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Analog Devices Inc./Maxim Integrated MAX13030EETE+
- Part No.:
- MAX13030EETE+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX13030EETE+.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 16TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,498
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Product details
Overview
MAX13030EETE+ from Maxim Integrated is a 6-channel bidirectional logic-level translator IC designed for high-speed voltage translation between +1.62V–+3.2V (VL) and +2.2V–+3.6V (VCC) domains. It supports 100Mbps data transfer, features internal 30µA pullup current sources per I/O, operates over –40°C to +85°C, and uses a 16-pin TQFN-EP (4mm × 4mm) package with exposed paddle. It is used in SD/MiniSD/MMC memory card interfaces where level shifting between low-voltage controllers and 3.3V cards is required.
For engineers reviewing the MAX13030EETE+ datasheet, MAX13030EETE+ pinout, MAX13030EETE+ application, or MAX13030EETE+ equivalent, key selection criteria include guaranteed 100Mbps operation with 4mA input drivers, ±15kV HBM ESD protection on VCC-side I/Os, automatic shutdown when VL > VCC, high-impedance I/O states during shutdown, and compatibility with both push-pull and open-drain drivers without external resistors.
Technical Context
The MAX13030EETE+ implements a BiCMOS-based nMOS pass-gate architecture with integrated output-accelerator stages that generate short-duration charge/discharge pulses during signal transitions-enabling fast edge rates without external pullups. Its dual-supply design isolates VL and VCC domains while maintaining bidirectional signal flow across six independent channels.
It lacks EN input and CLK_RET functionality (distinguishing it from MAX13031E–MAX13034E and MAX13035E variants), and its I/O VL_ and I/O VCC_ pins enter high-impedance state during automatic shutdown triggered by VL > VCC + 0.7V. The device draws only 6–10µA from VL and 16–25µA from VCC under active operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 6 bidirectional I/O channels for simultaneous level translation |
| Max Data Rate | 100Mbps - enables full-speed SD/SDIO and MMC interface operation |
| Voltage Ranges | VL: +1.62V to +3.2V; VCC: +2.2V to +3.6V - supports 1.8V ASIC ↔ 3.3V peripheral interconnect |
| ESD Protection | ±15kV HBM on I/O VCC_ lines - eliminates need for external TVS in memory-card slots |
| Supply Current | IQVL = 6–10µA, IQVCC = 16–25µA - ultra-low quiescent power for battery-sensitive host systems |
| Propagation Delay | tPVL-VCC / tPVCC-VL = 6.5ns max - ensures timing compliance in 26MHz SD clock domains |
| Shutdown Trigger | Automatic disable when VL > VCC + 0.7V - prevents latch-up during asymmetric power sequencing |
Pinout & Package
MAX13030EETE+ is housed in a lead-free 16-pin TQFN-EP package (4mm × 4mm, 0.5mm pitch) with exposed thermal paddle connected to GND. Pin numbering follows standard top-view orientation with Pin 1 at bottom-left corner.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | I/O VL1 | Bidirectional data channel referenced to VL; connects to 1.8V-side DAT0/CLK/ CMD of SD card |
| 2 | I/O VCC1 | Bidirectional data channel referenced to VCC; connects to 3.3V-side controller I/O |
| 3 | I/O VL2 | Second VL-referenced I/O - used for DAT1 in SD/SDIO applications |
| 4 | I/O VCC2 | Second VCC-referenced I/O - pairs with I/O VL2 for bidirectional DAT1 translation |
| 5 | I/O VL3 | Third VL-referenced I/O - assigned to DAT2 in memory-card implementations |
| 6 | I/O VCC3 | Third VCC-referenced I/O - completes DAT2 channel pair |
| 7 | I/O VCC4 | Fourth VCC-referenced I/O - used for DAT3 in 4-bit SD mode |
| 8 | I/O VL4 | Fourth VL-referenced I/O - pairs with I/O VCC4 for DAT3 translation |
| 9 | I/O VCC5 | Fifth VCC-referenced I/O - supports CMD line translation in SD/SDIO |
| 10 | I/O VL5 | Fifth VL-referenced I/O - pairs with I/O VCC5 for bidirectional CMD signaling |
| 11 | EN | No connection - MAX13030EETE+ does not include enable input (unlike MAX13031E–MAX13034E) |
| 12 | I/O VL6 | Sixth VL-referenced I/O - reserved for future expansion or auxiliary signals |
| 13 | GND | Analog/digital ground reference - must be low-impedance plane tied to exposed paddle |
| 14 | I/O VCC6 | Sixth VCC-referenced I/O - complements I/O VL6 for full 6-channel operation |
| 15 | VCC | Main power supply (2.2V–3.6V); requires 0.1µF + 1µF ceramic decoupling to GND |
| 16 | VL | Logic-reference supply (1.62V–3.2V); bypassed with 0.1µF ceramic capacitor to GND |
Key Features
| Feature | Design Value |
|---|---|
| 6-channel bidirectional translation | Enables full 4-bit SD/SDIO bus + CMD + CLK translation in single IC, reducing BOM count vs. discrete solutions |
| 100Mbps guaranteed data rate | Meets timing requirements for high-speed SD mode (25MHz clock, 50MB/s burst) without margin loss |
| Internal 30µA pullup current sources | Eliminates need for external pullups - simplifies layout and avoids RC delay degradation in high-speed buses |
| ±15kV HBM ESD protection (I/O VCC_) | Protects host controller I/O pins from ESD events during card insertion/removal without external components |
| Automatic shutdown (VL > VCC) | Prevents shoot-through current and undefined logic states during uncontrolled power sequencing in portable devices |
| High-impedance I/O during shutdown | Allows safe hot-plug of memory cards while host is powered down - no bus contention or leakage paths |
Applications
| SD Card Interface | MMC Memory Module |
|---|---|
Use Scenario: Interfacing a 1.8V FPGA or application processor to a standard 3.3V SD memory card in handheld or IoT devices. IC Role / Device Role / Timing Role: Bidirectional level translator for DAT0–DAT3, CMD, and CLK lines between VL (1.8V) and VCC (3.3V) domains. Use Value: Enables direct connection without external resistors or discrete translators; maintains 100Mbps throughput and meets SD physical layer timing specs. | Use Scenario: Level-shifting command and data signals between a low-power 1.8V microcontroller and a 3.3V MMC module in embedded storage subsystems. IC Role / Device Role / Timing Role: Translates all six MMC bus signals (CLK, CMD, DAT0–DAT3) with matched propagation delay and skew <0.8ns. Use Value: Guarantees signal integrity across voltage domains while supporting MMC high-speed mode (20MHz clock). |
| TransFlash (microSD) Slot | Memory Stick Duo Adapter |
Use Scenario: Integrating microSD support into space-constrained wearables using 1.8V SoC and legacy 3.3V card interface standards. IC Role / Device Role / Timing Role: Provides compact 6-channel translation in 4mm × 4mm TQFN package; handles DAT0–DAT3, CMD, and CLK with automatic power-aware shutdown. Use Value: Reduces PCB area vs. dual 4-channel translators; eliminates risk of bus contention during partial power-down. | Use Scenario: Adapting Sony Memory Stick Duo cards to host systems with 1.8V logic rails, requiring robust level translation for proprietary serial protocols. IC Role / Device Role / Timing Role: Translates bidirectional serial control and data lines (including strobe and reset) between 1.8V host and 3.3V card. Use Value: Supports reliable enumeration and data transfer at up to 20MB/s via precise 6.5ns propagation delay and sub-nanosecond skew control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 6-channel bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX13031EETE+ | Includes EN input; I/O VCC_ pulled to VCC (16.5kΩ) during shutdown instead of high-impedance | Suitable when system requires explicit enable control and defined VCC-referenced idle state on VCC-side bus | Select MAX13031EETE+ if firmware-controlled shutdown and weak pullup on VCC-side I/O during sleep are required |
| TXB0306RUTR | TI part with auto-direction sensing; 3.6V max VCC; no automatic VL>VCC shutdown; lower ESD rating (±8kV HBM) | Used in general-purpose multivoltage logic interfacing but lacks memory-card-specific robustness and shutdown behavior | Choose TXB0306RUTR only for non-critical industrial I²C/SPI bridges where ESD immunity and power sequencing safety are secondary |
Compared with MAX13031EETE+, MAX13030EETE+ offers simpler power management (no EN routing needed) and safer high-Z shutdown for hot-swap memory slots; versus TXB0306RUTR, it delivers superior ESD protection, guaranteed 100Mbps performance, and automatic fault-safe shutdown-making it purpose-built for memory-card applications.
Availability
MAX13030EETE+ is available at Aetrix Electronics and suitable for SD card interface design, MMC memory module integration, and TransFlash/microSD slot implementation requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MAX13030EETE+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated, now part of Analog Devices, designs precision analog, mixed-signal, and high-speed interface ICs for demanding industrial, communications, and consumer applications.
The MAX13030E–MAX13035E product line was engineered specifically for high-reliability memory-card level translation in portable and battery-powered systems, emphasizing ESD robustness, low quiescent current, and automatic power-aware operation.
FAQ
What is the maximum data rate supported by the MAX13030EETE+?
The MAX13030EETE+ guarantees 100Mbps data transfer under specified conditions (RSOURCE = 150Ω, CI/OVCC ≤ 10pF, CI/OVL ≤ 15pF, push-pull drivers). This enables full-speed operation in SD high-speed mode (25MHz clock) and MMC high-speed mode (20MHz clock), with measured propagation delay of 6.5ns and channel-to-channel skew under 0.8ns ensuring timing margin.
Does the MAX13030EETE+ have an enable (EN) pin?
No, the MAX13030EETE+ does not include an EN input. It belongs to the MAX13030E–MAX13034E family subset that omits EN functionality. Instead, it relies solely on automatic shutdown triggered when VL exceeds VCC by more than 0.7V. For designs requiring explicit enable control, MAX13031EETE+ is the functionally matched alternative with identical package and pinout except for EN activation.
What are the supply voltage ranges for VL and VCC on the MAX13030EETE+?
The MAX13030EETE+ accepts VL from +1.62V to +3.2V and VCC from +2.2V to +3.6V. During normal operation, VL must be ≤ VCC − 0.2V to ensure correct level translation. However, the device safely enters automatic shutdown if VL temporarily exceeds VCC during power-up or brownout conditions-preventing latch-up or damage.
How does the MAX13030EETE+ handle ESD protection?
The MAX13030EETE+ provides ±15kV Human Body Model (HBM) ESD protection on all I/O VCC_ pins (including CLK_VCC), meeting stringent requirements for memory-card slots subject to frequent insertion/removal. This eliminates the need for external TVS diodes on the 3.3V side, reducing component count and board space while maintaining system-level IEC 61000-4-2 compliance when combined with proper PCB layout.
What is the I/O state during shutdown on the MAX13030EETE+?
During automatic shutdown (triggered when VL > VCC + 0.7V), both I/O VL_ and I/O VCC_ pins enter high-impedance state. This is confirmed in the Ordering Information table for MAX13030EETE+, which specifies "High impedance" for both I/O VL_ and I/O VCC_ during shutdown-ensuring no bus contention or leakage current when the host is powered down but the memory card remains inserted.
MAX13030EETE+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Tube
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 6
- Voltage - VCCA:
- 1.62 V ~ 3.2 V
- Voltage - VCCB:
- 2.2 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain, Push-Pull
- Data Rate:
- 100Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Power Supply Decoupling
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-WQFN Exposed Pad
MAX13030EETE+ FAQ
1.How can I place an order for MAX13030EETE+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX13030EETE+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX13030EETE+ reliable?
The price and inventory of MAX13030EETE+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13030EETE+ is usually 5 days.
3.What payment methods are accepted for MAX13030EETE+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13030EETE+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX13030EETE+?
MAX13030EETE+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX13030EETE+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX13030EETE+?
For technical support, including MAX13030EETE+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13030EETE+ requirements.
6.How does Aetrix verify that MAX13030EETE+ is sourced from the original manufacturer or authorized distributors?
All MAX13030EETE+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13030EETE+ meets industry standards.
7.What is the process for return or replacement of MAX13030EETE+?
All MAX13030EETE+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX13030EETE+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX13030EETE+ part is unused and in its original packaging.
Return procedure for MAX13030EETE+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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