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Analog Devices Inc./Maxim Integrated MAX13013EBT-T
- Part No.:
- MAX13013EBT-T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX13013EBT-T.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 6UCSP
- Quantity:
- Payment:
- Shipping:
Inventory:19,551
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Product details
Overview
MAX13013EBT-T from Maxim Integrated is a single-channel bidirectional logic-level translator IC enabling 100Mbps data transfer between +1.2V to +1.8V low-voltage domains (VL side) and +1.65V to +3.6V higher-voltage domains (VCC side), with active-high enable (EN), tri-state operation, and ultra-low 0.1µA VL supply current when disabled. It supports SPI™ and MICROWIRE™ interface translation in portable communication devices and GPS modules.
For engineers reviewing the MAX13013EBT-T datasheet, MAX13013EBT-T pinout, MAX13013EBT-T application, or MAX13013EBT-T equivalent, key selection criteria include guaranteed 100Mbps data rate at VL ≥ 1.8V, bidirectional level shifting without inversion, 0.03µA VCC quiescent current in disable mode, and compatibility with UCSP-6 package layout constraints for space-constrained PCBs.
Technical Context
The MAX13013EBT-T implements a one-shot accelerator output architecture that activates only during signal transitions on either I/O VL_ or I/O VCC_, minimizing static power while achieving sub-4ns rise/fall times at 15pF load. Its dual-rail design accepts independent VL (+1.2V to VCC − 0.4V) and VCC (+1.65V to +3.6V) supplies, enabling interoperability between 1.2V ASICs and 3.3V microcontrollers.
Logic thresholds are defined as VIHL/VILL = 2/3×VL and 1/3×VL, and VIHC/VILC = 2/3×VCC and 1/3×VCC, ensuring robust noise margins across voltage combinations. The EN input directly controls tri-state behavior on both sides, reducing VCC current to 0.03µA and VL current to 0.1µA when asserted low.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 100Mbps guaranteed at VL ≥ 1.8V; 80Mbps at VL = 1.2V–1.79V - defines maximum usable clock frequency for SPI/MICROWIRE interfaces |
| VCC Supply Range | +1.65V to +3.6V - supports direct connection to 1.8V, 2.5V, 3.3V system rails without external regulators |
| VL Supply Range | +1.2V to (VCC − 0.4V) - enables translation from 1.2V FPGA I/O to 3.3V host processor, with safe startup margin |
| Disable Current (VCC) | 0.03µA - allows battery-powered systems to maintain multi-year shelf life in sleep mode |
| Disable Current (VL) | 0.1µA - ensures minimal leakage impact on ultra-low-power 1.2V sensor domain supplies |
| Propagation Delay | 6.5ns (VL→VCC), 6ns (VCC→VL) at 15pF - supports timing-critical high-speed serial links with <4ns part-to-part skew |
| Output Impedance | 12.5Ω (VL side), 18.5Ω (VCC side) - matches standard transmission line impedances for clean edge integrity |
Pinout & Package
The MAX13013EBT-T is housed in a 3 × 2 UCSP-6 (Ultra Compact Silicon Package) with bumps on the bottom of the die, measuring 1.5mm × 1.0mm × 0.5mm. This wafer-level chip-scale package enables board area reduction >70% versus SC70 alternatives.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O VL1 | Bidirectional data terminal referenced to VL rail; connects to 1.2V/1.8V logic (e.g., FPGA I/O bank) |
| 2 | EN | Active-high enable input; pulled to VL for normal operation; drives all I/Os into high-impedance state when low |
| 3 | GND | Analog/digital ground reference shared by both voltage domains; requires low-inductance connection to PCB ground plane |
| 4 | I/O VCC1 | Bidirectional data terminal referenced to VCC rail; connects to 2.5V/3.3V controller (e.g., MCU SPI port) |
| 5 | VL | Low-voltage supply input (+1.2V to VCC−0.4V); must be bypassed with 0.1µF ceramic capacitor near the pin |
| 6 | VCC | High-voltage supply input (+1.65V to +3.6V); must be bypassed with 0.1µF ceramic capacitor near the pin |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional level translation | Enables single-line, non-inverting data flow in both VL↔VCC directions without external direction control logic |
| One-shot accelerator architecture | Reduces dynamic power by activating output drivers only during signal transitions, cutting average current vs. always-on designs |
| Guaranteed 100Mbps operation | Validated across full temperature range (−40°C to +85°C) and voltage combinations, supporting industrial-grade timing compliance |
| Tri-state enable control | EN input places both I/O VL1 and I/O VCC1 in high-impedance state, isolating domains during system reset or power sequencing |
| UCSP-6 package | 1.5mm × 1.0mm footprint with solder bumps eliminates leadframe parasitics, improving signal integrity at 100Mbps |
Applications
| Portable GPS Receivers | SPI Interface Translation |
|---|---|
|
Use Scenario: Interfacing a 1.2V GNSS baseband ASIC to a 3.3V application processor over SPI bus. IC Role / Device Role / Timing Role: Bidirectional level translator on MOSI, MISO, and SCLK lines, preserving timing alignment and eliminating level-shifter-induced skew. Use Value: Enables direct connection without discrete resistors or additional buffers, reducing BOM count and PCB area in compact GPS modules. |
Use Scenario: Translating SPI signals between a 1.8V FPGA configuration interface and a 3.3V flash memory device. IC Role / Device Role / Timing Role: Single-channel translator deployed per signal line to maintain 100Mbps SCLK edge fidelity and setup/hold timing margins. Use Value: Guarantees sub-7ns propagation delay and <4ns skew across channels, preventing SPI frame corruption at maximum clock rates. |
| Low-Power Sensor Hubs | Cell Phone Baseband Interfaces |
|
Use Scenario: Connecting multiple 1.2V I²C sensors to a 2.5V sensor hub MCU in wearable health monitors. IC Role / Device Role / Timing Role: Level translator placed on each sensor's SDA/SCL pair, with EN tied to hub-controlled power rail for domain isolation. Use Value: Delivers 0.1µA VL supply current in disable mode, extending battery life during sensor idle periods without sacrificing wake-up latency. |
Use Scenario: Bridging 1.8V application processor GPIOs to 3.3V RF transceiver control lines in LTE handsets. IC Role / Device Role / Timing Role: Translator used for antenna switch control, PA enable, and band-select signals requiring fast, glitch-free voltage translation. Use Value: Sub-4ns rise/fall times prevent metastability in RF subsystem timing, while UCSP-6 size fits tight RF module layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0101DCKR | Single-channel, 1.65V–5.5V VCCA/VCCB; 60Mbps max; push-pull outputs; no EN pin | Lacks enable control and guaranteed 100Mbps performance; requires external pull-ups for open-drain compatibility | Select when lower cost and wider voltage range outweigh need for EN control and 100Mbps guarantee |
| SN74AVC1T45DBVR | Single-channel, 1.2V–3.6V; 500Mbps typical; direction pin (DIR) required; higher 10µA quiescent current | Unidirectional architecture mandates external DIR signal routing; unsuitable for true bidirectional SPI/MICROWIRE | Select only for unidirectional paths where DIR control is available and 500Mbps speed is critical |
Compared with TXS0101DCKR and SN74AVC1T45DBVR, the MAX13013EBT-T uniquely delivers guaranteed 100Mbps bidirectional translation with integrated EN control and sub-0.1µA disable current in a 1.5mm × 1.0mm UCSP, making it optimal for space- and power-constrained portable designs requiring no direction logic.
Availability
MAX13013EBT-T is available at Aetrix Electronics and suitable for portable GPS receivers, SPI interface translation, low-power sensor hubs, and cell phone baseband interfaces requiring stable component supply across automotive, industrial, and consumer production cycles.
Supply support for MAX13013EBT-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-speed interface ICs for demanding industrial, medical, and communications applications.
The MAX13013EBT-T belongs to Maxim's high-speed level translation product line, engineered specifically for multivoltage system interoperability in battery-powered portable electronics with strict size and power constraints.
FAQ
What is the minimum VL voltage supported by the MAX13013EBT-T?
The MAX13013EBT-T supports VL down to +1.2V, provided VL ≤ VCC − 0.4V. At VL = 1.2V, the guaranteed data rate is 80Mbps; 100Mbps is ensured only when VL ≥ 1.8V. This allows direct interfacing with 1.2V ASICs and PLDs while maintaining timing integrity in portable designs using the MAX13013EBT-T.
Does the MAX13013EBT-T require external pull-up or pull-down resistors?
No, the MAX13013EBT-T integrates internal pull-up (120Ω on I/O VL_) and pulldown (75Ω on I/O VL_, 2.5kΩ on I/O VCC_) resistors, eliminating the need for external biasing components. This simplifies PCB layout and reduces BOM count in applications such as SPI translation where the MAX13013EBT-T is deployed.
How does the enable (EN) pin affect power consumption of the MAX13013EBT-T?
When EN is driven low, the MAX13013EBT-T places both I/O VL1 and I/O VCC1 in tri-state and reduces VCC supply current to 0.03µA and VL supply current to 0.1µA. This ultra-low disable current makes the MAX13013EBT-T ideal for battery-operated systems where intermittent domain isolation is required without significant leakage penalty.
Can the MAX13013EBT-T translate signals between 1.2V and 3.3V rails?
Yes - the MAX13013EBT-T accepts VL = +1.2V and VCC = +3.3V (satisfying VL ≤ VCC − 0.4V), enabling direct translation between 1.2V logic (e.g., advanced FPGA I/O) and 3.3V microcontrollers. At this combination, the MAX13013EBT-T delivers 80Mbps guaranteed data rate with sub-7ns propagation delay.
What package type is used for the MAX13013EBT-T, and what are its key mechanical features?
The MAX13013EBT-T uses a 3 × 2 UCSP-6 (Ultra Compact Silicon Package) with dimensions 1.5mm × 1.0mm × 0.5mm and solder bumps on the die underside. This wafer-level package provides minimal parasitic inductance, supports fine-pitch PCB assembly, and occupies >70% less board area than comparable SC70 solutions - critical for miniaturized GPS and handset designs using the MAX13013EBT-T.
MAX13013EBT-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 1
- Voltage - VCCA:
- 1.2 V ~ 3.2 V
- Voltage - VCCB:
- 1.65 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 100Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-WFBGA, CSPBGA
MAX13013EBT-T FAQ
1.How can I place an order for MAX13013EBT-T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX13013EBT-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX13013EBT-T reliable?
The price and inventory of MAX13013EBT-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13013EBT-T is usually 5 days.
3.What payment methods are accepted for MAX13013EBT-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13013EBT-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX13013EBT-T?
MAX13013EBT-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX13013EBT-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX13013EBT-T?
For technical support, including MAX13013EBT-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13013EBT-T requirements.
6.How does Aetrix verify that MAX13013EBT-T is sourced from the original manufacturer or authorized distributors?
All MAX13013EBT-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13013EBT-T meets industry standards.
7.What is the process for return or replacement of MAX13013EBT-T?
All MAX13013EBT-T units undergo pre-shipment inspection (PSI). If there is an issue with MAX13013EBT-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX13013EBT-T part is unused and in its original packaging.
Return procedure for MAX13013EBT-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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