Analog Devices Inc./Maxim Integrated MAX13030EEBE+T

Overview

The MAX13030EEBE+T from Maxim Integrated is a 6-channel bidirectional logic-level translator IC designed for high-speed voltage translation between +1.62V–+3.2V (VL) and +2.2V–+3.6V (VCC) domains. It supports 100Mbps data rates, features internal 30µA pullup current sources per I/O, operates over –40°C to +85°C, and uses a 16-bump UCSP (2mm × 2mm) package. It is used in SD/MiniSD/MMC memory card interfaces where low-voltage ASICs communicate with 3.3V host controllers.

For engineers reviewing the MAX13030EEBE+T datasheet, MAX13030EEBE+T pinout, MAX13030EEBE+T application, or MAX13030EEBE+T equivalent, key selection criteria include guaranteed 100Mbps operation with 4mA input drivers, ±15kV HBM ESD protection on VCC-side I/Os, automatic shutdown when VL > VCC, and high-impedance I/O states during shutdown - critical for memory-card hot-swap and power-gated system designs.

Technical Context

The MAX13030EEBE+T implements a bidirectional nMOS pass-gate architecture with integrated output-accelerator stages that generate short charge/discharge pulses during signal transitions, enabling fast edge rates without external pullups. Its dual-supply operation allows independent VL and VCC rails, with logic thresholds referenced to internal boost circuits (VIHL = VL – 0.2V, VIHC = VCC – 0.4V).

It supports both push-pull and open-drain drivers due to internal 30µA pullup current sources, and includes automatic shutdown when VCC falls below VL by >0.7V - a safety feature preventing latch-up during asymmetric power sequencing. The device lacks an EN pin (unlike MAX13030E–MAX13034E variants), confirming its fixed-enable configuration per ordering code B16+1.

Key Specifications

Pinout & Package

Package: 16-bump UCSP (2mm × 2mm), lead-free, exposed paddle (connected to GND). Thermal resistance θJA = 121.3°C/W on multilayer board.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional logic-level translation applications.

Compared with MAX13030EETE+, the MAX13030EEBE+T offers superior board-area efficiency and is optimized for ultra-compact portable designs; compared with TXS0108E, it provides guaranteed shutdown behavior and higher ESD robustness essential for memory-card slots.

Availability

MAX13030EEBE+T is available at Aetrix Electronics and suitable for SD card interface design, embedded memory subsystems, and portable consumer electronics requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MAX13030EEBE+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and high-speed interface solutions for industrial, automotive, and consumer applications.

The MAX13030E–MAX13035E product line was designed specifically for high-reliability, high-speed memory-card level translation in portable and embedded systems - emphasizing low power, small footprint, and robust ESD performance.

FAQ

What is the maximum supported data rate for the MAX13030EEBE+T?

The MAX13030EEBE+T guarantees 100Mbps operation under specified conditions: push-pull drivers, RSOURCE = 150Ω, CI/OVCC ≤ 10pF, CI/OVL ≤ 15pF, and VCC = +3.3V/VL = +1.8V. This is validated across the full –40°C to +85°C temperature range and enables full-speed SD Mode 0 and SDIO communication. Real-world performance may vary slightly with higher capacitive loads or lower supply voltages.

Does the MAX13030EEBE+T have an enable (EN) pin?

No, the MAX13030EEBE+T does not include an EN pin. Per the Ordering Information table, only MAX13030E–MAX13034E variants feature EN; the MAX13030EEBE+T corresponds to the "MAX13030E" base part with fixed-enable operation and high-impedance I/O states during shutdown. Its functionality is fully enabled whenever VL and VCC are within valid ranges and VL ≤ VCC − 0.2V.

What are the I/O states of the MAX13030EEBE+T during shutdown?

During shutdown - triggered automatically when VL exceeds VCC by >0.7V - both I/O VL_ and I/O VCC_ terminals enter high-impedance state, as confirmed by the Ordering Information/Selector Guide for part number MAX13030EEBE+. This prevents bus contention and back-driving in memory-card slot applications where power rails may sequence independently.

Can the MAX13030EEBE+T translate I²C signals?

No, the MAX13030EEBE+T is not recommended for I²C level translation. Its architecture relies on internal current-source pullups and accelerator stages optimized for push-pull and open-drain digital signals like SD/SDIO, but it lacks the bidirectional, slew-rate-controlled design required for I²C's wired-AND topology and clock stretching. For I²C, Maxim recommends the MAX3372E–MAX3379E or MAX3390E–MAX3393E families.

What is the thermal resistance (θJA) of the MAX13030EEBE+T UCSP package?

The MAX13030EEBE+T in its 16-bump UCSP (2mm × 2mm) package has a junction-to-ambient thermal resistance (θJA) of 121.3°C/W when mounted on a standard multilayer PCB, per JEDEC JESD51-7 test methodology. This value assumes proper thermal via placement under the exposed paddle, which must be soldered to the PCB ground plane to achieve rated performance.