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Analog Devices Inc./Maxim Integrated MAX13030EETE+T
- Part No.:
- MAX13030EETE+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX13030EETE+T.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 16TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,862
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Product details
Overview
MAX13030EETE+T from Maxim Integrated is a 6-channel bidirectional logic-level translator IC designed for high-speed voltage translation between +1.62V–+3.2V (VL) and +2.2V–+3.6V (VCC) domains. It supports 100Mbps data rates, features six I/O pairs with internal 30μA pullups, operates over –40°C to +85°C, and uses a 16-pin TQFN-EP (4mm × 4mm) package. It is used in SD/MiniSD/MMC memory card interfaces where level shifting between low-voltage controllers and 3.3V cards is required.
For engineers reviewing the MAX13030EETE+T datasheet, MAX13030EETE+T pinout, MAX13030EETE+T application, or MAX13030EETE+T equivalent, key selection criteria include guaranteed 100Mbps operation with 4mA drivers, ±15kV HBM ESD protection on VCC-side I/Os, shutdown behavior with high-impedance I/O states, compatibility with push-pull and open-drain inputs, and thermal performance in the 4mm × 4mm TQFN package with exposed paddle.
Technical Context
The MAX13030EETE+T implements an nMOS pass-gate architecture with output-accelerator stages that activate only during signal transitions, minimizing static current while enabling fast edge rates. Its dual-supply design allows independent VL and VCC rails, with automatic shutdown triggered when VCC < VL − 0.2V - no enable pin required.
Unlike MAX13035E variants, MAX13030EETE+T lacks CLK_RET and EN pins; its functional pinout includes six bidirectional I/O pairs (I/O VL1–VL6 / I/O VCC1–VCC6), VL, VCC, GND, and exposed paddle. It accepts capacitive loads up to 15pF per line and delivers sub-7ns propagation delay (tPVL-VCC/tPVCC-VL) under typical conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 6 bidirectional I/O pairs - enables full SD/SDIO bus translation (DAT0–DAT3, CMD, CLK) without external logic. |
| Max Data Rate | 100Mbps - supports high-speed SD mode (e.g., 26MHz clock with 4-bit bus yielding >100MB/s theoretical throughput). |
| Voltage Ranges | VL = +1.62V to +3.2V; VCC = +2.2V to +3.6V - matches common low-power ASICs (1.8V) and legacy 3.3V peripherals. |
| ESD Protection | ±15kV HBM on I/O VCC_ lines - eliminates need for external TVS diodes in portable memory card slots. |
| Supply Current | IQVCC = 16–25µA; IQVL = 6–10µA - enables always-on level translation in battery-powered card readers with negligible quiescent drain. |
| Propagation Delay | tPVL-VCC / tPVCC-VL = 6.5ns max - ensures timing margin for 26MHz SD clock (38.5ns period) with setup/hold compliance. |
| Shutdown Behavior | I/O VL_ and I/O VCC_ enter high-impedance state when VCC < VL - prevents back-driving and bus contention during power sequencing. |
Pinout & Package
Package: 16-pin TQFN-EP (4mm × 4mm, 0.5mm pitch), thermally enhanced with exposed paddle connected to GND. Compatible with standard reflow profiles (peak 235°C bump temperature).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 12, 13 | I/O VL1–VL6 | VL-referenced bidirectional data lines - connect to low-voltage controller side (e.g., 1.8V SoC DAT/CMD/CLK). |
| 5, 6, 7, 8, 14, 15 | I/O VCC1–VCC6 | VCC-referenced bidirectional data lines - connect to higher-voltage peripheral side (e.g., 3.3V SD card interface). |
| 9 | VL | Logic supply input - must be bypassed with 0.1µF ceramic capacitor; defines low-side logic thresholds. |
| 10 | VCC | Power supply input - requires 0.1µF + 1µF ceramic decoupling for ESD robustness and noise immunity. |
| 11 | GND | Analog/digital ground reference - connects directly to PCB ground plane; exposed paddle must also tie to GND. |
| 16 | Exposed Paddle (EP) | Thermal and electrical ground - mandatory connection to maximize θJC (6°C/W) and ESD path integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional 100Mbps Translation | Enables full-speed SD/SDIO communication without direction-control signals or added latency. |
| Internal 30µA Pullup Sources | Eliminates external resistors for open-drain compatibility - reduces BOM count and board space in compact card readers. |
| Automatic Shutdown (VCC < VL) | Prevents bus contention and leakage during asymmetric power-up/down - critical for hot-plug memory card slots. |
| ±15kV HBM ESD on VCC I/Os | Meets IEC 61000-4-2 Level 4 (±8kV contact) without external protection - simplifies ESD design for handheld devices. |
| –40°C to +85°C Operation | Validated across industrial temperature range - suitable for automotive infotainment SD card adapters and industrial HMIs. |
Applications
| SD Card Interface | MMC/TransFlash Interface |
|---|---|
Use Scenario: Translating DAT0–DAT3, CMD, and CLK signals between a 1.8V application processor and a 3.3V SD memory card. IC Role / Device Role / Timing Role: Bidirectional level translator handling all six SD bus signals with matched propagation delay and skew ≤0.8ns. Use Value: Enables direct interoperability without protocol-aware glue logic; maintains 26MHz clock timing integrity with 6.5ns max delay. | Use Scenario: Interfacing a 1.62V FPGA I/O bank to a 3.3V MMC card in embedded storage modules. IC Role / Device Role / Timing Role: Voltage-domain bridge supporting multi-drop MMC command/response cycles at up to 20MHz. Use Value: Internal 30µA pullups ensure reliable open-drain ACK/NACK signaling without external resistors. |
| Memory Stick Card Adapter | Industrial SDIO Peripherals |
Use Scenario: Level-shifting serial interface (CLK, CMD, DAT) between a 2.5V microcontroller and legacy Memory Stick PRO Duo card. IC Role / Device Role / Timing Role: Six-channel translator with automatic shutdown preventing backfeed when card is inserted after host power-up. Use Value: High-impedance I/O state during VCC undervoltage avoids false commands and bus lockup. | Use Scenario: Connecting a 3.3V industrial camera module (SDIO WiFi) to a 1.8V SoC in ruggedized edge devices. IC Role / Device Role / Timing Role: Robust level shifter rated for –40°C to +85°C with ±15kV ESD protection on all VCC-side pins. Use Value: Eliminates need for discrete ESD diodes and saves >12mm² PCB area versus discrete resistor+diode solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX13032EETE+T | I/O VCC_ pulled down to GND (not high-Z) during shutdown; same pinout/package. | Suitable when controlled low-state on VCC side is required during power-down (e.g., to disable downstream buffers). | Select MAX13032EETE+T only if active-low shutdown behavior is explicitly needed; otherwise MAX13030EETE+T's high-Z preserves bus float. |
| TXS0108EPRJR | 8-channel, 3.3V/1.8V fixed-rail; no automatic VCC/VL sequencing detection; requires EN control. | Used in broader logic translation (I2C, UART, SPI); lacks memory-card-specific optimizations like accelerator stages. | Choose TXS0108EPRJR for general-purpose 8-channel translation; MAX13030EETE+T is optimized for SD/SDIO timing and ESD robustness. |
Compared with MAX13032EETE+T and TXS0108EPRJR, the MAX13030EETE+T uniquely combines automatic VCC/VL-aware shutdown, 100Mbps guaranteed rate with 4mA drivers, and ±15kV HBM protection - making it the most integrated solution for memory-card slot designs requiring minimal external components and strict ESD compliance.
Availability
MAX13030EETE+T is available at Aetrix Electronics and suitable for SD card readers, industrial HMIs, automotive infotainment systems, and portable medical devices requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MAX13030EETE+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and high-speed interface ICs for industrial, automotive, and communications markets.
The MAX13030E–MAX13035E product line was designed specifically for high-reliability, high-speed memory-card level translation in multivoltage portable and embedded systems - emphasizing ESD robustness, low quiescent current, and automatic power sequencing tolerance.
FAQ
What is the maximum data rate supported by the MAX13030EETE+T?
The MAX13030EETE+T guarantees 100Mbps operation under specified conditions: push-pull drivers sourcing ≥4mA, 150Ω source impedance, 10pF/15pF load capacitance on VCC/VL sides, and 2.2V–3.6V/1.62V–3.2V supply ranges. This enables full-speed SD mode (26MHz clock × 4-bit bus) without timing violations. Measured propagation delay is 6.5ns max, providing ample margin for high-frequency signaling.
Does the MAX13030EETE+T require an external enable signal?
No, the MAX13030EETE+T does not have an EN pin and does not require an external enable signal. It features automatic shutdown when VCC falls below VL − 0.2V, and enters normal operation when VCC > VL − 0.2V. This eliminates control logic overhead and simplifies power sequencing in memory card interfaces where VCC and VL may power up at different times.
What are the I/O states of the MAX13030EETE+T during shutdown?
During shutdown (triggered when VCC < VL − 0.2V), both I/O VL_ and I/O VCC_ pins enter high-impedance state for the MAX13030EETE+T. This is confirmed in the Ordering Information table, which lists "High impedance" for both I/O VL_ and I/O VCC_ states during shutdown. This prevents back-driving and bus contention in hot-plug scenarios such as SD card insertion/removal.
Can the MAX13030EETE+T be used with open-drain drivers?
Yes, the MAX13030EETE+T is fully compatible with open-drain drivers due to its internal 30μA pullup current sources on all I/O lines. These eliminate the need for external pullup resistors and ensure clean rise times even with capacitive loads up to 15pF. The device's output-accelerator stage further enhances edge speed, making it suitable for I2C-like open-drain protocols within its voltage and speed constraints.
What package type and thermal characteristics does the MAX13030EETE+T use?
The MAX13030EETE+T uses a 16-pin TQFN-EP package (4mm × 4mm, 0.5mm pitch) with exposed paddle. Its thermal resistance is θJA = 40°C/W and θJC = 6°C/W on a multilayer board, enabling reliable operation at full load up to +85°C ambient. The exposed paddle must be soldered to a solid GND plane to achieve specified thermal performance and ESD robustness.
MAX13030EETE+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 6
- Voltage - VCCA:
- 1.62 V ~ 3.2 V
- Voltage - VCCB:
- 2.2 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain, Push-Pull
- Data Rate:
- 100Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Power Supply Decoupling
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-WQFN Exposed Pad
MAX13030EETE+T FAQ
1.How can I place an order for MAX13030EETE+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX13030EETE+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX13030EETE+T reliable?
The price and inventory of MAX13030EETE+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13030EETE+T is usually 5 days.
3.What payment methods are accepted for MAX13030EETE+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13030EETE+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX13030EETE+T?
MAX13030EETE+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX13030EETE+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX13030EETE+T?
For technical support, including MAX13030EETE+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13030EETE+T requirements.
6.How does Aetrix verify that MAX13030EETE+T is sourced from the original manufacturer or authorized distributors?
All MAX13030EETE+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13030EETE+T meets industry standards.
7.What is the process for return or replacement of MAX13030EETE+T?
All MAX13030EETE+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX13030EETE+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX13030EETE+T part is unused and in its original packaging.
Return procedure for MAX13030EETE+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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