Analog Devices Inc./Maxim Integrated MAX13042EEBC+T

Overview

The MAX13042EEBC+T from Maxim Integrated is a 4-channel bidirectional logic-level translator IC designed for high-speed voltage translation between +1.62V–+3.2V (VL) and +2.2V–+3.6V (VCC) domains. It supports guaranteed 100Mbps data rates, features ±15kV IEC 61000-4-2 ESD protection on I/O VCC_ lines, internal 30µA pullup current sources per channel, and operates across –40°C to +85°C. It enables reliable SPI/MICROWIRE level shifting in portable communication devices and low-voltage ASIC interfaces.

For engineers reviewing the MAX13042EEBC+T datasheet, MAX13042EEBC+T pinout, MAX13042EEBC+T application, or MAX13042EEBC+T equivalent, this page delivers verified electrical parameters, UCSP-12 package mapping, shutdown behavior confirmation, real-world timing constraints (6.5ns propagation delay, 2.5ns rise/fall time), and validated alternative options for multivoltage system design.

Technical Context

The MAX13042EEBC+T implements a BiCMOS-based nMOS pass-gate architecture with edge-triggered output accelerator stages that generate short-duration charge/discharge pulses during signal transitions - enabling sub-3ns edge speeds without external pullups. Its dual-supply operation (VL and VCC) allows independent logic-level referencing per I/O pair, with automatic shutdown when VCC < VL and explicit control via EN input.

All four channels are fully bidirectional and internally pulled up to their respective supply rails (VL or VCC) by 30µA current sources, supporting both push-pull and open-drain drivers. The device guarantees 100Mbps operation with ≥4mA driver capability and maintains defined I/O states (high-impedance) during shutdown as specified for the MAX13042E variant.

Key Specifications

Pinout & Package

MAX13042EEBC+T is housed in a 12-bump UCSP™ package (1.54mm × 2.12mm, lead-free), optimized for space-constrained portable electronics. The die attach pad is not electrically connected; only the 12 solder bumps form functional terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with MAX13043EEBC+T and TXB0104RUTR, the MAX13042EEBC+T uniquely guarantees 100Mbps operation with 6.5ns propagation delay and offers programmable shutdown behavior via EN, making it optimal for industrial and portable systems demanding deterministic timing and robust power sequencing.

Availability

MAX13042EEBC+T is available at Aetrix Electronics and suitable for portable communication devices, GPS modules, and SPI-based sensor interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MAX13042EEBC+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and high-speed interface solutions for industrial, automotive, and portable applications.

The MAX13042E–MAX13045E family was designed specifically for high-speed, low-power bidirectional level translation in multivoltage portable systems - targeting SPI, MICROWIRE, and general-purpose GPIO bridging where space, ESD robustness, and timing predictability are critical.

FAQ

What is the maximum capacitive load the MAX13042EEBC+T can drive while maintaining 100Mbps operation?

The MAX13042EEBC+T maintains guaranteed 100Mbps operation with ≤10pF load on I/O VCC_ lines and ≤15pF on I/O VL_ lines, as validated in the datasheet's Typical Operating Characteristics (Figures toc09–toc12). Exceeding these values increases rise/fall time nonlinearly - e.g., at 40pF, tRVCC rises to ~1.2ns - potentially violating setup/hold margins in high-frequency SPI. Always verify load with oscilloscope measurements in final layout.

Does the MAX13042EEBC+T require external pullup resistors for open-drain interfaces like I²C?

No, the MAX13042EEBC+T does not require external pullup resistors for open-drain signaling. Its internal 30µA current sources provide sufficient pullup strength for standard CMOS loads, and integrated rise-time accelerators ensure fast transitions. However, for true I²C bus compliance (requiring bidirectional wired-AND with external pullups), use MAX3378E or MAX3396E instead - the MAX13042EEBC+T is optimized for SPI/MICROWIRE, not I²C protocol handling.

How does the MAX13042EEBC+T behave when VL is powered before VCC during system startup?

When VL is applied before VCC, the MAX13042EEBC+T automatically enters shutdown mode because VCC < VL exceeds the VL–VCC shutdown threshold (0.1VL to 0.8V). In this state, both I/O VL_ and I/O VCC_ enter high-impedance, preventing backfeeding into the unpowered VCC rail. This behavior is intrinsic to the device's architecture and requires no external circuitry - ensuring safe power sequencing in battery-powered portable systems.

Can the MAX13042EEBC+T translate signals between 1.2V and 3.3V logic domains?

No, the MAX13042EEBC+T cannot translate between 1.2V and 3.3V. Its VL supply range is strictly +1.62V to +3.2V, excluding 1.2V operation. Attempting to operate VL below 1.62V violates Absolute Maximum Ratings and causes undefined input thresholds (VIHL/VILL) and unreliable pullup current. For 1.2V interfaces, consider the MAX3378E or TXS0108E, which support 1.2V–3.6V translation with auto-direction sensing.

What is the thermal resistance (θ_JA) of the MAX13042EEBC+T in its UCSP-12 package?

The MAX13042EEBC+T in UCSP-12 has a junction-to-ambient thermal resistance (θ_JA) of 154°C/W, calculated from its 519mW maximum power dissipation at +70°C ambient and 6.5mW/°C derating above that temperature. This value assumes standard JEDEC 2-layer board layout with 1in² copper pour under the exposed die pad - actual θ_JA improves with enhanced PCB copper area and thermal vias, critical for sustained 100Mbps operation in enclosed handheld enclosures.