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Analog Devices Inc./Maxim Integrated MAX13055EETI+
- Part No.:
- MAX13055EETI+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX13055EETI+.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 28TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,226
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Product details
Overview
MAX13055EETI+ from Maxim Integrated is an 8-channel, bidirectional, high-speed logic-level translator IC designed for voltage-domain bridging between low-voltage (1.62V–3.2V) and higher-voltage (2.2V–3.6V) digital interfaces. It supports guaranteed 100Mbps data transfer with 2.5ns typical rise/fall times, internal 40µA pullup current sources per I/O, and automatic shutdown when VCC < VL. It is used in portable communication devices, camera modules, and smart card readers requiring robust multivoltage signal integrity.
For engineers reviewing the MAX13055EETI+ datasheet, MAX13055EETI+ pinout, MAX13055EETI+ application, or MAX13055EETI+ equivalent, key selection considerations include its 28-pin TQFN-EP package, open-drain I/O states during shutdown, ±15kV HBM ESD protection on I/O VCC lines, and compatibility with both push-pull and open-drain drivers sourcing ≥4mA.
Technical Context
The MAX13055EETI+ employs an nMOS pass-gate architecture with dedicated rise/fall time accelerator stages per channel-generating short-duration output pulses to actively charge/discharge load capacitance during signal transitions. This enables sub-3ns edge speeds even with 15pF loads while maintaining bidirectional operation without direction control pins.
It features dual-supply operation (VL = 1.62V–3.2V, VCC = 2.2V–3.6V), EN-controlled shutdown (≤2µA VCC supply current), and automatic disable when VCC falls below VL. During shutdown, both I/O VL_ and I/O VCC_ terminals enter open-drain state-ensuring high-impedance isolation without external pull resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 8 bidirectional I/O channels-enables compact translation of full parallel buses or multi-signal interfaces like camera or memory control lines. |
| Max Data Rate | 100Mbps (push-pull mode)-supports high-speed serial protocols including SPI, UART, and parallel data links in portable systems. |
| Rise/Fall Time | 2.5ns typical (CI/O = 10–15pF)-ensures signal integrity at high frequencies without external termination or slew-rate control. |
| Supply Range | VL: +1.62V to +3.2V; VCC: +2.2V to +3.6V-matches common low-power ASIC/PLD core voltages (1.8V) and I/O rails (3.3V). |
| ESD Protection | ±15kV HBM, ±15kV IEC 61000-4-2 air, ±8kV contact on I/O VCC-eliminates need for external TVS diodes in handheld and POS applications. |
| Shutdown Current | ≤2µA total (VCC + VL)-enables battery-powered operation with negligible quiescent drain during sleep modes. |
| Internal Pullup | 40µA per I/O-allows direct interface with open-drain drivers (e.g., I²C) without external resistors, reducing BOM count and board space. |
Pinout & Package
MAX13055EETI+ is housed in a RoHS-compliant, lead-free 28-pin TQFN-EP package (3.5mm × 5.5mm, 0.5mm pitch) with exposed thermal pad connected to GND. The package supports automated assembly and provides low thermal resistance (θJA = 35°C/W).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1,12–14,24–27 | N.C. | No internal connection-must be left floating or grounded per layout best practices; no routing required. |
| 2–10 | I/O VL1–VL8 | Bidirectional signals referenced to VL supply-connect to 1.62V–3.2V domain (e.g., baseband processor I/O). |
| 11 | EN | Active-high enable-drive high for normal operation; low disables all channels and forces I/O into open-drain shutdown state. |
| 15–18,20–23 | I/O VCC1–VCC8 | Bidirectional signals referenced to VCC supply-interface with 2.2V–3.6V domain (e.g., PMIC or sensor I/O). |
| 19 | VCC | +2.2V to +3.6V power rail-requires local 1µF + 0.1µF ceramic decoupling for noise suppression and ESD immunity. |
| 28 | VL | +1.62V to +3.2V logic reference-bypass with 0.1µF ceramic capacitor; defines low-side logic thresholds. |
| 6, B3–B5 | GND | Ground return for both supplies-multiple pins reduce ground impedance and improve noise rejection. |
| EP | Exposed Pad | Thermal and electrical ground-must be soldered to PCB ground plane for thermal performance and ESD path integrity. |
Key Features
| Feature | Design Value |
|---|---|
| 8-channel bidirectional translation | Eliminates need for separate TX/RX translators or direction-control logic-reduces component count and routing complexity in multivoltage SoC interconnects. |
| 100Mbps guaranteed data rate | Validated across full temperature (-40°C to +85°C) and supply ranges-ensures timing margin for real-time interfaces in industrial and portable equipment. |
| Internal 40µA pullup current sources | Enables seamless interoperability with open-drain drivers (e.g., I²C, SMBus) without external resistors-saves PCB area and avoids RC timing uncertainty. |
| Automatic VCC < VL shutdown | Prevents back-powering or latch-up during asymmetric power sequencing-critical for battery-backed systems with independent domain power rails. |
| ±15kV HBM ESD on I/O VCC | Meets IEC 61000-4-2 Level 4 system-level ESD requirements-reduces or eliminates need for discrete protection components in end-equipment design. |
Applications
| Smart Card Readers | Camera Modules |
|---|---|
Use Scenario: Translating command/response signals between a 1.8V smart card controller and a 3.3V host microcontroller in payment terminals or secure ID readers. IC Role / Device Role / Timing Role: Bidirectional level shifter enabling full-duplex ISO/IEC 7816-3 compliant communication without direction control or timing skew. Use Value: Guarantees 100Mbps throughput and 2.5ns edge fidelity-preserves protocol timing margins while supporting hot-plug detection and reset signaling. |
Use Scenario: Bridging MIPI CSI-2 D-PHY data lanes or parallel image data bus between a 1.62V image sensor and a 3.3V application processor in mobile cameras. IC Role / Device Role / Timing Role: High-speed, low-skew (≤2ns channel-to-channel) translator preserving signal integrity across multiple parallel data paths. Use Value: Internal rise/fall accelerators maintain sub-3ns transitions under 15pF load-prevents bit errors and frame corruption in high-resolution video capture. |
| Portable POS Systems | Cell Phones |
Use Scenario: Interfacing a low-voltage NFC controller (1.8V) with a 3.3V secure element or display driver in handheld point-of-sale terminals. IC Role / Device Role / Timing Role: Voltage-domain isolator with open-drain shutdown state-ensures safe I/O isolation during power-down sequences. Use Value: ≤2µA shutdown current extends battery life; ±15kV HBM ESD withstand protects against user-handling events in unshielded retail environments. |
Use Scenario: Level-shifting GPIO, interrupt, and reset signals between a 1.8V modem baseband and 3.3V power management IC in LTE/5G smartphones. IC Role / Device Role / Timing Role: Compact, low-power bidirectional translator supporting dynamic voltage scaling and fast wake-up latency. Use Value: 28-pin TQFN-EP (3.5mm × 5.5mm) fits tight RF module layouts; automatic VCC < VL shutdown prevents leakage during modem sleep states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX13056EETI+ | I/O VCC_ pulled down to GND (10kΩ) during shutdown; I/O VL_ remains open-drain. | Suitable where VCC-side bus must be actively held low during sleep (e.g., reset line assertion). | Select MAX13056EETI+ only if controlled low-state on VCC-side I/O during shutdown is required-otherwise MAX13055EETI+ offers symmetric open-drain isolation. |
| MAX3378EASA+ | 4-channel, unidirectional translator with integrated 10kΩ pullups; no automatic VCC/VL sequencing detection. | Designed for I²C/SMBus with fixed-direction clock/data separation-not suitable for full-duplex or parallel bus translation. | Choose MAX3378EASA+ only for dedicated I²C translation; MAX13055EETI+ is superior for 8-channel, bidirectional, high-speed general-purpose use. |
Compared with MAX13056EETI+, MAX13055EETI+ provides symmetrical open-drain shutdown on both sides-ideal for systems requiring complete bus float. Against MAX3378EASA+, it delivers double the channel count, true bidirectionality, and 25× higher speed-making it appropriate for next-generation portable interfaces beyond legacy I²C.
Availability
MAX13055EETI+ is available at Aetrix Electronics and suitable for portable communication devices, camera modules, and smart card readers requiring stable component supply across extended temperature and long production lifecycles.
Supply support for MAX13055EETI+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog and mixed-signal ICs for power, sensing, connectivity, and interface applications.
The MAX13055E–MAX13058E family was engineered for high-speed, low-power, multivoltage system interconnect-targeting portable, battery-operated, and space-constrained electronics where signal integrity and supply sequencing robustness are critical.
FAQ
What is the maximum supported data rate for MAX13055EETI+ in push-pull mode?
The MAX13055EETI+ guarantees 100Mbps data transfer in push-pull configuration across its full operating temperature range (-40°C to +85°C) and supply voltage ranges (VL = 1.62V–3.2V, VCC = 2.2V–3.6V). This is validated with 10pF/15pF capacitive loads and source impedances under 150Ω. Open-drain operation supports up to 1Mbps due to reliance on internal 40µA pullup current.
Does MAX13055EETI+ require external pullup resistors on its I/O lines?
No, MAX13055EETI+ does not require external pullup resistors. It integrates 40µA internal current sources on each I/O line-sufficient to drive open-drain signals and eliminate external components. The datasheet explicitly advises against using external pullups, as they conflict with the internal accelerator architecture and may degrade edge speed or cause contention.
What happens to the I/O pins of MAX13055EETI+ during shutdown mode?
When enabled low (EN = GND) or when VCC drops below VL, MAX13055EETI+ enters shutdown mode. In this state, both I/O VL_ and I/O VCC_ pins default to open-drain configuration-presenting high-impedance outputs with no active pullup or pulldown. This behavior is confirmed in the Ordering Information/Selector Guide for the MAX13055EETI+ variant.
Can MAX13055EETI+ translate between 1.8V and 3.3V logic domains?
Yes, MAX13055EETI+ is specifically designed for 1.8V-to-3.3V translation: VL can be set to +1.8V (within 1.62V–3.2V range) and VCC to +3.3V (within 2.2V–3.6V range). Input thresholds scale with supply (e.g., VIHL = VL – 0.2V, VIHC = VCC – 0.4V), ensuring reliable recognition of logic levels across both domains.
What package type and thermal characteristics does MAX13055EETI+ use?
MAX13055EETI+ uses a 28-pin TQFN-EP package (3.5mm × 5.5mm, 0.5mm pitch) with exposed thermal pad. Its junction-to-ambient thermal resistance (θJA) is 35°C/W, and junction-to-case (θJC) is 2.7°C/W-enabling efficient heat dissipation in compact portable designs without additional heatsinking.
MAX13055EETI+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Tube
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 8
- Voltage - VCCA:
- 1.62 V ~ 3.2 V
- Voltage - VCCB:
- 2.2 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain, Push-Pull
- Data Rate:
- 100Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Power Supply Decoupling
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-WFQFN Exposed Pad
MAX13055EETI+ FAQ
1.How can I place an order for MAX13055EETI+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX13055EETI+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX13055EETI+ reliable?
The price and inventory of MAX13055EETI+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13055EETI+ is usually 5 days.
3.What payment methods are accepted for MAX13055EETI+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13055EETI+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX13055EETI+?
MAX13055EETI+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX13055EETI+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX13055EETI+?
For technical support, including MAX13055EETI+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13055EETI+ requirements.
6.How does Aetrix verify that MAX13055EETI+ is sourced from the original manufacturer or authorized distributors?
All MAX13055EETI+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13055EETI+ meets industry standards.
7.What is the process for return or replacement of MAX13055EETI+?
All MAX13055EETI+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX13055EETI+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX13055EETI+ part is unused and in its original packaging.
Return procedure for MAX13055EETI+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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