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Analog Devices Inc./Maxim Integrated MAX13055EETI+T
- Part No.:
- MAX13055EETI+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX13055EETI+T.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 28TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,786
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Product details
Overview
The MAX13055EETI+T from Maxim Integrated is an 8-channel, bidirectional, high-speed logic-level translator IC designed for voltage translation between 1.62V–3.2V (VL) and 2.2V–3.6V (VCC) domains in multivoltage systems. It supports guaranteed 100Mbps data transfer with push-pull drivers, features internal 40µA pullup current sources per I/O, and includes enable-controlled and automatic VCC/VL-dependent shutdown modes. It is used in portable communication devices, camera modules, and smart card readers requiring low-power, high-fidelity level shifting.
For engineers reviewing the MAX13055EETI+T datasheet, MAX13055EETI+T pinout, MAX13055EETI+T application, or MAX13055EETI+T equivalent, key selection criteria include bidirectional 100Mbps timing performance, dual-supply voltage flexibility (VL down to 1.62V, VCC up to 3.6V), ESD robustness (±15kV HBM), shutdown behavior (open-drain I/O states), and TQFN-EP package compatibility with high-density PCB layouts.
Technical Context
The MAX13055EETI+T implements an nMOS pass-gate architecture with dedicated rise/fall time accelerator stages per channel, enabling sub-7ns propagation delay (tPVCC-VL/tPVL-VCC ≤6.5ns) and 2.5ns typical rise/fall times under 15pF/10pF loads. Its dual-supply operation requires VL ≤ VCC – 0.2V during normal use but tolerates VL > VCC during startup/shutdown without latch-up.
Each I/O channel is internally pulled up to its respective supply (VL or VCC) via a 40µA current source, eliminating need for external resistors and supporting both open-drain and push-pull drivers. The EN input enables active-low shutdown, while automatic shutdown activates when VCC falls below VL - both placing I/O VL_ and I/O VCC_ into open-drain state per the MAX13055E variant specification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 8 bidirectional I/O channels - enables compact translation of full parallel buses or multi-signal interfaces |
| Data Rate | 100Mbps guaranteed - supports high-speed serial links like I²C fast-mode+, SPI, or GPIO-bus protocols |
| Supply Range VL | +1.62V to +3.2V - compatible with 1.8V/2.5V/3.3V low-voltage ASICs, PLDs, and mobile SoCs |
| Supply Range VCC | +2.2V to +3.6V - interfaces directly with 2.5V/3.3V system rails without external regulators |
| Propagation Delay | 1ns to 6.5ns - ensures timing-critical signal integrity across voltage domains with minimal skew (≤2ns) |
| ESD Protection | ±15kV HBM, ±15kV IEC 61000-4-2 air, ±8kV contact - eliminates need for external TVS on I/O VCC_ lines |
| Shutdown Current | ≤2µA from VCC, ≤4µA from VL - enables ultra-low-power sleep states in battery-operated devices |
Pinout & Package
MAX13055EETI+T is housed in a RoHS-compliant, lead-free 28-pin TQFN-EP package (3.5mm × 5.5mm, 0.5mm pitch) with exposed thermal pad connected to GND. Pin mapping follows standard I/O pairing: I/O VL1–VL8 on one side, corresponding I/O VCC1–VCC8 on the opposite side, with dedicated VL, VCC, EN, and GND pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 12, 13, 14, 24, 25, 26, 27 | N.C. | No internal connection - must be left floating or grounded per layout best practice; no routing required |
| 2–10 (I/O VL1–VL8) | VL-referenced bidirectional I/O | Interface with low-voltage domain (1.62V–3.2V); driven by or drives ASIC/PLD logic |
| 11 | EN | Active-high enable - drive high for normal operation; low forces shutdown with open-drain I/O states |
| 15–23 (I/O VCC8–VCC1) | VCC-referenced bidirectional I/O | Interface with higher-voltage domain (2.2V–3.6V); connects to microcontroller, FPGA, or system bus |
| 19, 20, 21, 22, 23 | VCC | Main power rail - requires local 1µF + 0.1µF ceramic decoupling; shared across multiple pins for low impedance |
| 6, 28 | GND / VL | Ground reference and VL supply - VL bypassed with 0.1µF capacitor; GND pins provide return path for all supplies |
| 28 | VL | Low-voltage logic supply - sets input/output thresholds for VL-side I/O; must be ≤ VCC − 0.2V in operation |
| EP (exposed pad) | Thermal/Ground plane | Must be soldered to solid GND copper area - improves thermal dissipation (θJA = 35°C/W) and EMI performance |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional 100Mbps translation | Enables full-duplex, non-inverting level shift without direction-control pins - reduces BOM and routing complexity |
| Internal 40µA pullup current sources | Eliminates external pullup resistors on both VL and VCC sides - saves board space and avoids RC timing uncertainty |
| Automatic VCC/VL shutdown detection | Disables translation when VCC < VL - prevents backfeeding and ensures safe power sequencing in mixed-rail systems |
| Open-drain I/O state in shutdown | Guarantees high-impedance, non-driving I/O during power-down - avoids bus contention in multi-device systems |
| Rise/fall time accelerator circuitry | Reduces edge distortion under capacitive load - maintains signal fidelity up to 40pF without external compensation |
Applications
| Smart Card Readers | Camera Modules |
|---|---|
|
Use Scenario: Translating command/data signals between a 1.8V smart card controller and a 3.3V host processor over ISO/IEC 7816 interface. IC Role / Device Role / Timing Role: Bidirectional level translator ensuring protocol-compliant voltage levels and timing margins for clock, reset, and I/O lines. Use Value: Guarantees 100Mbps capability exceeds ISO/IEC 7816-3 asynchronous T=0/T=1 timing requirements while maintaining ±15kV ESD protection on host-facing I/O VCC_ pins. |
Use Scenario: Interfacing a 1.8V image sensor's parallel data bus (D0–D7, HSYNC, VSYNC) with a 3.3V application processor's camera interface. IC Role / Device Role / Timing Role: Simultaneous 8-channel translation preserving setup/hold timing across all data lanes with ≤2ns channel-to-channel skew. Use Value: Internal 40µA pullups eliminate need for 8 external resistors, reducing layout area and parasitic capacitance that would degrade 100Mbps pixel clock edges. |
| Portable POS Systems | Cell Phones |
|
Use Scenario: Level-shifting GPIO, interrupt, and status signals between a 1.62V secure element and a 3.3V payment controller in EMV-compliant terminals. IC Role / Device Role / Timing Role: Low-power translator with shutdown mode activated during idle periods to extend battery life. Use Value: Shutdown current ≤2µA from VCC and ≤4µA from VL minimizes quiescent drain, while open-drain I/O states prevent leakage paths during sleep. |
Use Scenario: Bridging baseband processor (1.8V) and application processor (2.8V) I²C control lines for sensor hub, audio codec, or PMIC configuration. IC Role / Device Role / Timing Role: Bidirectional translator supporting I²C fast-mode+ (1Mbps) with internal pullups replacing external resistors on both sides. Use Value: Eliminates external pullups while maintaining rise-time acceleration - avoids bus slowdown caused by resistor-capacitance interaction at high frequencies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX13056EETI+ | I/O VCC_ pulled down to GND (10kΩ) in shutdown; I/O VL_ remains open-drain | Suitable where VCC-side bus must be actively held low during power-down (e.g., reset signaling) | Select MAX13056EETI+ only if forced GND termination on VCC-side I/O during shutdown is required |
| TXB0108RGER | TI device with auto-direction sensing, 3.6V max VCCA, 5.5V max VCCB, no integrated ESD beyond 2kV HBM | Requires external ESD protection for industrial-grade robustness; lacks automatic VCC/VL shutdown | Choose TXB0108RGER only for cost-sensitive, non-ESD-critical applications where auto-direction is preferred over fixed enable control |
Compared with MAX13055EETI+T, MAX13056EETI+ offers asymmetric shutdown behavior useful for reset assertion, while TXB0108RGER trades integrated ESD and supply-aware shutdown for auto-direction sensing - making MAX13055EETI+T optimal for high-reliability, mixed-rail portable systems requiring guaranteed 100Mbps and ±15kV protection.
Availability
MAX13055EETI+T is available at Aetrix Electronics and suitable for portable communication devices, camera modules, and smart card readers requiring stable component supply across extended temperature (-40°C to +85°C) and long-lifecycle production programs.
Supply support for MAX13055EETI+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-speed interface ICs for demanding industrial, automotive, and portable applications.
The MAX13055E–MAX13058E family was developed specifically for high-speed, low-power, multivoltage system interfacing - targeting space-constrained, battery-powered devices needing robust, pin-efficient level translation without external components.
FAQ
What is the maximum supported data rate for MAX13055EETI+T in push-pull mode?
The MAX13055EETI+T guarantees 100Mbps data transfer in push-pull mode under specified conditions (CI/OVL_ ≤15pF, CI/OVCC_ ≤10pF, RSOURCE < 150Ω). This is validated across the full operating temperature range (-40°C to +85°C) and supply ranges (VL = 1.62V–3.2V, VCC = 2.2V–3.6V). Open-drain operation is limited to 1Mbps due to reliance on internal 40µA pullup current.
Does MAX13055EETI+T require external pullup resistors on its I/O lines?
No, MAX13055EETI+T does not require external pullup resistors. Each I/O line is internally pulled up to its respective supply (VL or VCC) via a 40µA current source, supporting both push-pull and open-drain drivers. External pullups are explicitly discouraged in the datasheet as they interfere with the internal accelerator circuitry and degrade timing performance.
What happens to the I/O pins of MAX13055EETI+T during shutdown mode?
In shutdown mode (EN = low or VCC < VL), the MAX13055EETI+T places both I/O VL_ and I/O VCC_ pins in an open-drain state. This is confirmed in the Ordering Information/Selector Guide for the MAX13055E variant. No internal pullup or pulldown is active on either side, resulting in high-impedance outputs that avoid bus contention.
Can MAX13055EETI+T translate between VL = 1.8V and VCC = 3.3V?
Yes, MAX13055EETI+T fully supports VL = 1.8V and VCC = 3.3V operation. This combination falls within its specified ranges (VL: 1.62V–3.2V; VCC: 2.2V–3.6V) and satisfies the requirement VL ≤ VCC − 0.2V. All electrical characteristics - including propagation delay (≤6.5ns), rise/fall time (2.5ns typ), and ESD ratings - are guaranteed under this condition.
Is the exposed pad (EP) on the MAX13055EETI+T TQFN package required to be connected to ground?
Yes, the exposed pad (EP) on the MAX13055EETI+T TQFN package must be soldered to a solid GND plane. It serves as both a thermal dissipation path (θJA = 35°C/W) and a low-inductance ground return. Maxim specifies EP connection to GND in the Pin Configurations diagram and Package Information - omitting this compromises thermal performance, EMI immunity, and long-term reliability.
MAX13055EETI+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 8
- Voltage - VCCA:
- 1.62 V ~ 3.2 V
- Voltage - VCCB:
- 2.2 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain, Push-Pull
- Data Rate:
- 100Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Power Supply Decoupling
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-WFQFN Exposed Pad
MAX13055EETI+T FAQ
1.How can I place an order for MAX13055EETI+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX13055EETI+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX13055EETI+T reliable?
The price and inventory of MAX13055EETI+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13055EETI+T is usually 5 days.
3.What payment methods are accepted for MAX13055EETI+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13055EETI+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX13055EETI+T?
MAX13055EETI+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX13055EETI+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX13055EETI+T?
For technical support, including MAX13055EETI+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13055EETI+T requirements.
6.How does Aetrix verify that MAX13055EETI+T is sourced from the original manufacturer or authorized distributors?
All MAX13055EETI+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13055EETI+T meets industry standards.
7.What is the process for return or replacement of MAX13055EETI+T?
All MAX13055EETI+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX13055EETI+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX13055EETI+T part is unused and in its original packaging.
Return procedure for MAX13055EETI+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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