Analog Devices Inc./Maxim Integrated MAX1030BETI+
- Part No.:
- MAX1030BETI+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Analog to Digital Converters (ADC)
- Package:
- 28-WFQFN Exposed Pad
- Datasheet:
-
MAX1030BETI+.pdf
- Description:
- IC ADC 10-BIT 300KSPS 28TQFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,269
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX1030BETI+ from Maxim Integrated is a 10-bit, 300ksps serial analog-to-digital converter with integrated temperature sensor (±0.7°C accuracy at +25°C), 16-entry FIFO, and internal 4.096V reference. It supports 16 single-ended or 8 true differential input channels in unipolar/bipolar modes, operates from a single +5V supply, and interfaces via 10MHz SPI/QSPI/MICROWIRE-compatible 3-wire serial port. It is used in industrial control systems for multichannel voltage and temperature monitoring.
For engineers reviewing the MAX1030BETI+ datasheet, MAX1030BETI+ pinout, MAX1030BETI+ application, or MAX1030BETI+ equivalent, this page delivers verified technical context, exact pin functions for the 28-pin TQFN package, real-world design meaning of INL/DNL/THD/SFDR specs, and two validated alternative parts with documented functional and application-level differences.
Technical Context
The MAX1030BETI+ employs a fully differential successive-approximation register (SAR) architecture with on-chip track-and-hold, enabling simultaneous acquisition across 16 analog inputs. Its internal oscillator supports clock modes 00/01/10 (4.4MHz ±10%), while mode 11 enables externally clocked operation up to 300ksps using SCLK ≤10MHz.
It integrates a dedicated temperature-sensing path using the internal reference, delivering results in two's complement format at 1/8°C resolution. The 16-deep FIFO buffers both ADC conversions and temperature readings, allowing burst acquisition without serial bus contention - critical for deterministic data logging in embedded supervisory systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 10-bit SAR - delivers 1024 discrete output codes; sufficient for precision system supervision where 0.1% full-scale resolution is required. |
| Sampling Rate | 300ksps max (external clock) - supports undersampling of signals up to 1MHz bandwidth, enabling high-frequency transient capture in motor control feedback loops. |
| INL / DNL | ±1 LSB each - guarantees monotonicity and no missing codes over –40°C to +85°C, essential for closed-loop control stability and calibration integrity. |
| SINAD / SFDR | 61dB / 89dBc at 30kHz - ensures clean digitization of low-amplitude sensor signals (e.g., thermocouples, strain gauges) in noisy industrial environments. |
| Temp Sensor Accuracy | ±0.7°C at +25°C, ±1.2°C over full range - enables board-level thermal management without external sensor calibration. |
| Supply Current | 2.3mA at 300ksps (internal ref) - allows continuous high-speed acquisition in power-constrained remote I/O modules. |
| Reference Voltage | Internal 4.096V ±1.7% (±20ppm/°C TC) - eliminates need for external precision reference, reducing BOM count and layout area in space-sensitive designs. |
Pinout & Package
The MAX1030BETI+ is packaged in a 28-pin 5mm × 5mm TQFN with exposed pad (EP), RoHS-compliant and lead-free. Thermal performance is optimized by connecting EP directly to GND plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| AIN0–AIN15 | Analog Input Channels | 16 configurable single-ended or 8 differential pairs; AIN12–AIN15 available only on MAX1030 - enables full channel utilization in multi-sensor industrial nodes. |
| REF+/REF− | Reference Inputs | REF+ accepts 1.0V to VDD+50mV; REF− serves as negative reference or analog input AIN14 - supports flexible ratiometric or absolute measurement schemes. |
| CNVST/AIN15 | Conversion Start / Analog Input | Active-low conversion trigger; dual-function pin allows hardware-triggered sampling without CPU intervention - reduces firmware overhead in real-time control. |
| SCLK, DIN, DOUT, CS | 3-Wire Serial Interface | 10MHz SPI/QSPI/MICROWIRE-compatible; CPOL/CPHA agnostic - interoperates with legacy microcontrollers without custom driver development. |
| EOC | End-of-Conversion Flag | Active-low open-drain output; asserts after conversion completion in clock modes 00/01/10 - enables interrupt-driven data retrieval and precise timing synchronization. |
| VDD, GND, EP | Power & Ground | +5V ±5% supply; EP must be soldered to GND plane for thermal dissipation and noise immunity - mandatory for stable 10-bit performance at full speed. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Temperature Sensor | ±0.7°C accuracy at +25°C, 1/8°C resolution - eliminates discrete thermal sensor and signal conditioning, simplifying thermal monitoring in PLC backplanes. |
| 16-Entry FIFO Buffer | Stores 16 ADC results + 1 temp reading; overwrites oldest on overflow - enables burst acquisition of multiple channels before host read, improving system throughput in data loggers. |
| True Differential Track/Hold | Supports 8 differential pairs with common-mode rejection - rejects noise in long-line sensor interfaces (e.g., 4–20mA transmitters, RTD bridges) without external instrumentation amps. |
| Four Clock Modes | CKSEL[1:0] selects internal timer, CNVST-triggered, serial-initiated, or SCLK-synchronized acquisition - provides flexibility across deterministic control, event-driven sensing, and high-throughput streaming. |
| AutoShutdown™ | Reduces supply current to <5μA during idle - extends battery life in portable condition-monitoring equipment between measurement cycles. |
Applications
| Industrial Process Monitoring | Patient Vital Sign Acquisition |
|---|---|
Use Scenario: Continuous monitoring of 12+ analog sensors (pressure, flow, temperature) in a modular PLC I/O rack. IC Role / Device Role / Timing Role: Central multichannel ADC performing synchronized voltage and on-die temperature sampling every 3.3ms (300ksps aggregate). Use Value: 16-channel capability eliminates need for multiple smaller ADCs; FIFO enables gapless data capture during host bus arbitration delays. |
Use Scenario: Portable ECG/SpO₂ monitor acquiring biopotential signals and ambient temperature for sensor drift compensation. IC Role / Device Role / Timing Role: Simultaneous bipolar differential ECG channel (AIN0/AIN1) and unipolar thermistor input (AIN2), sampled at 1ksps per channel. Use Value: Internal reference and temp sensor eliminate calibration drift; ±1 LSB DNL ensures accurate R-wave amplitude quantization for arrhythmia detection. |
| Data Logging in Harsh Environments | Motor Drive Feedback Sensing |
Use Scenario: Standalone environmental logger deployed in oil-field telemetry units, operating unattended for months. IC Role / Device Role / Timing Role: Low-power ADC performing periodic 16-channel scans (voltage, current, temp) using AutoShutdown™ between bursts. Use Value: 2.3mA active current + sub-5μA shutdown enables >1-year battery life; –40°C to +85°C rating ensures reliability in desert/winter deployments. |
Use Scenario: Real-time phase current and DC-link voltage sensing in 3-phase inverter control boards. IC Role / Device Role / Timing Role: High-speed acquisition of three shunt-based currents (differential) and bus voltage (single-ended) with synchronized sampling. Use Value: 1MHz input bandwidth and 300ksps rate support FOC algorithms requiring <3.3μs sampling interval; true differential inputs reject PWM switching noise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multichannel ADC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADS7953IRHBT | 12-bit, 1MSPS, SPI interface, no internal temp sensor or FIFO; requires external reference. | Better resolution/speed but lacks integrated temp sensing and burst buffering - demands additional ICs for thermal monitoring and data coalescence. | Select when higher resolution (12-bit) and faster throughput (>300ksps) outweigh integration benefits and BOM simplicity. |
| AD7928BRUZ | 12-bit, 1MSPS, 8-channel, no FIFO or temp sensor; uses external reference only; 20-pin TSSOP package. | Lacks on-chip FIFO and temperature sensor - requires host MCU to manage timing-critical conversions and external thermal sensing. | Choose for cost-sensitive, lower-channel-count systems where external reference and separate temp IC are acceptable. |
Compared with MAX1030BETI+, ADS7953IRHBT offers higher resolution and speed but increases system complexity with external reference and no thermal sensing, while AD7928BRUZ trades integration for lower cost and channel count - making MAX1030BETI+ optimal for compact, self-contained industrial monitoring where 10-bit fidelity, FIFO buffering, and on-die temperature are design requirements.
Availability
MAX1030BETI+ is available at Aetrix Electronics and suitable for industrial control systems, patient monitoring devices, and environmental data loggers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MAX1030BETI+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, medical, and communications applications.
The MAX1026/MAX1028/MAX1030 product line was engineered specifically for embedded system supervision - integrating ADC, temperature sensing, FIFO, and serial interface into a single chip to reduce size, cost, and firmware complexity in multichannel monitoring applications.
FAQ
What is the maximum sampling rate achievable with MAX1030BETI+ using its internal clock?
The MAX1030BETI+ achieves up to 300ksps only when using an external clock (clock mode 11). With its internal oscillator (modes 00/01/10), the maximum sampling rate is limited to approximately 275ksps due to ±10% frequency tolerance of the 4.4MHz internal clock. For deterministic timing in closed-loop control, external clocking is recommended to guarantee 300ksps operation. The MAX1030BETI+ datasheet specifies 300ksps as the absolute maximum under external clock conditions.
Does MAX1030BETI+ support true differential measurements across all 16 input channels?
No. MAX1030BETI+ supports true differential measurements only across predefined channel pairs: AIN0/AIN1, AIN2/AIN3, AIN4/AIN5, AIN6/AIN7, AIN8/AIN9, AIN10/AIN11, AIN12/AIN13, and AIN14/AIN15 - totaling 8 differential channels. Single-ended operation is available on all 16 inputs. The device does not support arbitrary differential pairing (e.g., AIN0 vs AIN5); pairing is fixed in hardware and configured via the setup register's DIFFSEL bits.
How is the internal temperature sensor calibrated in MAX1030BETI+?
The MAX1030BETI+ internal temperature sensor is factory-trimmed and specified for ±0.7°C accuracy at +25°C (Grade B), degrading to ±1.2°C over –40°C to +85°C. It uses the internal 4.096V reference exclusively - no external reference affects temperature readings. Output is two's complement, 1/8°C resolution (e.g., 0x0100 = +32.0°C), and conversion time is 55μs. Calibration data is not user-accessible; accuracy reflects total error including nonlinearity and power-supply rejection (0.3°C/V).
Can MAX1030BETI+ operate with an external reference while still using the internal temperature sensor?
Yes. The MAX1030BETI+ always uses its internal reference for temperature measurements, regardless of whether VREF is derived internally (4.096V) or externally (applied to REF+/REF−). This is explicitly stated in the datasheet Note 9 and Electrical Characteristics table: "Temperature measurements always use the internal reference." External reference configuration only affects analog voltage conversions - ensuring consistent thermal accuracy even when optimizing ADC full-scale range for specific sensor outputs.
What is the function of the exposed pad (EP) on the MAX1030BETI+ TQFN package?
The exposed pad (EP) on the MAX1030BETI+ 28-pin TQFN package must be soldered to a solid GND plane for both thermal dissipation and electrical noise reduction. It is not electrically isolated and forms part of the internal ground connection. Failure to connect EP to GND degrades AC performance (increased THD/SFDR), raises junction temperature beyond rated limits, and may cause INL/DNL specification violations - especially at 300ksps operation where power dissipation reaches ~12mW. The datasheet specifies EP as "Connect EP to GND" in the Pin Description table.
MAX1030BETI+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 28-WFQFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Number of Bits:
- 10
- Sampling Rate (Per Second):
- 300k
- Number of Inputs:
- 8, 16
- Input Type:
- Differential, Single Ended
- Data Interface:
- SPI
- Configuration:
- S/H-ADC
- Ratio - S/H:ADC:
- 1:1
- Number of A/D Converters:
- 1
- Architecture:
- SAR
- Reference Type:
- External, Internal
- Voltage - Supply, Analog:
- 5V
- Voltage - Supply, Digital:
- 5V
- Features:
- Temperature Sensor
- Operating Temperature:
- -40°C ~ 85°C
- Supplier Device Package:
- 28-TQFN (5x5)
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
MAX1030BETI+ FAQ
1.How can I place an order for MAX1030BETI+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX1030BETI+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX1030BETI+ reliable?
The price and inventory of MAX1030BETI+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX1030BETI+ is usually 5 days.
3.What payment methods are accepted for MAX1030BETI+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX1030BETI+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX1030BETI+?
MAX1030BETI+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX1030BETI+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX1030BETI+?
For technical support, including MAX1030BETI+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX1030BETI+ requirements.
6.How does Aetrix verify that MAX1030BETI+ is sourced from the original manufacturer or authorized distributors?
All MAX1030BETI+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX1030BETI+ meets industry standards.
7.What is the process for return or replacement of MAX1030BETI+?
All MAX1030BETI+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX1030BETI+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX1030BETI+ part is unused and in its original packaging.
Return procedure for MAX1030BETI+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX1030BETI+ Tags

-
ADC081C021CIMKX/NOPB
Texas Instruments

-
MCP3021A5T-E/OT
Microchip Technology

-
TLA2024IRUGR
Texas Instruments

-
MCP3221A5T-E/OT
Microchip Technology

-
MCP3221A5T-I/OT
Microchip Technology

-
MCP3221A4T-E/OT
Microchip Technology

-
MCP3221A6T-E/OT
Microchip Technology

-
MCP3221A0T-E/OT
Microchip Technology

-
MCP3221A1T-E/OT
Microchip Technology

-
ADC121S021CIMFX/NOPB
Texas Instruments

-
MCP3001-I/MS
Microchip Technology

-
MCP3001-I/SN
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

