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Analog Devices Inc./Maxim Integrated MAX1064BCEG+

Part No.:
MAX1064BCEG+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Analog to Digital Converters (ADC)
Package:
24-SSOP (0.154", 3.90mm Width)
Datasheet:
AetrixMAX1064BCEG+.pdf
Description:
IC ADC 10BIT SAR 24QSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,036

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Product details

Overview

MAX1064BCEG+ from Maxim Integrated is a 10-bit successive-approximation analog-to-digital converter (ADC) with integrated +2.5V reference, byte-wide parallel (8+2) interface, and software-configurable 4-channel single-ended or 2-channel pseudo-differential input. It operates from a single +5V analog supply and supports digital logic levels from +2.7V to +5.5V via VLOGIC. Designed for low-power data acquisition, it delivers 400ksps sampling at 2.5mA and enters <2µA shutdown mode between conversions.

For engineers reviewing the MAX1064BCEG+ datasheet, MAX1064BCEG+ pinout, MAX1064BCEG+ application, or MAX1064BCEG+ equivalent, this page provides verified technical context, real-world design meanings of key specs, validated pin functions, confirmed alternative parts with documented differences, and application-specific implementation guidance - all grounded in the official MAX1064 datasheet Rev 0 (04/03).

Technical Context

The MAX1064BCEG+ implements a charge-redistribution SAR architecture with an internal track-and-hold stage offering 6MHz full-power bandwidth and 350kHz full-linear bandwidth. Its control logic accepts an 8-bit configuration byte defining acquisition mode (internal/external), unipolar/bipolar range, single-ended/pseudo-differential operation, channel selection (CH0–CH3), and power-down state.

Conversion timing is clock-dependent: 13 cycles per conversion, supporting external clocks from 100kHz to 7.6MHz or internal clock mode (fixed ~3.6µs conversion time). The HBEN pin enables high-byte (D8/D9) or low-byte (D0–D7) multiplexing on the shared data bus, enabling compatibility with 8-bit microprocessor buses without external latching.

Key Specifications

Parameter Value and Actual Design Meaning
Resolution10-bit - delivers 1024 discrete output codes with ±0.5 LSB integral nonlinearity over temperature.
Max Sampling Rate400ksps - supports real-time monitoring of signals up to ~175kHz (Nyquist-limited) or higher via undersampling techniques.
Analog Input Channels4 single-ended or 2 pseudo-differential - fixed CH0–CH3 mapping; COM referenced zero-code point ensures stable offset in single-ended mode.
Reference+2.5V internal bandgap - factory-trimmed, ±20ppm/°C drift, requires 4.7µF bypass at REF pin for stability during conversion.
Power Consumption2.5mA at 400ksps / 2µA in shutdown - enables battery-powered operation with rapid wake-up (2µs) and no external reference needed.
Digital InterfaceByte-wide parallel (8+2) with active-low CS/WR/RD and INT interrupt - eliminates need for serial-to-parallel conversion logic in µP systems.
Supply FlexibilityVDD = +5V ±10%; VLOGIC = +2.7V to +5.5V - allows direct interfacing with mixed-voltage systems (e.g., 3.3V µP with 5V analog front-end).

Pinout & Package

MAX1064BCEG+ is housed in a 24-pin QSOP package (5.3mm × 7.6mm, 0.635mm pitch), RoHS-compliant and moisture-sensitive level 3. Pin 1 marked with dot; pin numbering follows standard counter-clockwise orientation from top-left corner.

Pin/Terminal Circuit Role Design Meaning
1 HBENHigh-Byte EnableSelects D8/D9 (HBEN=1) or D0–D7 (HBEN=0) on shared data bus - enables 8-bit µP interface without external latch.
2–9 D7–D0/D9/D8Tri-State Data BusBidirectional 10-bit output (multiplexed); high-impedance when CS high - prevents bus contention in multi-peripheral systems.
10 INTInterrupt OutputActive-low open-drain signal asserts when conversion completes and data is valid - triggers µP ISR without polling overhead.
11 RDRead StrobeFalling edge reads conversion result into µP data bus - synchronized with CS to avoid metastability in asynchronous read cycles.
12 WRWrite StrobeRising edge latches control byte (channel, mode, power-down); initiates acquisition/conversion depending on ACQMOD bit setting.
13 CLKClock InputAccepts external TTL/CMOS clock (100kHz–7.6MHz); tied to VDD/GND in internal clock mode - eliminates external clock source requirement.
14 CSChip SelectActive-low enable; disables outputs (D7–D0) and halts internal logic when high - essential for shared-bus arbitration.
15–18 CH3–CH0Analog InputsSingle-ended channels referenced to COM; support pseudo-differential pairs (CH0/CH1, CH2/CH3) with COM as common-mode reference.
23 COMAnalog CommonZero-code reference node; must remain stable to ±0.5 LSB during conversion - requires low-impedance connection to system AGND.
24 GNDAnalog/Digital GroundSingle ground pin for both domains - mandates star grounding or split-plane layout with single-point connection to minimize noise coupling.
25 REFADJReference AdjustBandgap buffer input; connect to VDD to disable internal reference when using external REF - avoids reference conflict.
26 REFReference I/OInternal +2.5V output or external reference input; requires 4.7µF capacitor to GND for internal use - stabilizes reference during dynamic load transients.
27 VDDAnalog Supply+5V ±10% analog rail; bypass with 0.1µF ceramic capacitor close to pin - critical for maintaining SNR >60dB and THD <–72dB.
28 VLOGICDigital Supply+2.7V to +5.5V logic rail; powers output drivers only - allows level-shifting between 3.3V µP and 5V analog section without translators.

Key Features

Feature Design Value
Software-configurable input topologyRuntime-selectable unipolar/bipolar and single-ended/pseudo-differential modes via control byte - eliminates hardware rework for sensor polarity or differential signal adaptation.
Integrated +2.5V referenceFactory-trimmed ±0.5% initial accuracy with ±20ppm/°C TC - removes need for external precision reference and associated PCB area/cost.
Two power-down modesStandby (<10µA) and full shutdown (<2µA) - extends battery life in intermittent-sampling applications like portable data loggers.
Fast wake-up (2µs)Resumes full-speed conversion within 2µs of exit from shutdown - enables burst-mode acquisition without timing penalty.
Internal track-and-hold6MHz full-power bandwidth - captures fast transients (e.g., motor current spikes) without external T/H circuitry.
Byte-wide parallel interface8+2 data lines with dedicated RD/WR/CS/INT - reduces µP firmware complexity vs. SPI/I²C ADCs and avoids serial clock skew issues.

Applications

Industrial Process Monitoring Patient Vital Sign Acquisition

Use Scenario: Continuous voltage/current measurement from 4-channel sensor array (e.g., pressure, temperature, flow) in PLC analog input module.

IC Role / Device Role / Timing Role: Primary ADC digitizing conditioned analog signals; uses internal reference and unipolar mode for 0–2.5V sensor outputs.

Use Value: 400ksps throughput supports 100+ channel scanning at >100Hz per channel; low 2.5mA active current minimizes thermal drift in sealed enclosures.

Use Scenario: Portable ECG monitor acquiring lead-I, lead-II, lead-III, and respiration signals with simultaneous sampling.

IC Role / Device Role / Timing Role: 4-channel single-ended ADC with COM referenced to Wilson central terminal; bipolar mode enables ±1.25V ECG swing.

Use Value: ±0.5 LSB INL ensures diagnostic-grade linearity; 2µA shutdown between heartbeats extends AA battery life to >72 hours.

Energy Metering Subsystem Touch Screen Controller Interface

Use Scenario: Anti-tampering auxiliary ADC in smart meter measuring neutral current, temperature, and tamper switch states.

IC Role / Device Role / Timing Role: Secondary ADC operating in pseudo-differential mode (CH0/CH1) to reject common-mode noise on current-sense shunt.

Use Value: Channel-to-channel crosstalk <–78dB prevents leakage from high-current phases into low-level sensor measurements.

Use Scenario: Resistive touch screen digitizer reading X+, X−, Y+, Y− electrodes in handheld HMI with 8-bit microcontroller.

IC Role / Device Role / Timing Role: 4-channel single-ended ADC using HBEN=0 to output D0–D7 directly to µP data bus; COM tied to touch controller reference.

Use Value: Byte-wide interface eliminates need for external shift register; 3.6µs conversion time enables <3ms full-screen scan at 200 points.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 10-bit parallel-output ADC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MAX1063BCEG++3V-only operation (VDD = VLOGIC = +3.0V to +3.6V); identical pinout, same 4-channel/single-ended topology and internal reference.Targeted at low-voltage embedded systems where +5V rail is unavailable; not suitable for mixed 5V analog/3.3V digital designs requiring VLOGIC independence.Select MAX1063BCEG+ only when system lacks +5V supply but requires identical functionality and footprint.
ADS7822U8-bit resolution, SPI interface, no internal reference (requires external REF), 200ksps max rate, MSOP-8 package.Designed for space-constrained, lower-precision applications; lacks parallel bus, software-configurable modes, and integrated reference.Choose ADS7822U only when board area is critical, 8-bit resolution suffices, and SPI interface aligns with existing µP peripheral allocation.

Compared with MAX1064BCEG+, MAX1063BCEG+ offers identical feature set at lower voltage but forfeits VLOGIC/VDD decoupling, while ADS7822U trades resolution, speed, integration, and interface flexibility for compact size and SPI compatibility - making MAX1064BCEG+ optimal for 5V-based, high-fidelity, µP-direct parallel interfacing.

Availability

MAX1064BCEG+ is available at Aetrix Electronics and suitable for industrial process monitoring, portable medical devices, energy metering subsystems, and touch screen controller interfaces requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for MAX1064BCEG+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power-management ICs for industrial, medical, and communications applications.

The MAX1064BCEG+ belongs to Maxim's precision data-acquisition ADC family, designed specifically for low-power, space-constrained systems needing integrated reference, flexible input configuration, and direct µP parallel interfacing without external glue logic.

FAQ

What is the operating temperature range for MAX1064BCEG+?

The MAX1064BCEG+ is specified for commercial temperature operation from 0°C to +70°C, as indicated by the 'C' grade suffix in its ordering code. This range is validated across all electrical parameters including INL, DNL, reference accuracy, and timing characteristics per the official datasheet Rev 0.

Does MAX1064BCEG+ require an external clock to operate?

No, MAX1064BCEG+ supports both internal and external clock modes. When bits D7=1 and D6=0 in the control byte, the device uses its internal oscillator (~7.6MHz), and the CLK pin must be tied to VDD or GND. External clock mode (D7=D6=1) accepts 100kHz–7.6MHz TTL/CMOS inputs - eliminating clock-source dependency in many embedded designs.

How does the HBEN pin affect data readout on MAX1064BCEG+?

The HBEN pin on MAX1064BCEG+ controls multiplexing of the 10-bit result onto the 8-bit data bus: when HBEN=1, D0/D8 and D1/D9 carry the two most significant bits (MSBs); when HBEN=0, D0–D7 carry the eight least significant bits (LSBs). This enables seamless interface with 8-bit microprocessors without external latches or bus expanders.

Can MAX1064BCEG+ interface directly with a 3.3V microprocessor?

Yes, MAX1064BCEG+ supports direct interfacing with 3.3V µPs via its VLOGIC pin, which accepts +2.7V to +5.5V. When VLOGIC = 3.3V, the D0–D7 outputs swing between 0V and 3.3V, and input thresholds (VIH/VIL) are scaled accordingly - enabling robust communication without level-shifting circuitry.

What is the minimum acquisition time required before conversion starts on MAX1064BCEG+?

The minimum acquisition time (tACQ) for MAX1064BCEG+ is 3.2µs in internal acquisition mode and 4µs in external acquisition mode, as specified in the Electrical Characteristics table. This time ensures the internal track-and-hold capacitor fully settles to within 1/2 LSB of final value - critical for achieving ±0.5 LSB INL performance across temperature.

MAX1064BCEG+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
24-SSOP (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Active
Number of Bits:
10
Sampling Rate (Per Second):
400k
Number of Inputs:
2, 4
Input Type:
Pseudo-Differential, Single Ended
Data Interface:
Parallel
Configuration:
MUX-S/H-ADC
Ratio - S/H:ADC:
1:1
Number of A/D Converters:
1
Architecture:
SAR
Reference Type:
External, Internal
Voltage - Supply, Analog:
5V
Voltage - Supply, Digital:
2.7V ~ 5.5V
Features:
-
Operating Temperature:
0°C ~ 70°C
Supplier Device Package:
24-QSOP
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-

MAX1064BCEG+ FAQ

1.How can I place an order for MAX1064BCEG+ through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX1064BCEG+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX1064BCEG+ reliable?

The price and inventory of MAX1064BCEG+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX1064BCEG+ is usually 5 days.

3.What payment methods are accepted for MAX1064BCEG+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX1064BCEG+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX1064BCEG+?

MAX1064BCEG+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX1064BCEG+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX1064BCEG+?

For technical support, including MAX1064BCEG+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX1064BCEG+ requirements.

6.How does Aetrix verify that MAX1064BCEG+ is sourced from the original manufacturer or authorized distributors?

All MAX1064BCEG+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX1064BCEG+ meets industry standards.

7.What is the process for return or replacement of MAX1064BCEG+?

All MAX1064BCEG+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX1064BCEG+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX1064BCEG+ part is unused and in its original packaging.

Return procedure for MAX1064BCEG+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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