Analog Devices Inc./Maxim Integrated MAX13035EETE+

Overview

The MAX13035EETE+ from Maxim Integrated is a 6-channel bidirectional logic-level translator IC designed for high-speed voltage translation between VL (1.62V–3.2V) and VCC (2.2V–3.6V) domains in memory-card interfaces. It supports 100Mbps data rates, features a dedicated CLK_RET output for clock return functionality, and includes ±15kV HBM ESD protection on I/O VCC lines - enabling robust SD/MiniSD/MMC card level translation in portable storage systems.

For engineers reviewing the MAX13035EETE+ datasheet, MAX13035EETE+ pinout, MAX13035EETE+ application, or MAX13035EETE+ equivalent, key selection considerations include its TQFN-EP (4mm × 4mm) package with exposed paddle, automatic shutdown when VL > VCC + 0.7V, tri-state leakage <2µA during shutdown, and guaranteed 6.5ns propagation delay (typ.) driving I/O VL_ to I/O VCC_ at 100Mbps.

Technical Context

The MAX13035EETE+ implements an nMOS pass-gate architecture with integrated rise/fall-time accelerator stages that activate only during signal transitions, minimizing static power while achieving sub-7ns propagation delay. Its dual-supply operation (VL and VCC) enables true bidirectional level shifting without direction control pins.

Unlike earlier family members (e.g., MAX13030E–MAX13034E), the MAX13035EETE+ omits the EN input and instead integrates a CLK_RET output tied to CLK_VL - making it specifically optimized for clock-forwarding applications in SD card host controllers where clock integrity and low skew are critical.

Key Specifications

Pinout & Package

MAX13035EETE+ uses a 16-pin TQFN-EP (4mm × 4mm) package with exposed paddle connected to GND for thermal and ESD performance. Pin numbering follows standard top-view orientation with Pin 1 at top-left corner.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with MAX13030EETE+, the MAX13035EETE+ trades enable control for precise clock return capability - making it uniquely suited for SD/SDIO host designs requiring timing-critical clock feedback. Compared with TXB0306RUTR, it delivers higher speed, superior ESD protection, and deterministic propagation delay - critical for certified memory card interfaces.

Availability

MAX13035EETE+ is available at Aetrix Electronics and suitable for SD card readers, embedded MMC hosts, industrial secure digital slots, and portable media controllers requiring stable component supply across extended temperature and high-reliability environments.

Supply support for MAX13035EETE+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and high-speed interface solutions for industrial, communications, and consumer applications.

The MAX13030E–MAX13035E product line was engineered specifically for high-integrity, high-speed memory-card level translation - addressing timing, ESD, and power constraints inherent in portable storage interfaces.

FAQ

What is the primary function of the CLK_RET pin on the MAX13035EETE+?

The CLK_RET pin on the MAX13035EETE+ outputs a VL-referenced copy of the CLK_VL input signal. It is not a buffered or regenerated clock but a direct, low-skew return path used by host controllers to verify clock presence, synchronize timing recovery circuits, and validate card readiness before command issuance - a feature absent in other MAX1303x family members like MAX13030EETE+.

Does the MAX13035EETE+ support automatic shutdown, and how does it differ from MAX13030EETE+?

Yes, the MAX13035EETE+ supports automatic shutdown when VL exceeds VCC + 0.7V - disabling translation and reducing supply current to ≤2µA. Unlike MAX13030EETE+, which uses an EN pin for manual shutdown, the MAX13035EETE+ has no EN pin and relies solely on this voltage-threshold-based automatic mode - simplifying design for hot-plug memory card slots where VCC may be sequenced after VL.

Can the MAX13035EETE+ be used with open-drain drivers, and what pullup mechanism does it use?

Yes, the MAX13035EETE+ supports both push-pull and open-drain drivers. It uses internal 30µA current-source pullups on all I/O lines (I/O VL_, I/O VCC_, CLK_VL, CLK_RET), eliminating the need for external pullup resistors. This design ensures consistent rise times across voltage domains and avoids conflicts with open-drain bus arbitration - critical for SD card DAT line sharing.

What is the maximum capacitive load the MAX13035EETE+ can drive while maintaining 100Mbps operation?

The MAX13035EETE+ maintains 100Mbps data rate with ≤10pF load on I/O VCC_ lines and ≤15pF load on I/O VL_ lines when using 150Ω source impedance and typical supply voltages (VCC = 3.3V, VL = 1.8V). Exceeding these loads increases rise/fall time and propagation delay - degrading timing margins; the device's built-in accelerator stages help mitigate this up to ~25pF, but 100Mbps compliance is only guaranteed within the specified limits.

How does the MAX13035EETE+ handle ESD protection, and which pins are covered?

The MAX13035EETE+ provides ±15kV Human Body Model (HBM) ESD protection specifically on all I/O VCC_ pins and CLK_VCC - the high-voltage side of the interface. I/O VL_ and CLK_VL pins are rated to ±12kV (IEC 61000-4-2 air-gap) and ±8kV (contact discharge). This asymmetric protection aligns with real-world stress profiles where host-side lines face greater ESD exposure than card-side traces.