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Analog Devices Inc./Maxim Integrated MAX13047EEVB+T

Part No.:
MAX13047EEVB+T
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Translators, Level Shifters
Package:
Datasheet:
AetrixMAX13047EEVB+T.pdf
Description:
IC TRANSLATOR BIDIR 10UTQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,041

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Product details

Overview

The MAX13047EEVB+T from Maxim Integrated is a dual-channel, bidirectional, ±15kV ESD-protected level translator IC designed for voltage-level shifting between low-voltage (VL = +1.1V to +3.6V) and higher-voltage (VCC = +1.65V to +5.5V) domains in multivoltage systems. It supports guaranteed 8Mbps push-pull data rates, features shutdown mode with <1μA supply current, and uses transmission-gate architecture for true bidirectional translation on each channel. It is commonly used in I²C and 1-Wire interface bridging between low-power ASICs/PLDs and 3.3V/5V peripherals.

For engineers reviewing the MAX13047EEVB+T datasheet, MAX13047EEVB+T pinout, MAX13047EEVB+T application, or MAX13047EEVB+T equivalent, key selection considerations include its dual-channel UTQFN-10 package, VL/VCC supply flexibility, ±15kV HBM ESD rating on VCC-side I/Os, thermal short-circuit protection, and compatibility with rail-to-rail or open-drain driving topologies.

Technical Context

The MAX13047EEVB+T implements a transmission-gate-based bidirectional level-shifting architecture with integrated rise-time accelerators on both VL and VCC sides, enabling up to 16Mbps operation under +1.8V ≤ VL ≤ VCC ≤ +3.3V conditions. Its internal 10kΩ pullup resistors on I/O VL and I/O VCC lines support open-drain configurations without external components.

Shutdown is controlled via the SHDN pin, which disconnects internal pullups and forces I/Os into high-impedance state while limiting total supply current to <1μA. The device incorporates thermal-overload detection that triggers automatic shutdown at TJ > +150°C and resumes operation below +140°C.

Key Specifications

Parameter Value and Actual Design Meaning
Channels Dual-channel - enables simultaneous level translation of two independent bidirectional signal paths (e.g., I²C SDA/SCL).
VL Supply Range +1.1V to min(+3.6V, VCC + 0.3V) - supports ultra-low-voltage logic (e.g., 1.2V/1.8V ASICs) interfacing with higher-voltage buses.
VCC Supply Range +1.65V to +5.5V - compatible with 1.8V, 2.5V, 3.3V, and 5V system rails without level-shifter reconfiguration.
Max Data Rate (Push-Pull) 8Mbps (guaranteed), 16Mbps (under +1.8V ≤ VL ≤ VCC ≤ +3.3V) - meets high-speed I²C Fast-mode Plus and 1-Wire timing requirements.
ESD Protection (I/O VCC) ±15kV HBM, ±15kV IEC61000-4-2 air-gap, ±8kV IEC61000-4-2 contact - eliminates need for external TVS diodes in exposed signal routing.
Shutdown Current <1μA (max) - enables zero-power standby in battery-powered portable devices during sleep modes.
Operating Temp Range –40°C to +85°C - qualified for industrial and consumer embedded applications without derating.

Pinout & Package

The MAX13047EEVB+T is housed in a 10-pin UTQFN package (1.4mm × 1.8mm, 0.5mm pitch) with wettable flanks for automated optical inspection. Thermal resistance θJA = 20.1°C/W enables reliable operation at full speed without heatsinking in compact layouts.

Pin/Terminal Circuit Role Design Meaning
1, 10 I/O VL2 / I/O VL1 Bidirectional data terminals referenced to VL - connect to low-voltage side signals (e.g., 1.8V microcontroller I²C lines).
2 VL Low-voltage supply input - must be bypassed with 0.1µF ceramic capacitor; sets logic threshold for VL-side I/Os.
3, 7 N.C. No internal connection - left unconnected per datasheet; no PCB trace or solder required.
4 SHDN Active-high enable control - drive high for normal operation; low places device in ultra-low-power shutdown.
5, 8 I/O VCC2 / I/O VCC1 Bidirectional data terminals referenced to VCC - connect to higher-voltage side signals (e.g., 3.3V sensor interface).
6 VCC High-voltage supply input - requires 1µF ceramic capacitor for full ±15kV ESD protection; sets logic threshold for VCC-side I/Os.
9 GND Analog/digital ground reference - must be connected to system ground plane with low-inductance path to minimize noise coupling.

Key Features

Feature Design Value
Bidirectional Translation Transmission-gate core enables automatic direction detection - no control pins or configuration needed for VL ↔ VCC data flow.
Rise-Time Acceleration Integrated edge- and level-sensitive accelerators reduce tR/tF to ≤15ns (CL = 15pF) - maintains signal integrity at 16Mbps without external buffers.
Thermal Short-Circuit Protection Automatic shutdown at TJ > +150°C with hysteresis - prevents latch-up or permanent damage during sustained I/O fault conditions.
Supply-Independent Shutdown Operates with VL active and VCC disconnected - allows partial power-down of host system while preserving low-voltage domain functionality.
ESD-Robust I/O Architecture On-chip protection structures withstand ±15kV HBM on VCC-side I/Os in all states (active/shutdown/power-off) - simplifies system-level ESD compliance.

Applications

I²C Bus Level Translation 1-Wire Interface Bridging

Use Scenario: Interfacing a 1.8V microcontroller to a 3.3V I²C temperature sensor in a portable medical monitor.

IC Role / Device Role: Bidirectional level translator for SDA and SCL lines, maintaining protocol timing and open-drain behavior.

Use Value: Eliminates external pullup resistors on VL side and ensures 8Mbps timing compliance without signal distortion or bus contention.

Use Scenario: Connecting a 1.2V FPGA to a DS2502 1-Wire EEPROM in an asset-tracking tag.

IC Role / Device Role: Voltage-level shifter for bidirectional 1-Wire data line, supporting parasitic power mode.

Use Value: Enables direct interface without level-shifter configuration overhead; 16.3kbps operation verified with DS2502 timing constraints.

Low-Voltage ASIC-to-Peripheral Bridge Multi-Rail Industrial Sensor Hub

Use Scenario: Linking a 1.1V AI accelerator ASIC to legacy 5V analog front-end ICs in an edge inference module.

IC Role / Device Role: Dual-channel translator handling separate control and status signals across voltage domains.

Use Value: Supports VL as low as +1.1V - critical for advanced-node logic while maintaining robustness against VCC = +5.5V transients.

Use Scenario: Aggregating sensor data from 1.8V MEMS accelerometers and 3.3V pressure transducers onto a single 5V microcontroller bus.

IC Role / Device Role: Dual-channel translator enabling concurrent communication with heterogeneous sensors.

Use Value: Single UTQFN-10 device replaces discrete solutions - reduces BOM count, PCB area, and layout complexity in space-constrained hubs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Alternative Part Technical Difference Application Difference Selection Advice
TXS0102DCUR 2-channel, 1.65V–5.5V VCCA/VCCB, no integrated ESD protection beyond 2kV HBM, max 60Mbps but requires external pullups for open-drain use. Lacks ±15kV IEC61000-4-2 rated ESD protection - mandates external TVS diodes in harsh environments or exposed connectors. Preferred where ultra-high speed (>8Mbps) and minimal propagation delay dominate; accept added board area and cost for external protection.
PCA9306DCUR 2-channel, 1.2V–3.3V VL, 1.8V–5.5V VH, no shutdown mode, no thermal protection, 400kbps typical I²C rate, no rise-time acceleration. Not suitable for 1.1V VL operation or 8Mbps push-pull applications; lacks fail-safe shutdown and ESD robustness for portable designs. Appropriate only for cost-sensitive, low-speed (<400kbps), non-portable applications where ESD risk is negligible and thermal faults are unlikely.

Compared with TXS0102DCUR and PCA9306DCUR, the MAX13047EEVB+T uniquely delivers integrated ±15kV ESD protection, sub-1μA shutdown, thermal fault recovery, and guaranteed 8Mbps performance down to VL = +1.1V - making it the only option qualified for ruggedized portable and industrial I²C/1-Wire bridges without design compromises.

Availability

The MAX13047EEVB+T is available at Aetrix Electronics and suitable for I²C bus translation, 1-Wire interface bridging, low-voltage ASIC-to-peripheral interconnect, and multi-rail industrial sensor hub applications requiring stable component supply across production lifecycles.

Supply support for MAX13047EEVB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power-management ICs for industrial, automotive, communications, and consumer markets.

The MAX13047EEVB+T belongs to Maxim's bidirectional level translator product line, engineered specifically for robust, low-power, ESD-hardened voltage-domain bridging in portable and space-constrained embedded systems.

FAQ

What is the minimum VL supply voltage supported by the MAX13047EEVB+T?

The MAX13047EEVB+T supports VL as low as +1.1V, enabling direct interfacing with advanced low-power logic families such as 1.2V and 1.1V ASICs and PLDs. This specification is guaranteed over the full –40°C to +85°C operating temperature range and is validated in the Electrical Characteristics table under "VL Supply Range" with MIN = 1.1V.

Does the MAX13047EEVB+T require external pullup resistors for I²C operation?

No - the MAX13047EEVB+T integrates 10kΩ pullup resistors on both I/O VL and I/O VCC lines, eliminating the need for external pullups in standard open-drain I²C configurations. These internal resistors are automatically disconnected during shutdown mode to maintain high-impedance I/O states.

Can the MAX13047EEVB+T operate with VCC disconnected while VL remains powered?

Yes - the MAX13047EEVB+T enters shutdown mode when VCC is disconnected or grounded while VL is active. In this state, I/O VL remains functional and undamaged, though translation to I/O VCC is disabled. This feature enables selective power gating in battery-operated systems without risking device damage.

What ESD protection standards does the MAX13047EEVB+T meet on its VCC-side I/Os?

The MAX13047EEVB+T provides ±15kV Human Body Model (HBM), ±15kV IEC61000-4-2 air-gap discharge, and ±8kV IEC61000-4-2 contact discharge protection on I/O VCC pins. This exceeds Level 4 IEC61000-4-2 system-level immunity requirements and removes the need for external ESD suppression components in most end-equipment designs.

How does the MAX13047EEVB+T handle thermal overload conditions?

The MAX13047EEVB+T incorporates thermal-overload detection that triggers automatic shutdown when junction temperature exceeds +150°C. Once cooled below +140°C, the device autonomously resumes normal operation - providing self-protecting behavior during sustained I/O short-circuit events without requiring external monitoring circuitry.

MAX13047EEVB+T Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
Packaging:
Tape & Reel (TR)
Product Status:
Active
Translator Type:
Voltage Level
Channel Type:
Bidirectional
Number of Circuits:
1
Channels per Circuit:
2
Voltage - VCCA:
1.1 V ~ 3.6 V
Voltage - VCCB:
1.65 V ~ 5.5 V
Input Signal:
-
Output Signal:
-
Output Type:
Push-Pull
Data Rate:
16Mbps
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Features:
Thermal-Shutdown Protection
Mounting Type:
Surface Mount
Supplier Device Package:
10-UFQFN

MAX13047EEVB+T FAQ

1.How can I place an order for MAX13047EEVB+T through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX13047EEVB+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX13047EEVB+T reliable?

The price and inventory of MAX13047EEVB+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13047EEVB+T is usually 5 days.

3.What payment methods are accepted for MAX13047EEVB+T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13047EEVB+T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX13047EEVB+T?

MAX13047EEVB+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX13047EEVB+T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX13047EEVB+T?

For technical support, including MAX13047EEVB+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13047EEVB+T requirements.

6.How does Aetrix verify that MAX13047EEVB+T is sourced from the original manufacturer or authorized distributors?

All MAX13047EEVB+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13047EEVB+T meets industry standards.

7.What is the process for return or replacement of MAX13047EEVB+T?

All MAX13047EEVB+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX13047EEVB+T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX13047EEVB+T part is unused and in its original packaging.

Return procedure for MAX13047EEVB+T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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