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Analog Devices Inc./Maxim Integrated MAX13035EETE/V+

Part No.:
MAX13035EETE/V+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Translators, Level Shifters
Package:
Datasheet:
AetrixMAX13035EETE/V+.pdf
Description:
6-CHANNEL HIGH-SPEED LOGIC-LEVEL
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,217

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Product details

Overview

MAX13035EETE/V+ from Maxim Integrated is a 6-channel bidirectional logic-level translator IC designed for high-speed voltage translation between VL (1.62V–3.2V) and VCC (2.2V–3.6V) domains. It supports 100Mbps data transfer, features a dedicated CLK_RET output for clock return functionality, provides ±15kV HBM ESD protection on I/O VCC lines, and operates across –40°C to +85°C in TQFN-EP (4mm × 4mm) package - enabling SD/MiniSD/MMC memory-card interface bridging.

For engineers reviewing the MAX13035EETE/V+ datasheet, MAX13035EETE/V+ pinout, MAX13035EETE/V+ application, or MAX13035EETE/V+ equivalent, key selection criteria include guaranteed 100Mbps operation with 4mA input drivers, automatic shutdown when VCC < VL, high-impedance I/O states during shutdown, and compatibility with push-pull or open-drain signaling in multivoltage embedded systems.

Technical Context

The MAX13035EETE/V+ implements a BiCMOS-based nMOS pass-gate architecture with integrated rise/fall-time accelerator stages that activate only during signal transitions - minimizing static power while achieving sub-8ns propagation delay (tPVL-VCC = 8ns max). Its dual-supply design isolates VL-referenced I/Os (I/O VL1–VL6, CLK_VL, CLK_RET) from VCC-referenced I/Os (I/O VCC1–VCC6, CLK_VCC), with independent internal 30µA pullup current sources per channel.

Unlike MAX13030E–MAX13034E variants, MAX13035EETE/V+ omits the EN pin and relies solely on automatic shutdown triggered by VCC falling below VL (VTH_L = 0.1VL, VTH_H = 0.05VL), with I/O VL_ and I/O VCC_ both entering high-impedance state during shutdown - confirmed for this exact part number in the Ordering Information/Selector Guide.

Key Specifications

ParameterValue and Actual Design Meaning
Channels6 bidirectional I/O channels + dedicated CLK_VL/CLK_RET/CLK_VCC paths
Max Data Rate100Mbps - verified with 150Ω source, 10pF/15pF loads, push-pull drivers
VCC Range+2.2V to +3.6V - sets high-side logic levels; must exceed VL by ≥0.2V in normal operation
VL Range+1.62V to +3.2V - sets low-side logic levels; supports 1.8V memory interfaces
Propagation DelaytPVL-VCC ≤ 8ns, tPVCC-VL ≤ 8ns - ensures timing-critical SD card command/data alignment
ESD Protection±15kV HBM on I/O VCC/CLK_VCC - meets IEC 61000-4-2 contact discharge (±8kV)
Shutdown TriggerVCC rising threshold VTH_H = 0.05VL to 0.85V - enables robust power sequencing in mixed-voltage systems

Pinout & Package

MAX13035EETE/V+ is supplied in a lead-free 16-pin TQFN-EP package (4mm × 4mm, 0.5mm pitch) with exposed paddle (EP) requiring connection to GND for thermal and ESD performance. Pin functions are electrically validated per Maxim's Functional Diagram and Pin Configurations (Rev 2, Feb 2021).

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 13, 14, 15I/O VL1–VL6, I/O VCC1–VCC6, CLK_VL, CLK_RET, CLK_VCCBidirectional level-translated signals - VL-side pins referenced to VL supply; VCC-side pins referenced to VCC supply
11CLK_RETDedicated output returning identical waveform applied to CLK_VL - eliminates need for external clock buffer in memory-card applications
16GNDGround reference for all internal circuitry and EP thermal path
C2VCCMain power supply (2.2V–3.6V); requires 0.1µF + 1µF ceramic decoupling
C1VLLogic-reference supply (1.62V–3.2V); bypassed with 0.1µF capacitor
EPExposed PaddleThermal and ESD ground path - must be soldered to PCB GND plane

Key Features

FeatureDesign Value
CLK_RET clock return pathEliminates external clock repeater in SD/MiniSD host-to-card interfaces, reducing BOM count and board area
Automatic VCC-triggered shutdownDisables translation when VCC drops below VL - prevents bus contention during power sequencing without external control logic
Internal 30µA pullup current sourcesEnables direct drive from open-drain controllers (e.g., microcontroller GPIOs) without external resistors - simplifies layout and improves signal integrity
Sub-8ns propagation delayMeets timing budgets for 26MHz SD clock (4× oversampling) and CMD/DAT setup/hold requirements
±15kV HBM ESD protectionProtects against handling-induced transients on VCC-side I/Os - critical for removable memory-card slots exposed to user insertion/removal

Applications

SD Card InterfaceMMC/TransFlash Interface

Use Scenario: Translating 1.8V SD host controller signals to 3.3V SD card interface while maintaining 100Mbps command/data throughput.

IC Role / Device Role / Timing Role: Bidirectional level translator with CLK_RET returning host clock to card side - synchronizing CMD/DAT sampling without added latency.

Use Value: Enables single-chip voltage bridging for UHS-I SD mode, eliminating discrete resistor networks and reducing PCB layer count.

Use Scenario: Interfacing 1.8V FPGA I/O banks to 3.3V MMC/TransFlash cards in portable medical devices.

IC Role / Device Role / Timing Role: Six-channel translator supporting DAT0–DAT3, CMD, and CLK with automatic shutdown during card removal.

Use Value: Guarantees high-impedance I/O states during hot-swap events - preventing back-driving of FPGA pins and system lockup.

Memory Stick Level TranslationIndustrial Embedded Multivoltage Bridge

Use Scenario: Adapting legacy 3.3V Memory Stick Pro Duo interfaces to modern 1.8V SoC designs in digital cameras.

IC Role / Device Role / Timing Role: Voltage-domain isolator with 100Mbps capability and ±15kV ESD hardening on VCC-side pins.

Use Value: Survives repeated insertion cycles in consumer electronics - no external TVS diodes required on card-facing I/Os.

Use Scenario: Bridging 2.5V ASIC peripherals to 3.3V industrial PLC backplane signals in factory automation.

IC Role / Device Role / Timing Role: High-speed bidirectional translator with automatic VCC-fail detection and thermal-enhanced TQFN-EP package.

Use Value: Maintains signal integrity across wide temperature range (–40°C to +85°C) with 40°C/W θJA - suitable for uncooled enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MAX13030EETE+Includes EN pin; same 6-channel core but lacks CLK_RET; shutdown requires active EN controlSuitable where external enable sequencing is preferred over automatic VCC-triggered shutdownSelect MAX13030EETE+ if system requires explicit software-controlled shutdown rather than autonomous power-loss response
TXS0108E8-channel, 3.6V VCCA / 5.5V VCCB; no automatic shutdown; different pinout and timing specsUsed in broader voltage-range applications (e.g., 1.2V ↔ 5V), not optimized for memory-card-specific 1.8V/3.3V translationChoose TXS0108E only when expanding beyond six channels or requiring higher VCCB tolerance - not drop-in compatible

Compared with MAX13030EETE+, MAX13035EETE/V+ removes EN complexity and adds CLK_RET - simplifying SD host designs. Versus TXS0108E, it offers tighter timing, integrated ESD, and memory-card-optimized shutdown behavior - at the cost of channel count and voltage flexibility.

Availability

MAX13035EETE/V+ is available at Aetrix Electronics and suitable for SD card interface, MMC/TransFlash integration, Memory Stick adaptation, and industrial multivoltage bridge applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MAX13035EETE/V+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power-management ICs for demanding industrial, automotive, and communications applications.

The MAX13030E–MAX13035E product line delivers high-speed, low-power bidirectional level translation specifically for memory-card interfaces and multivoltage system interconnects - emphasizing ESD robustness, automatic power-aware operation, and minimal board footprint.

FAQ

What is the function of the CLK_RET pin on the MAX13035EETE/V+?

The CLK_RET pin on the MAX13035EETE/V+ returns an exact replica of the clock signal applied to CLK_VL, referenced to the VL supply. This eliminates the need for an external clock buffer in SD/MiniSD host-to-card interfaces, preserving signal integrity and reducing component count. The MAX13035EETE/V+ is the only variant in the family with this dedicated clock-return feature.

Does the MAX13035EETE/V+ have an enable (EN) pin?

No, the MAX13035EETE/V+ does not include an EN pin. Unlike MAX13030E–MAX13034E variants, it relies exclusively on automatic shutdown triggered when VCC falls below VL. This behavior is confirmed for the exact part number MAX13035EETE/V+ in the Ordering Information/Selector Guide, where EN is omitted from the pin configuration.

What are the I/O states during shutdown for the MAX13035EETE/V+?

During shutdown (triggered when VCC < VL), both I/O VL_ and I/O VCC_ pins enter high-impedance state for the MAX13035EETE/V+. This is explicitly documented in the Ordering Information/Selector Guide row for MAX13035EETE/V+T, confirming high-impedance behavior for both sides - ensuring safe bus isolation without external pull resistors.

What package type is used for the MAX13035EETE/V+?

The MAX13035EETE/V+ uses a 16-pin TQFN-EP package (4mm × 4mm, 0.5mm pitch) with exposed paddle. The package code T1644+4 confirms this configuration, and the exposed paddle must be connected to GND for optimal thermal dissipation (θJA = 40°C/W) and ESD performance.

Can the MAX13035EETE/V+ translate between 1.2V and 3.3V logic levels?

No, the MAX13035EETE/V+ does not support 1.2V logic translation. Its VL supply range is strictly +1.62V to +3.2V, and VCC range is +2.2V to +3.6V, with normal operation requiring VL ≤ VCC − 0.2V. For 1.2V interfaces, alternative translators such as TXB0108 or MAX3372E should be evaluated.

MAX13035EETE/V+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
Packaging:
Tube
Product Status:
Active
Translator Type:
Voltage Level
Channel Type:
Bidirectional
Number of Circuits:
1
Channels per Circuit:
6
Voltage - VCCA:
2.2 V ~ 3.6 V
Voltage - VCCB:
1.62 V ~ 3.2 V
Input Signal:
-
Output Signal:
-
Output Type:
Non-Inverted
Data Rate:
100Mbps
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-WQFN Exposed Pad

MAX13035EETE/V+ FAQ

1.How can I place an order for MAX13035EETE/V+ through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX13035EETE/V+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX13035EETE/V+ reliable?

The price and inventory of MAX13035EETE/V+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13035EETE/V+ is usually 5 days.

3.What payment methods are accepted for MAX13035EETE/V+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13035EETE/V+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX13035EETE/V+?

MAX13035EETE/V+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX13035EETE/V+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX13035EETE/V+?

For technical support, including MAX13035EETE/V+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13035EETE/V+ requirements.

6.How does Aetrix verify that MAX13035EETE/V+ is sourced from the original manufacturer or authorized distributors?

All MAX13035EETE/V+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13035EETE/V+ meets industry standards.

7.What is the process for return or replacement of MAX13035EETE/V+?

All MAX13035EETE/V+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX13035EETE/V+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX13035EETE/V+ part is unused and in its original packaging.

Return procedure for MAX13035EETE/V+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MAX13035EETE/V+ Tags

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