height, lead-free and RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Compared with SN74HCT541PW and 74VHC541FT, M74HCT541RM13TR delivers guaranteed VOH ≥4.18 V at 6 mA and full industrial temp qualification per unit-critical for deterministic bus timing in safety-critical control systems.

Availability

M74HCT541RM13TR is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive body control modules, test equipment pattern generators, and medical imaging subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for M74HCT541RM13TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power ICs, sensors, and analog/mixed-signal devices for industrial, automotive, and consumer markets.

The M74HCT541 belongs to ST's HCT logic family-engineered for TTL-compatible speed and CMOS efficiency in harsh-environment digital interfacing applications.

FAQ

What is the maximum capacitive load the M74HCT541RM13TR can drive while maintaining 14 ns propagation delay?

The 14 ns typical propagation delay is specified at CL = 50 pF. At CL = 150 pF, delay increases to 18 ns (typ.). Driving >150 pF requires derating timing margins or adding local buffering; the device is not characterized beyond 150 pF in official AC specs.

Can G1 and G2 be tied together and driven by a single controller signal?

Yes-G1 and G2 are logically ANDed, so tying them together creates a single active-low enable. This configuration is functionally valid and commonly used; however, it eliminates independent control of two enable domains, reducing flexibility in multi-master bus arbitration schemes.

Does the M74HCT541RM13TR support hot insertion in live backplanes?

No-while it includes input protection diodes, the device lacks explicit hot-swap circuitry (e.g., slew-rate limiting, undervoltage lockout). Applying VCC before GND or inserting while powered risks latch-up. Use external hot-swap controllers or sequencing circuits for live insertion.

Is the TSSOP-20 package of M74HCT541RM13TR compatible with standard SOIC-20 footprints?

No-the TSSOP-20 (6.5 × 4.4 mm) has 0.65 mm lead pitch and gull-wing leads, whereas SOIC-20 uses 1.27 mm pitch and鸥翼 leads. Mechanical incompatibility prevents direct footprint substitution; re-layout is required for TSSOP adoption.