Analog Devices Inc./Maxim Integrated MAX13032EEBE+T

Overview

MAX13032EEBE+T from Maxim Integrated is a 6-channel bidirectional logic-level translator IC designed for high-speed voltage translation between +1.62V–+3.2V (VL) and +2.2V–+3.6V (VCC) domains. It supports 100Mbps data rates, features automatic shutdown when VCC < VL, and provides I/O VCC_ pulled down to GND during shutdown. It is used in SD/MiniSD/MMC memory card interfaces requiring precise level shifting with minimal propagation delay (6.5ns).

For engineers reviewing the MAX13032EEBE+T datasheet, MAX13032EEBE+T pinout, MAX13032EEBE+T application, or MAX13032EEBE+T equivalent, this page delivers verified electrical specs, UCSP-16 package details, shutdown behavior confirmation, ESD protection rating (+15kV HBM on I/O VCC_), and real-world memory-card interface design context.

Technical Context

The MAX13032EEBE+T implements nMOS pass-gate architecture with output-accelerator stages that activate only during signal transitions, minimizing static power while enabling 100Mbps operation with as little as 4mA driver strength. Its dual-supply operation allows independent VL and VCC rails, with internal 30µA pullup current sources supporting both push-pull and open-drain drivers.

Unlike MAX13030E–MAX13034E variants, MAX13032EEBE+T lacks an EN pin and relies solely on automatic shutdown triggered by VL > VCC + 0.7V threshold. During shutdown, I/O VL_ remains high-impedance while I/O VCC_ is actively pulled to GND via 10–23kΩ internal pulldown (confirmed for MAX13032E).

Key Specifications

Pinout & Package

MAX13032EEBE+T is housed in a lead-free 16-bump UCSP package (2mm × 2mm), RoHS-compliant, with exposed paddle connected to GND for thermal and ESD performance. Bump pitch is 0.5mm; land pattern follows Maxim's THERMAL-UCSP-21-0101 standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with MAX13030EEBE+, MAX13032EEBE+T provides guaranteed I/O VCC_ pulldown during shutdown-critical for preventing false SD card detection-and eliminates enable logic overhead. Against MAX13032EETE+, it offers identical electrical behavior in a space-optimized UCSP package ideal for ultra-compact memory card slots.

Availability

MAX13032EEBE+T is available at Aetrix Electronics and suitable for SD card readers, embedded MMC hosts, microSD adapters, and Memory Stick interfaces requiring stable component supply across industrial temperature range (-40°C to +85°C).

Supply support for MAX13032EEBE+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated, now part of Analog Devices, designs precision analog, mixed-signal, and high-speed interface ICs for demanding industrial, automotive, and computing applications.

The MAX13030E–MAX13035E product line was engineered specifically for multivoltage memory-card interfaces, delivering sub-7ns propagation delay, automatic power-aware shutdown, and integrated ESD protection in wafer-level chip-scale packaging.

FAQ

What is the shutdown behavior of MAX13032EEBE+T?

MAX13032EEBE+T enters automatic shutdown when VCC falls below VL + 0.7V. During shutdown, I/O VL_ terminals go high-impedance, while I/O VCC_ terminals are actively pulled to GND via internal 10–23kΩ resistors. This behavior is confirmed in the Ordering Information table for MAX13032E and distinguishes it from MAX13030E–MAX13034E variants that require an EN pin.

Does MAX13032EEBE+T support CLK_RET functionality?

No, MAX13032EEBE+T does not include CLK_RET. That feature is exclusive to the MAX13035E variant. MAX13032EEBE+T provides six bidirectional data channels (I/O VL1–VL6 and I/O VCC1–VCC6) plus separate CLK_VL and CLK_VCC paths, but no clock return output. The functional diagram and pin configuration tables confirm CLK_RET is absent in MAX13032E.

What package type is used for MAX13032EEBE+T?

MAX13032EEBE+T uses a 16-bump UCSP (Ultra Compact Silicon Package) measuring 2mm × 2mm with 0.5mm bump pitch. It is lead-free, RoHS-compliant, and features an exposed paddle that must be soldered to a GND plane. Package code B16+1 and outline number 21-0101 are specified in Maxim's official documentation.

Can MAX13032EEBE+T drive open-drain buses without external pullups?

Yes, MAX13032EEBE+T integrates 30µA internal current sources on all I/O lines, enabling direct drive of open-drain buses like SD card DAT lines without external pullup resistors. Rise time is accelerated by internal circuitry, and the datasheet explicitly advises against adding external pullups due to potential interaction with the internal architecture.

What is the maximum capacitive load supported by MAX13032EEBE+T at 100Mbps?

MAX13032EEBE+T supports up to 15pF on I/O VL_ lines and 10pF on I/O VCC_ lines while maintaining 100Mbps operation under typical conditions (VCC = 3.3V, VL = 1.8V, RSOURCE = 150Ω). Rise/fall times remain ≤2.5ns within this load range, as validated in the Timing Characteristics table and Typical Operating Characteristics plots (toc09/toc10).