Analog Devices Inc./Maxim Integrated MAX13043EEBC+T

Overview

The MAX13043EEBC+T from Maxim Integrated is a 4-channel bidirectional voltage-level translator IC designed for high-speed logic-level conversion between +1.62V–+3.2V (VL) and +2.2V–+3.6V (VCC) domains. It supports guaranteed 100Mbps data transfer, features ±15kV IEC 61000-4-2 ESD protection on I/O VCC_ lines, internal 30µA pullup current sources per channel, and operates across –40°C to +85°C. It enables robust SPI/MICROWIRE level translation in portable communication devices and low-voltage ASIC interfaces.

For engineers reviewing the MAX13043EEBC+T datasheet, MAX13043EEBC+T pinout, MAX13043EEBC+T application, or MAX13043EEBC+T equivalent, this page delivers verified electrical parameters, UCSP-12 package mapping, shutdown behavior (I/O VL_ = high-impedance, I/O VCC_ = 16.5kΩ to GND), timing characteristics (6.5ns propagation delay), and real-world design implications for multivoltage system integration.

Technical Context

The MAX13043EEBC+T implements a BiCMOS-based nMOS pass-gate architecture with edge-triggered rise/fall-time accelerator stages that generate sub-4ns pulses to rapidly charge/discharge I/O capacitances. Its dual-supply operation allows independent VL and VCC rails, with automatic shutdown activated when VCC falls below VL by more than the threshold (0.1VL to 0.8V).

Each of its four bidirectional channels uses internal 30µA current-source pullups-enabling compatibility with both push-pull and open-drain drivers without external resistors-and maintains defined I/O states during shutdown per part variant: MAX13043EEBC+T holds I/O VL_ in high-impedance while pulling I/O VCC_ to GND via 16.5kΩ.

Key Specifications

Pinout & Package

MAX13043EEBC+T is housed in a 12-bump UCSP (1.54mm × 2.12mm) lead-free wafer-level chip-scale package with bottom-mounted solder bumps. The package features an exposed die attach pad (not electrically connected) and requires standard reflow profiles per Maxim's UCSP application note.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with MAX13042EEBC+T and TXB0104RGYR, the MAX13043EEBC+T uniquely combines programmable shutdown (EN-controlled), asymmetric I/O behavior during sleep (Hi-Z VL / pulldown VCC), and industry-leading ±15kV IEC ESD protection-making it optimal for portable electronics demanding both reliability and precise power-state control.

Availability

MAX13043EEBC+T is available at Aetrix Electronics and suitable for portable communication devices, GPS modules, and SPI-based embedded systems requiring stable component supply, long-term lifecycle support, and guaranteed lead-free compliance.

Supply support for MAX13043EEBC+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and high-speed interface solutions for industrial, communications, and consumer markets.

The MAX13042E–MAX13045E product line was engineered specifically for high-speed, low-power bidirectional level translation in multivoltage portable systems-addressing the need for compact, ESD-hardened interfaces between 1.8V ASICs and 3.3V peripherals.

FAQ

What is the shutdown behavior of the MAX13043EEBC+T?

The MAX13043EEBC+T enters low-power shutdown when EN is driven low or when VCC falls below VL by more than the threshold (0.1VL to 0.8V). During shutdown, I/O VL_ assumes high-impedance state while I/O VCC_ is actively pulled to GND through a 16.5kΩ internal resistor-ensuring defined logic-low state on the VCC side without external components. This behavior is fixed for the MAX13043EEBC+T variant and differs from other members of the MAX13042E–MAX13045E family.

Does the MAX13043EEBC+T require external pullup resistors?

No, the MAX13043EEBC+T does not require external pullup resistors. It integrates 30µA current-source pullups on all I/O lines, enabling direct drive from open-drain or push-pull sources. External pullups are discouraged as they interfere with the internal accelerator circuitry and may degrade rise/fall time performance. The internal pullups ensure VOHL ≥ 2/3 VL and VOHC ≥ 2/3 VCC under 20µA load conditions.

What is the maximum capacitive load the MAX13043EEBC+T can drive at 100Mbps?

The MAX13043EEBC+T is characterized for 100Mbps operation with CIOVL_ ≤15pF and CIOVCC_ ≤10pF. Rise/fall times remain ≤2.5ns (typ) within these limits. Driving larger loads increases transition time nonlinearly-e.g., at 40pF on I/O VCC_, tRVCC rises to ~1.2ns (typ) but propagation delay increases to ~4.5ns. For >15pF loads, derating the data rate or verifying timing margins against the "Rise/Fall Time vs. Capacitive Load" curves in the datasheet is required.

Can the MAX13043EEBC+T translate between 1.2V and 3.3V logic levels?

No, the MAX13043EEBC+T cannot translate from 1.2V to 3.3V. Its VL supply range is strictly +1.62V to +3.2V, and VCC must be ≥ VL + 0.2V for normal operation. A 1.2V source falls below the minimum VL specification and would not meet input threshold requirements (VILL = 0.15V, VIHL = VL – 0.2V). For 1.2V interfaces, consider the MAX3378E or TXS0102, which support lower VL ranges.

How does the MAX13043EEBC+T handle power sequencing when VL powers up before VCC?

When VL powers up before VCC, the MAX13043EEBC+T automatically enters shutdown mode because VCC < VL triggers the built-in VCC-VL comparator. In this state, I/O VL_ goes high-impedance and I/O VCC_ is pulled to GND via 16.5kΩ-preventing back-driving or latch-up. Once VCC rises above VL + 0.2V, the device exits shutdown and resumes bidirectional translation. This behavior is inherent to the MAX13043EEBC+T and requires no external sequencing circuitry.