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Home > Products > Integrated Circuits (ICs) > Logic > Translators, Level Shifters

Analog Devices Inc./Maxim Integrated MAX13043EETD+

Name: MAX13043EETD+
Brand: Analog Devices Inc./Maxim Integrated
SKU: MAX13043EETD+
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MAX13043EETD+

Manufacturer:: Analog Devices Inc./Maxim Integrated

Category:: Translators, Level Shifters

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Datasheet:: MAX13043EETD+.pdf

Description:: IMPROVED HIGH-SPEED LLT

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Product details

Overview

MAX13043EETD+ from Maxim Integrated is a 4-channel bidirectional voltage-level translator IC designed for high-speed logic-level translation between 1.62V–3.2V (VL) and 2.2V–3.6V (VCC) domains. It supports guaranteed 100Mbps data rates, features ±15kV IEC 61000-4-2 ESD protection on I/O VCC_ lines, internal 30µA pull-up current sources per channel, and an enable (EN) input for low-power shutdown. It is used in multivoltage SPI/MICROWIRE interfaces in portable communication devices and GPS modules.

For engineers reviewing the MAX13043EETD+ datasheet, MAX13043EETD+ pinout, MAX13043EETD+ application, or MAX13043EETD+ equivalent, this page delivers verified electrical parameters, package-specific pin mapping, real-world timing behavior (e.g., 6.5ns propagation delay), shutdown-state behavior (I/O VCC_ pulled to GND via 16.5kΩ during shutdown), and validated alternative parts for level translation in space-constrained, high-reliability embedded systems.

Technical Context

The MAX13043EETD+ implements a BiCMOS-based nMOS pass-gate architecture with edge-triggered rise/fall-time accelerator stages that generate short pulses to rapidly charge/discharge I/O capacitance-enabling 100Mbps operation even with weak 4mA drivers. Its dual-supply operation requires VL ≤ VCC − 0.2V for normal function, and it automatically enters shutdown when VCC < VL.

During shutdown (EN = GND or VCC < VL), the MAX13043EETD+ places I/O VL_ in high-impedance state and I/O VCC_ in active pulldown (16.5kΩ to GND), as confirmed by the Ordering Information/Selector Guide for part number MAX13043EETD+. This asymmetric shutdown behavior distinguishes it from MAX13042E/MAX13044E variants and directly impacts system bus hold requirements.

Key Specifications

Parameter	Value and Actual Design Meaning
Channels	4 bidirectional I/O channels-supports simultaneous level translation across four signal lines without direction control pins.
Max Data Rate	100Mbps-guaranteed under push-pull drive with C_IOVCC ≤10pF, C_IOVL ≤15pF, and source impedance <150Ω.
V_L Range	+1.62V to +3.2V-enables interfacing with 1.8V/2.5V/3.3V low-voltage ASICs, PLDs, and microcontrollers.
V_CC Range	+2.2V to +3.6V-compatible with 2.5V/3.3V higher-voltage system buses and peripherals.
ESD Protection	±15kV IEC 61000-4-2 contact discharge on I/O VCC_-eliminates need for external TVS diodes in handheld device designs.
Propagation Delay	6.5ns (max)-measured from I/O VL_ to I/O VCC_ or vice versa-ensures tight timing budgets in high-speed serial links.
Shutdown Behavior	I/O VCC_ = 16.5kΩ to GND; I/O VL_ = high-impedance-provides defined bus state on VCC side while isolating VL domain during power sequencing.

Pinout & Package

MAX13043EETD+ uses a 14-pin TDFN-EP (3mm × 3mm) package with exposed paddle (EP) connected to GND. Pin numbering follows standard TDFN top-view layout with pin 1 at bottom-left corner.

Pin/Terminal	Circuit Role	Design Meaning
I/O VL1–I/O VL4	Low-voltage bidirectional I/O	Referenced to VL supply; accept 1.62V–3.2V logic; internally pulled up with 30µA current source.
I/O VCC1–I/O VCC4	High-voltage bidirectional I/O	Referenced to VCC supply; output 2/3×VCC high / 1/3×VCC low; pulldown to GND via 16.5kΩ in shutdown mode.
VCC	High-side power supply	+2.2V to +3.6V; must be ≥ VL + 0.2V for normal operation; powers VCC-side I/O and internal boost circuitry.
VL	Low-side power supply	+1.62V to +3.2V; sets logic thresholds for VL-side I/O; enables automatic shutdown if VCC < VL.
EN	Enable control input	Active-high (VIH = VL − 0.4V); drives device into shutdown when pulled low; overrides automatic shutdown.
GND	Ground reference	Common return for both supplies; exposed paddle (EP) must be soldered to PCB ground plane for thermal and ESD performance.
N.C.	No connection	Pins 4 and 11 are unconnected-must remain floating; no internal bonding or circuitry attached.

Key Features

Feature	Design Value
Bidirectional translation without direction pin	Eliminates PCB routing complexity and firmware overhead in full-duplex protocols like SPI and MICROWIRE.
Edge-accelerated transition timing	Rise/fall times ≤2.5ns (typical) achieved via on-demand pulse-driven output accelerators-not fixed-speed buffers.
Automatic VCC/VL power sequencing detection	Shuts down when VCC drops below VL threshold (V_{TH_L} = 0.12×VL), preventing backfeeding and latch-up in mixed-rail systems.
Integrated 30µA pull-up current sources	Enables direct interface with open-drain drivers (e.g., I²C) without external resistors-reducing BOM count and board area.
Asymmetric shutdown I/O states	I/O VCC_ actively pulled to GND (16.5kΩ) while I/O VL_ floats-preserves VL-domain integrity and simplifies power-down sequencing.

Applications

Portable POS Systems	SPI Level Translation
Use Scenario: Interfacing a 1.8V ARM Cortex-M microcontroller with a 3.3V display controller and SD card slot in a handheld point-of-sale terminal. IC Role / Device Role / Timing Role: Bidirectional level translator for MOSI, MISO, SCLK, and CS signals; maintains 100Mbps timing integrity across voltage domains. Use Value: Enables single-chip translation of all four SPI lines with sub-7ns propagation delay-avoiding skew-induced CRC errors in high-throughput transaction logging.	Use Scenario: Translating SPI signals between a 1.8V FPGA configuration interface and a 3.3V flash memory in industrial programmable logic controllers. IC Role / Device Role / Timing Role: Voltage-level shifter for quad-SPI bus; operates within 2.5ns rise/fall time budget required for 50MHz clock domains. Use Value: Guarantees timing compliance without external acceleration circuits-reducing layout sensitivity and enabling 4-layer PCB cost optimization.
GPS Modules	Cell Phone Baseband Interfaces
Use Scenario: Level-shifting UART and I²C control lines between a 1.8V GPS baseband processor and 3.3V RF front-end and antenna switch ICs. IC Role / Device Role / Timing Role: Bidirectional translator supporting both push-pull (UART TX/RX) and open-drain (I²C SDA/SCL) signaling with integrated 30µA pull-ups. Use Value: Eliminates need for separate pull-up resistors on I²C lines-reducing component count and improving ESD robustness via ±15kV I/O VCC_ protection.	Use Scenario: Connecting a 1.62V application processor to 2.8V camera sensor and audio codec in smartphone mainboard designs. IC Role / Device Role / Timing Role: Low-voltage logic translator for MIPI-like control buses requiring fast edge rates and minimal supply current (25µA IQ_VCC). Use Value: Delivers 100Mbps capability at 1.62V VL-supporting next-gen ultra-low-power mobile SoCs while maintaining compatibility with legacy 3.3V peripherals.

Portable POS Systems

SPI Level Translation

Use Scenario: Interfacing a 1.8V ARM Cortex-M microcontroller with a 3.3V display controller and SD card slot in a handheld point-of-sale terminal.

IC Role / Device Role / Timing Role: Bidirectional level translator for MOSI, MISO, SCLK, and CS signals; maintains 100Mbps timing integrity across voltage domains.

Use Value: Enables single-chip translation of all four SPI lines with sub-7ns propagation delay-avoiding skew-induced CRC errors in high-throughput transaction logging.

Use Scenario: Translating SPI signals between a 1.8V FPGA configuration interface and a 3.3V flash memory in industrial programmable logic controllers.

IC Role / Device Role / Timing Role: Voltage-level shifter for quad-SPI bus; operates within 2.5ns rise/fall time budget required for 50MHz clock domains.

Use Value: Guarantees timing compliance without external acceleration circuits-reducing layout sensitivity and enabling 4-layer PCB cost optimization.

GPS Modules

Cell Phone Baseband Interfaces

Use Scenario: Level-shifting UART and I²C control lines between a 1.8V GPS baseband processor and 3.3V RF front-end and antenna switch ICs.

IC Role / Device Role / Timing Role: Bidirectional translator supporting both push-pull (UART TX/RX) and open-drain (I²C SDA/SCL) signaling with integrated 30µA pull-ups.

Use Value: Eliminates need for separate pull-up resistors on I²C lines-reducing component count and improving ESD robustness via ±15kV I/O VCC_ protection.

Use Scenario: Connecting a 1.62V application processor to 2.8V camera sensor and audio codec in smartphone mainboard designs.

IC Role / Device Role / Timing Role: Low-voltage logic translator for MIPI-like control buses requiring fast edge rates and minimal supply current (25µA IQ_VCC).

Use Value: Delivers 100Mbps capability at 1.62V VL-supporting next-gen ultra-low-power mobile SoCs while maintaining compatibility with legacy 3.3V peripherals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MAX13042EETD+	I/O VCC_ and I/O VL_ both enter high-impedance state during shutdown-no pulldown on VCC side.	Suitable where bus isolation on both sides is required during power-down (e.g., hot-swap systems).	Select MAX13042EETD+ only if symmetric high-Z shutdown is mandatory; MAX13043EETD+ preferred when VCC-side bus hold is needed.
TXB0104RUTR	4-channel auto-direction-sensing translator with 1.2V–3.6V VL and 1.65V–5.5V VCC ranges; no EN pin; different internal architecture (pass transistor + buffer).	Used in USB OTG, Bluetooth modules; lacks ±15kV ESD rating and guaranteed 100Mbps spec-rated for 100Mbps typical only.	Choose TXB0104RUTR for wider voltage flexibility and directionless operation; choose MAX13043EETD+ for deterministic timing, ESD-critical environments, and explicit EN control.

Compared with MAX13042EETD+, MAX13043EETD+ provides active VCC-side pulldown during shutdown-critical for preventing floating bus states in powered-down subsystems. Against TXB0104RUTR, it offers superior ESD immunity and production-guaranteed 100Mbps performance, making it preferable for automotive-grade portable electronics and industrial telemetry.

Availability

MAX13043EETD+ is available at Aetrix Electronics and suitable for portable POS systems, GPS modules, cell phone baseband interfaces, and SPI/MICROWIRE level translation requiring stable component supply across extended temperature (-40°C to +85°C) and high-reliability production cycles.

Supply support for MAX13043EETD+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.

The MAX13042E–MAX13045E family was designed specifically for high-speed, low-power bidirectional level translation in space-constrained portable electronics-addressing the need for guaranteed 100Mbps operation, robust ESD protection, and intelligent power sequencing in multivoltage SoC interfaces.

FAQ

What is the shutdown behavior of MAX13043EETD+ on I/O VCC_ and I/O VL_ pins?

When MAX13043EETD+ enters shutdown-either via EN = GND or automatic VCC < VL detection-I/O VL_ transitions to high-impedance, while I/O VCC_ is actively pulled to GND through an internal 16.5kΩ resistor. This asymmetric behavior is confirmed in the Ordering Information/Selector Guide for MAX13043EETD+ and ensures defined bus state on the VCC side during power-down sequences, unlike MAX13042EETD+ which places both sides in high-Z.

Does MAX13043EETD+ support open-drain drivers like I²C?

Yes, MAX13043EETD+ supports open-drain drivers via its internal 30µA pull-up current sources on both I/O VL_ and I/O VCC_ lines-eliminating the need for external pull-up resistors. The device's architecture allows direct connection to I²C buses, though for strict I²C compliance (e.g., rise time control), external resistors may still be added; however, the datasheet explicitly warns against using them due to potential interaction with internal accelerators.

What is the maximum capacitive load MAX13043EETD+ can drive at 100Mbps?

MAX13043EETD+ guarantees 100Mbps operation with C_IOVCC ≤10pF and C_IOVL ≤15pF, as specified in the Timing Characteristics table. Rise/fall times degrade linearly beyond these values-e.g., t_RVCC increases from 2.5ns to ~1.2ns at 40pF (per Figure TOC09). For reliable 100Mbps, total trace + pin + receiver capacitance must stay within these limits; layout best practices (short traces, ground planes) are essential.

Can MAX13043EETD+ operate with VL > VCC?

No-MAX13043EETD+ requires VL ≤ VCC − 0.2V during normal operation per the Level Translation section. If VL exceeds VCC, the device automatically enters shutdown mode (V_{TH_L} = 0.12×VL). While brief VL > VCC during startup is tolerated, sustained violation risks undefined behavior, increased leakage, and potential damage per Absolute Maximum Ratings (VCC, VL limited to −0.3V to +4V, but functional range is strictly constrained).

What package variants does MAX13043EETD+ come in, and what is the exposed paddle connection?

MAX13043EETD+ is exclusively offered in the 14-pin TDFN-EP (3mm × 3mm) package with exposed paddle (EP), identified by "T1433-2" pkg code. The exposed paddle must be soldered to a PCB ground plane-it is internally connected to GND and critical for thermal dissipation (1951mW max power at +70°C) and ESD performance. Unlike UCSP variants, this TDFN version has no alternative bump-count or footprint options.

MAX13043EETD+ Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc./Maxim Integrated

Series:: -

Package/Case:

Packaging:: Bulk

Product Status:: Obsolete

Translator Type:: Voltage Level

Channel Type:: Bidirectional

Number of Circuits:: 1

Channels per Circuit:: 4

Voltage - VCCA:: 2.2 V ~ 3.6 V

Voltage - VCCB:: 1.62 V ~ 3.2 V

Input Signal:: -

Output Signal:: -

Output Type:: Non-Inverted

Data Rate:: 100Mbps

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Features:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 14-WFDFN Exposed Pad

MAX13043EETD+ FAQ

1.How can I place an order for MAX13043EETD+ through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX13043EETD+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX13043EETD+ reliable?

The price and inventory of MAX13043EETD+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13043EETD+ is usually 5 days.

3.What payment methods are accepted for MAX13043EETD+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13043EETD+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX13043EETD+?

MAX13043EETD+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX13043EETD+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX13043EETD+?

For technical support, including MAX13043EETD+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13043EETD+ requirements.

6.How does Aetrix verify that MAX13043EETD+ is sourced from the original manufacturer or authorized distributors?

All MAX13043EETD+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13043EETD+ meets industry standards.

7.What is the process for return or replacement of MAX13043EETD+?

All MAX13043EETD+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX13043EETD+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX13043EETD+ part is unused and in its original packaging.

Return procedure for MAX13043EETD+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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