Analog Devices Inc./Maxim Integrated MAX13013EBT

Overview

The MAX13013EBT from Maxim Integrated is a single-channel bidirectional logic-level translator enabling 100Mbps data transfer between +1.2V to +3.6V voltage domains. It features independent VL and VCC supplies, active-high EN control, tri-state capability, and operates across –40°C to +85°C. Used in SPI/MICROWIRE interfaces between low-voltage ASICs and higher-voltage systems.

For engineers reviewing the MAX13013EBT datasheet, MAX13013EBT pinout, MAX13013EBT application, or MAX13013EBT equivalent, this page delivers verified electrical specs, UCSP-6 package details, timing behavior under 15pF load, supply current vs. temperature, and real-world level-shifting use cases in portable communications and GPS modules.

Technical Context

The MAX13013EBT implements a one-shot accelerator output stage architecture that activates only during signal transitions on either I/O VL_ or I/O VCC_, minimizing quiescent current. Its bidirectional path supports simultaneous VL↔VCC translation without inversion on a single line.

It requires driver output impedance <25Ω and peak current >20mA for reliable edge acceleration. Input thresholds are defined as VIHL/VILL = 2/3×VL and 1/3×VL, while VOHL/VOLL = 2/3×VL and 1/3×VL at 20µA load - ensuring CMOS-compatible switching margins across its full VL (1.2V–VCC−0.4V) and VCC (1.65V–3.6V) ranges.

Key Specifications

Pinout & Package

MAX13013EBT is packaged in a 3 × 2 wafer-level chip-scale package (UCSP-6) with bumps on the bottom of the die. The package measures 1.4mm × 1.0mm × 0.5mm and is lead-free and RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with TXS0101DCKR and SN74AVC1T45DBVR, the MAX13013EBT uniquely delivers true bidirectional translation without direction pins or pullups, guarantees 100Mbps at 1.8V VL, and provides ultra-low 0.03µA tri-state VCC current - making it optimal for compact, battery-critical, high-speed portable interfaces.

Availability

MAX13013EBT is available at Aetrix Electronics and suitable for GPS modules, portable POS terminals, cell phone baseband interfaces, and SPI flash bridges requiring stable component supply across industrial temperature ranges and long production lifecycles.

Supply support for MAX13013EBT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-speed digital ICs for industrial, medical, automotive, and communications applications.

The MAX13013EBT belongs to Maxim's high-speed level translation product line, engineered specifically for multivoltage system interconnect in space-constrained, low-power portable electronics.

FAQ

What is the minimum VL voltage supported by the MAX13013EBT?

The MAX13013EBT supports VL down to +1.2V, provided VL ≤ VCC − 0.4V. At VL = 1.2V, the device guarantees 80Mbps data rate and maintains valid input thresholds (VIHL = 0.8V, VILL = 0.4V) and output drive (VOHL = 0.8V, VOLL = 0.4V at 20µA). This enables direct interfacing with 1.2V FPGA I/O banks and ultra-low-power microcontrollers. The MAX13013EBT remains functional even during VL > VCC at startup, preventing latch-up.

Does the MAX13013EBT require external pullup resistors on its I/O lines?

No, the MAX13013EBT does not require external pullup resistors. Its I/O VL_ pins integrate 120Ω pullup and 75Ω pulldown networks, while I/O VCC_ pins include 2.5kΩ pullup/pulldown resistors - sufficient for CMOS input biasing and bus termination. External pullups would conflict with these internal networks and degrade rise/fall times. The MAX13013EBT's architecture relies on active one-shot drivers, not passive resistive biasing, for edge acceleration.

How does the enable (EN) pin affect power consumption in the MAX13013EBT?

When EN is driven low (GND), the MAX13013EBT places both I/O VL1 and I/O VCC1 into high-impedance tri-state and reduces VCC supply current to 0.03µA and VL supply current to 0.1µA at +25°C. This represents a >99.9% reduction versus active-mode current (0.1µA). The tri-state condition isolates both voltage domains electrically, eliminating bus contention and leakage paths - a key feature for MAX13013EBT use in battery-backed GPS modules during deep-sleep cycles.

Can the MAX13013EBT translate between 1.8V and 3.3V domains at 100Mbps?

Yes, the MAX13013EBT guarantees 100Mbps data rate when VL ≥ 1.8V and load capacitance ≤ 15pF on either I/O side. With VL = 1.8V and VCC = 3.3V, propagation delays are 6.5ns (VL→VCC) and 6ns (VCC→VL), and rise/fall times are ≤2.5ns (I/O VL_) and ≤4ns (I/O VCC_) - fully compliant with SPI Mode 0/3 timing at 50MHz clock (20ns period). The MAX13013EBT's one-shot accelerator architecture ensures consistent edge speed across this voltage combination.

What package type is used for the MAX13013EBT, and what are its key mechanical dimensions?

The MAX13013EBT uses a 3 × 2 UCSP-6 (wafer-level chip-scale) package with bumps on the bottom of the die. Its footprint is 1.4mm × 1.0mm, thickness is 0.5mm, and bump pitch is 0.5mm. The package is lead-free, RoHS-compliant, and designed for reflow soldering per JEDEC J-STD-020. This ultra-compact form factor makes the MAX13013EBT ideal for space-constrained applications like wearable GPS trackers and slim smartphone modules where SC70 or SOT-23 packages are prohibitively large.