Analog Devices Inc./Maxim Integrated MAX13043EEBC+

Overview

The MAX13043EEBC+ from Maxim Integrated is a 4-channel bidirectional logic-level translator IC designed for high-speed voltage translation between mismatched logic domains in multivoltage systems. It supports 100Mbps data transfer with ±15kV ESD protection on I/O VCC_ lines, operates across VCC = +2.2V to +3.6V and VL = +1.62V to +3.2V, and features an enable input and automatic shutdown when VCC < VL - ideal for SPI/MICROWIRE level translation in portable communication devices.

For engineers reviewing the MAX13043EEBC+ datasheet, MAX13043EEBC+ pinout, MAX13043EEBC+ application, or MAX13043EEBC+ equivalent, this page delivers verified electrical parameters, UCSP-12 package mapping, shutdown-state behavior (I/O VL_ = high impedance, I/O VCC_ = 16.5kΩ to GND), timing performance at 100Mbps, and real-world design implications for push-pull/open-drain driver compatibility.

Technical Context

The MAX13043EEBC+ implements a BiCMOS-based nMOS pass-gate architecture with integrated rise/fall-time accelerator stages that generate short pulses during signal transitions to actively charge/discharge load capacitance. Its dual-supply operation relies on independent VL and VCC rails, where logic levels on either side are referenced strictly to their respective supply - enabling true bidirectional translation without inversion.

Each I/O channel includes internal 30µA pullup current sources, eliminating need for external resistors while supporting both push-pull and open-drain drivers. The device enters low-power shutdown when EN = GND or when VCC falls below VL by more than the threshold (0.1VL to 0.8V), with I/O states during shutdown determined by part variant - for MAX13043EEBC+, I/O VL_ remains high-impedance while I/O VCC_ is pulled to GND via 16.5kΩ.

Key Specifications

Pinout & Package

MAX13043EEBC+ uses a 12-bump UCSP™ package (1.54mm × 2.12mm, lead-free), optimized for space-constrained portable electronics. The die is mounted upside-down with solder bumps on the bottom surface; PCB layout requires precise bump-pad alignment per Maxim's UCSP application note.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with MAX13042EEBC+, MAX13043EEBC+ provides controlled VCC-side termination during shutdown while keeping VL-side floating - offering a middle-ground option for mixed-signal systems needing partial bus control without full pull-down on both domains.

Availability

MAX13043EEBC+ is available at Aetrix Electronics and suitable for portable communication devices, GPS modules, and SPI-based embedded systems requiring stable component supply, long-term lifecycle support, and lead-free compliance.

Supply support for MAX13043EEBC+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog and mixed-signal ICs for power, sensing, connectivity, and interface applications.

The MAX13042E–MAX13045E product line was designed specifically for high-speed, low-power bidirectional level translation in space-constrained portable electronics - targeting SPI, MICROWIRE, and general-purpose multivoltage I/O bridging.

FAQ

What is the shutdown behavior of MAX13043EEBC+?

The MAX13043EEBC+ enters shutdown when EN = GND or when VCC falls below VL by more than the threshold (0.1VL to 0.8V). During shutdown, I/O VL_ remains in high-impedance state while I/O VCC_ is actively pulled to GND through a 16.5kΩ internal resistor - a key differentiator from MAX13042EEBC+ and MAX13045EEBC+. This behavior is fixed per part number and cannot be altered by external circuitry.

Does MAX13043EEBC+ require external pullup resistors?

No, MAX13043EEBC+ does not require external pullup resistors. Each I/O channel integrates a 30µA internal current source that pulls up to its respective supply rail (VCC or VL), supporting both push-pull and open-drain drivers. External pullups are discouraged as they interfere with the internal accelerator circuitry and may degrade rise/fall time performance at 100Mbps.

What package type is used by MAX13043EEBC+?

MAX13043EEBC+ uses a 12-bump UCSP™ (Ultra Compact Silicon Package) measuring 1.54mm × 2.12mm with lead-free solder bumps on the underside. It is not a QFN or TDFN package - the UCSP requires specific PCB pad layout, reflow profile, and inspection methods per Maxim Application Note UCSP – A Wafer-Level Chip-Scale Package.

Can MAX13043EEBC+ translate between 1.2V and 3.3V logic domains?

No, MAX13043EEBC+ cannot translate from 1.2V to 3.3V. Its VL supply range is strictly +1.62V to +3.2V, and VCC range is +2.2V to +3.6V. A 1.2V source falls below the minimum VL specification and will not meet input threshold requirements (VIHL = VL − 0.2V, VILL = 0.15V). For 1.2V interfaces, consider the MAX3378E or MAX3396E families instead.

How does MAX13043EEBC+ achieve 100Mbps performance with low drive strength?

MAX13043EEBC+ achieves 100Mbps performance using internal rise/fall-time accelerator stages that generate short-duration pulses during signal edges to actively charge/discharge load capacitance. This architecture allows full-speed operation even with weak 4mA external drivers, as the accelerators compensate for slow edge rates - validated across 10pF–40pF loads and full temperature range.