Analog Devices Inc./Maxim Integrated MAX1029ACEP
- Part No.:
- MAX1029ACEP
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Analog to Digital Converters (ADC)
- Package:
- 20-SSOP (0.154", 3.90mm Width)
- Datasheet:
-
MAX1029ACEP.pdf
- Description:
- 10-BIT 300KSPS ADCS WITH FIFO
- Quantity:
- Payment:

- Shipping:

Inventory:379
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX1029ACEP from Maxim Integrated is a 10-bit, 300ksps serial analog-to-digital converter with integrated temperature sensor (±1.2°C error over –40°C to +85°C), internal 2.5V reference (±30ppm/°C TC), and 16-entry FIFO. It supports 12 single-ended or 6 true differential input channels in unipolar/bipolar modes, operates from a single +3V supply, and interfaces via 10MHz SPI/QSPI/MICROWIRE. It is used in industrial control systems for multichannel voltage and on-chip temperature monitoring.
For engineers reviewing the MAX1029ACEP datasheet, MAX1029ACEP pinout, MAX1029ACEP application, or MAX1029ACEP equivalent, key selection considerations include its 12-channel analog multiplexer configuration, internal FIFO buffering for burst acquisition, AutoShutdown™ power management, and compatibility with low-power embedded microcontroller interfaces requiring precise thermal-aware data acquisition.
Technical Context
The MAX1029ACEP implements a fully differential successive-approximation register (SAR) ADC architecture with integrated track-and-hold, supporting both single-ended and true differential inputs. Its internal oscillator enables autonomous conversion timing in clock modes 00, 01, and 10, while external SCLK up to 10MHz drives mode 11 for maximum 300ksps sampling.
It integrates an on-die temperature sensor with 1/8°C resolution and two's-complement output, always referenced to its internal 2.5V reference. The 16-deep FIFO stores mixed voltage and temperature results, enabling background acquisition without serial bus contention-critical for real-time system supervision where latency and interrupt load must be minimized.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 10-bit SAR - delivers 1024 discrete digital codes with no missing codes over temperature. |
| Sampling Rate | 300ksps max - supports high-speed transient capture when externally clocked (SCLK ≤ 10MHz). |
| INL / DNL | ±1 LSB - ensures monotonicity and linearity critical for closed-loop control feedback accuracy. |
| Temp Sensor Error | ±1.2°C (–40°C to +85°C) - enables reliable board-level thermal monitoring without external sensors. |
| Supply Current | 1.75mA at 300ksps (internal ref) - enables battery-backed or energy-constrained instrumentation designs. |
| Reference | Internal 2.5V ±0.5% (±30ppm/°C) - eliminates need for external precision reference in cost-sensitive applications. |
| Digital Interface | 3-wire SPI/QSPI/MICROWIRE-compatible - interoperates with standard MCU peripherals without protocol translation. |
Pinout & Package
MAX1029ACEP is housed in a 20-pin QSOP package (5.3mm × 10.2mm, 0.65mm pitch) with gull-wing leads. The exposed pad is absent-this is a plastic SOP variant, not TQFN.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | AIN0 | Analog input channel 0 - configurable as single-ended or differential positive input (AIN0/AIN1). |
| 2–10 | AIN1–AIN9 | Additional analog inputs - AIN0–AIN9 available; AIN8/AIN9 support differential pairing only on MAX1029/MAX1031. |
| 11 | REF-/AIN10 | Negative reference input or analog input 10 - dual-function pin; REF- mode disables AIN10 usage. |
| 12 | CNVST/AIN11 | Active-low conversion start or analog input 11 - pulse low to trigger acquisition; function selected via setup register. |
| 13 | REF+ | Positive reference input - accepts internal 2.5V ref or external reference up to VDD + 50mV. |
| 14 | GND | Analog/digital ground - common return for reference, analog inputs, and digital I/O; requires low-impedance connection. |
| 15 | VDD | +2.7V to +3.6V supply - powers core, reference, and interface; bypass with 0.1μF ceramic capacitor. |
| 16 | SCLK | Serial clock input - edge-triggered (rising for DIN, falling for DOUT); 40–60% duty cycle required. |
| 17 | CS | Active-low chip select - enables serial interface; high state places DOUT in high-impedance mode. |
| 18 | DIN | Serial data input - latched on rising SCLK edge; carries 8-bit command bytes (setup, conversion, etc.). |
| 19 | DOUT | Serial data output - outputs 16-bit result MSB-first on falling SCLK edge; tri-stated when CS = high. |
| 20 | EOC | End-of-conversion flag - active-low pulse signals completion of last requested operation (except clock mode 11). |
Key Features
| Feature | Design Value |
|---|---|
| 16-entry FIFO buffer | Stores up to 16 voltage conversions + 1 temperature reading - decouples acquisition from host readout, reducing MCU interrupt overhead. |
| Configurable scan & averaging | Supports programmable channel sequencing (NSCAN1/NSCAN0) and internal averaging (up to 4x) - improves SNR for noisy sensor signals without firmware averaging. |
| True differential T/H architecture | Rejects common-mode noise on matched AIN pairs (e.g., AIN0/AIN1) - essential for industrial signal integrity in EMI-prone environments. |
| AutoShutdown™ mode | Reduces supply current to <0.5μA during idle - extends battery life in portable data loggers and remote sensors. |
| Integrated temperature sensor | Delivers calibrated Celsius output (1/8°C resolution, two's complement) using same internal reference - eliminates calibration drift between voltage and temp measurements. |
Applications
| Industrial Process Monitoring | Patient Vital Sign Acquisition |
|---|---|
Use Scenario: Continuous logging of thermocouple voltages, pressure transducer outputs, and ambient temperature in PLC-based factory automation cabinets. IC Role / Device Role / Timing Role: Multichannel voltage digitizer with on-chip thermal compensation - acquires synchronized analog inputs and die temperature to correct sensor drift in real time. Use Value: Eliminates need for separate temperature sensor and external reference, reducing BOM count and layout area by >30% versus discrete solutions. |
Use Scenario: Portable ECG/SpO₂ monitor acquiring lead voltages, battery voltage, and PCB temperature during clinical use. IC Role / Device Role / Timing Role: Low-power ADC subsystem - performs burst acquisition of 12 physiological channels plus self-temperature every 500ms using internal FIFO and AutoShutdown™. Use Value: Achieves <2mA average current at 100ksps effective rate, enabling >72-hour operation on a single CR2032 coin cell. |
| Data-Acquisition System Front-End | Embedded System Supervision |
Use Scenario: Rack-mounted test equipment measuring multiple DC power rail voltages (12V, 5V, 3.3V, 1.8V), current sense shunt drops, and heatsink temperature. IC Role / Device Role / Timing Role: Precision supervisory ADC - uses internal 2.5V reference and ±1 LSB INL to guarantee ±0.25% full-scale accuracy across all rails. Use Value: Enables single-chip replacement of 4x standalone 12-bit ADCs + 1x temperature IC, cutting assembly cost and test complexity. |
Use Scenario: Real-time health monitoring of FPGA or SoC carrier boards, tracking VCCINT, VCCAUX, VCCO, and junction temperature. IC Role / Device Role / Timing Role: System management controller interface - reads rail voltages and die temperature via SPI in <10μs per channel using scan mode and FIFO. Use Value: Provides deterministic timing for thermal throttling decisions with <50μs total latency from trigger to host-read result. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multichannel ADC with temperature sensing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADS7953IRHBT | 12-bit, 1MSPS, 16-channel, no integrated temp sensor; requires external reference and temperature IC. | Better resolution/speed but higher BOM cost and design complexity for thermal-aware systems. | Select when >10-bit ENOB and >300ksps are mandatory, and board space allows separate thermal sensing. |
| AD7923BRUZ | 12-bit, 200ksps, 8-channel, no FIFO or temp sensor; SPI-only interface (no QSPI/MICROWIRE). | Limited channel count and no autonomous acquisition - requires continuous MCU polling. | Choose for simpler, lower-cost 8-channel systems where temperature monitoring is handled externally. |
Compared with ADS7953IRHBT and AD7923BRUZ, the MAX1029ACEP uniquely integrates FIFO buffering, on-die temperature sensing, and internal reference in a 20-pin QSOP-reducing component count and firmware overhead for compact, thermally aware data acquisition where 10-bit resolution suffices.
Availability
MAX1029ACEP is available at Aetrix Electronics and suitable for industrial process monitoring, portable medical devices, data-acquisition front-ends, and embedded system supervision requiring stable component supply across extended temperature ranges.
Supply support for MAX1029ACEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, automotive, and healthcare applications.
The MAX1027/MAX1029/MAX1031 family was engineered for low-power, multichannel data acquisition in space-constrained systems requiring integrated thermal awareness and minimal external components.
FAQ
What is the operating temperature range specified for the MAX1029ACEP?
The MAX1029ACEP is rated for operation from –40°C to +85°C, matching the extended industrial temperature grade denoted by the "E" in its part number suffix. This range applies to all electrical specifications including INL, DNL, temperature sensor accuracy (±1.2°C), and supply current performance. The device maintains full functionality across this range without derating.
Does the MAX1029ACEP require an external reference, or does it have an internal one?
The MAX1029ACEP includes a factory-trimmed internal 2.5V reference with ±0.5% initial accuracy and ±30ppm/°C temperature coefficient. It can operate fully autonomously using this reference. An external differential reference (0–500mV on REF–, 1.0V–VDD+50mV on REF+) may be substituted, but the internal reference remains mandatory for temperature measurements.
How many analog input channels does the MAX1029ACEP support, and what configurations are available?
The MAX1029ACEP supports 12 single-ended analog inputs (AIN0–AIN11) or 6 true differential pairs (AIN0/AIN1, AIN2/AIN3, AIN4/AIN5, AIN6/AIN7, AIN8/AIN9, AIN10/AIN11). Configuration is controlled via the setup register; each pair can be independently set to unipolar or bipolar mode, with output format (binary or two's complement) automatically determined by mode selection.
What is the purpose and capacity of the FIFO in the MAX1029ACEP?
The MAX1029ACEP contains a 16-deep FIFO that stores complete 16-bit conversion results - up to 16 voltage samples or a mix including one temperature reading. This allows the ADC to perform background acquisitions (e.g., scanning all 12 channels) without blocking the SPI bus, enabling the host MCU to service other tasks while data accumulates for batch readout.
Can the MAX1029ACEP perform simultaneous sampling across multiple channels?
No, the MAX1029ACEP does not support simultaneous sampling. It uses a single SAR core with a multiplexed analog front-end, performing sequential conversions per channel in scan mode. However, its fast 3.5μs acquisition time and FIFO enable tightly spaced sampling (e.g., 12 channels in <50μs total), which is sufficient for most industrial and biomedical monitoring where inter-channel skew under 100ns is not required.
MAX1029ACEP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 20-SSOP (0.154", 3.90mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Number of Bits:
- 10
- Sampling Rate (Per Second):
- 300k
- Number of Inputs:
- 6, 12
- Input Type:
- Differential, Single Ended
- Data Interface:
- 3-Wire, Microwire, QSPI, SPI
- Configuration:
- MUX-S/H-ADC
- Ratio - S/H:ADC:
- 1:1
- Number of A/D Converters:
- 1
- Architecture:
- SAR
- Reference Type:
- External, Internal
- Voltage - Supply, Analog:
- 2.7V ~ 3.6V
- Voltage - Supply, Digital:
- 2.7V ~ 3.6V
- Features:
- Internal Oscillator, Temperature Sensor
- Operating Temperature:
- 0°C ~ 70°C
- Supplier Device Package:
- 20-QSOP
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
MAX1029ACEP FAQ
1.How can I place an order for MAX1029ACEP through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX1029ACEP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX1029ACEP reliable?
The price and inventory of MAX1029ACEP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX1029ACEP is usually 5 days.
3.What payment methods are accepted for MAX1029ACEP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX1029ACEP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX1029ACEP?
MAX1029ACEP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX1029ACEP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX1029ACEP?
For technical support, including MAX1029ACEP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX1029ACEP requirements.
6.How does Aetrix verify that MAX1029ACEP is sourced from the original manufacturer or authorized distributors?
All MAX1029ACEP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX1029ACEP meets industry standards.
7.What is the process for return or replacement of MAX1029ACEP?
All MAX1029ACEP units undergo pre-shipment inspection (PSI). If there is an issue with MAX1029ACEP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX1029ACEP part is unused and in its original packaging.
Return procedure for MAX1029ACEP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX1029ACEP Tags

-
ADC081C021CIMKX/NOPB
Texas Instruments

-
MCP3021A5T-E/OT
Microchip Technology

-
TLA2024IRUGR
Texas Instruments

-
MCP3221A5T-E/OT
Microchip Technology

-
MCP3221A5T-I/OT
Microchip Technology

-
MCP3221A4T-E/OT
Microchip Technology

-
MCP3221A6T-E/OT
Microchip Technology

-
MCP3221A0T-E/OT
Microchip Technology

-
MCP3221A1T-E/OT
Microchip Technology

-
ADC121S021CIMFX/NOPB
Texas Instruments

-
MCP3001-I/MS
Microchip Technology

-
MCP3001-I/SN
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

