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Analog Devices Inc./Maxim Integrated MAX13055EEWG+
- Part No.:
- MAX13055EEWG+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX13055EEWG+.pdf
- Description:
- INTERFACE CIRCUIT
- Quantity:
- Payment:
- Shipping:
Inventory:1,875
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Product details
Overview
MAX13055EEWG+ from Maxim Integrated is an 8-channel bidirectional low-voltage logic-level translator IC designed for high-speed voltage domain bridging between 1.62V–3.2V (VL) and 2.2V–3.6V (VCC) systems. It supports guaranteed 100Mbps data transfer, features internal 40µA I/O pull-ups, and operates across –40°C to +85°C in a 24-bump WLP package. It is used in smart card readers and portable communication devices requiring robust level shifting.
For engineers reviewing the MAX13055EEWG+ datasheet, MAX13055EEWG+ pinout, MAX13055EEWG+ application, or MAX13055EEWG+ equivalent, key selection criteria include bidirectional channel count, shutdown-state I/O behavior (open-drain on both VL_ and VCC_ sides), ESD robustness (±15kV HBM), supply voltage flexibility, and WLP package compatibility with space-constrained PCB layouts.
Technical Context
The MAX13055EEWG+ implements passive FET-based bidirectional translation per channel without direction control pins, enabling seamless signal flow across voltage domains. Its enable (EN) input and automatic VCC<VL shutdown provide dual power management modes, while internal 40µA current sources eliminate external pull-ups for push-pull or open-drain drivers.
During shutdown, both I/O VL_ and I/O VCC_ terminals enter open-drain state-confirmed for MAX13055EEWG+ in the Ordering Information/Selector Guide. This behavior isolates signal paths while maintaining high-impedance termination, critical for system-level power sequencing in portable POS and camera modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | Guaranteed 100Mbps-supports high-speed UART, I²C, and GPIO bridging without timing margin loss. |
| Channel Count | 8 bidirectional channels-enables full parallel interface translation (e.g., 8-bit data bus) without external direction control. |
| VL Range | +1.62V to +3.2V-interoperates with 1.8V ASICs, PLDs, and low-power microcontrollers. |
| VCC Range | +2.2V to +3.6V-compatible with 3.3V system rails and mixed-voltage backplanes. |
| ESD Protection | ±15kV HBM, ±15kV IEC 61000-4-2 air, ±8kV contact-reduces need for external TVS diodes in handheld device interfaces. |
| Shutdown Behavior | I/O VL_ and I/O VCC_ both open-drain-ensures no leakage path during power-down, preserving battery life in portable systems. |
| Operating Temp | –40°C to +85°C-qualified for industrial and consumer-grade portable electronics environments. |
Pinout & Package
MAX13055EEWG+ is housed in a 24-bump wafer-level package (WLP) with 0.4mm pitch, optimized for ultra-compact PCB footprints. Pin assignments follow standard ball-grid layout for WLP devices; functional mapping is defined by bump position rather than traditional leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | High-side supply rail | Power source for VCC-side logic levels (2.2V–3.6V); must be stable before EN assertion. |
| VL | Low-side supply rail | Power source for VL-side logic levels (1.62V–3.2V); enables automatic shutdown if VL > VCC. |
| EN | Enable control input | Active-high digital input; drives device into low-power shutdown when logic-low. |
| I/O VL1–VL8 | Bidirectional low-voltage I/O | Connect to 1.62V–3.2V domain signals; internally pulled up with 40µA current source. |
| I/O VCC1–VCC8 | Bidirectional high-voltage I/O | Connect to 2.2V–3.6V domain signals; same internal pull-up structure as VL-side. |
| GND | Ground reference | Common return path for both supply domains; requires low-inductance connection to minimize noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation without direction pin | Eliminates need for external control logic or timing-critical direction signals in multi-channel interfaces. |
| Internal 40µA pull-up current sources | Supports direct connection to open-drain drivers (e.g., I²C) and push-pull outputs without external resistors. |
| Automatic VCC < VL shutdown | Prevents unintended operation during power sequencing faults-no software or external monitoring required. |
| Open-drain I/O state in shutdown | Maintains isolation between voltage domains during sleep mode, avoiding cross-talk or back-powering risks. |
| Lead-free 24-bump WLP | 0.4mm pitch enables <10mm² footprint-ideal for camera modules and slim mobile accessories where board area is constrained. |
Applications
| Smart Card Readers | Camera Modules |
|---|---|
Use Scenario: Translating command/response signals between a 3.3V host controller and 1.8V smart card interface. IC Role / Device Role / Timing Role: Bidirectional level translator ensuring protocol-compliant voltage alignment for ISO/IEC 7816-3 signaling. Use Value: Enables interoperability without custom level-shifting circuitry, reducing BOM count and layout complexity. | Use Scenario: Bridging parallel image data bus (8-bit) between 1.8V image sensor and 3.3V application processor. IC Role / Device Role / Timing Role: High-speed 8-channel translator preserving signal integrity at 100Mbps for raw pixel streaming. Use Value: Maintains timing margins under tight setup/hold constraints, avoiding frame corruption in HD video capture. |
| Portable POS Systems | GPS Receivers |
Use Scenario: Level-shifting GPIO and serial control lines between 1.8V secure element and 3.3V main MCU in payment terminals. IC Role / Device Role / Timing Role: Isolates low-voltage security IC from higher-voltage peripherals while supporting fast firmware update protocols. Use Value: Prevents latch-up during hot-plug events and ensures reliable transaction handshaking across voltage domains. | Use Scenario: Interfacing 1.8V GPS baseband IC with 3.3V RF front-end and host navigation processor. IC Role / Device Role / Timing Role: Voltage-domain bridge for NMEA 0183 UART and interrupt signaling with sub-10ns propagation delay. Use Value: Guarantees deterministic latency for time-critical PPS (pulse-per-second) synchronization signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0108RJR | 8-channel, auto-direction sensing; 1.2V–3.6V VL/VCC range; 100Mbps typical (not guaranteed) | Requires no EN signal; less robust ESD (±2kV HBM); different shutdown behavior (high-Z, not open-drain) | Select when directionless auto-sensing is preferred and guaranteed 100Mbps is not required. |
| SN74AVC8T245RHLR | 8-channel, direction-controlled; 1.2V–3.6V; 500Mbps guaranteed; active-high DIR pin required | Unidirectional per channel unless externally wired; higher drive strength (24mA); larger 24-pin QFN package | Select when higher speed or stronger drive is needed and direction control logic is available. |
Compared with TXB0108RJR and SN74AVC8T245RHLR, the MAX13055EEWG+ uniquely guarantees 100Mbps performance with open-drain shutdown states on both sides-critical for battery-powered systems requiring strict power isolation and deterministic timing in mixed-voltage interfaces.
Availability
MAX13055EEWG+ is available at Aetrix Electronics and suitable for smart card readers, camera modules, and portable POS systems requiring stable component supply, extended temperature operation, and lead-free packaging compliance.
Supply support for MAX13055EEWG+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-speed interface ICs for industrial, communications, and consumer applications.
The MAX13055E–MAX13058E product line targets multivoltage system integration, delivering robust, high-speed level translation for portable and space-constrained electronics where supply flexibility and ESD resilience are essential.
FAQ
What is the guaranteed maximum data rate supported by the MAX13055EEWG+?
The MAX13055EEWG+ guarantees 100Mbps data transfer across all 8 bidirectional channels under specified supply and load conditions. This performance is validated across the full operating temperature range (–40°C to +85°C) and is not dependent on external pull-up resistors due to its internal 40µA current sources. The MAX13055EEWG+ maintains this rate with minimal jitter and ringing, making it suitable for time-sensitive interfaces like camera sensor buses.
How does the MAX13055EEWG+ behave during shutdown mode?
When the EN pin is driven low or when VCC falls below VL, the MAX13055EEWG+ enters shutdown mode with both I/O VL_ and I/O VCC_ terminals in open-drain state-as explicitly defined in the Ordering Information/Selector Guide for MAX13055EEWG+. This ensures no current flows between voltage domains, preventing back-powering or leakage that could compromise battery life in portable devices using the MAX13055EEWG+.
What package type is used for the MAX13055EEWG+?
The MAX13055EEWG+ uses a 24-bump wafer-level package (WLP) with 0.4mm pitch and lead-free/RoHS-compliant construction. This ultra-compact package measures approximately 2.1mm × 2.1mm and is optimized for high-density layouts in space-constrained applications such as camera modules and slim mobile accessories where the MAX13055EEWG+ is commonly deployed.
Does the MAX13055EEWG+ require external pull-up resistors?
No, the MAX13055EEWG+ integrates 40µA current sources on all I/O VL_ and I/O VCC_ pins, eliminating the need for external pull-up resistors. This design supports direct interfacing with both push-pull and open-drain drivers-including I²C-compatible signals-without additional components. The internal pull-ups ensure proper logic-level definition during idle and transition states, simplifying schematic design for systems using the MAX13055EEWG+.
What ESD protection levels does the MAX13055EEWG+ provide on its I/O lines?
The MAX13055EEWG+ provides ±15kV ESD protection per Human Body Model (HBM) and ±15kV per IEC 61000-4-2 air discharge on its I/O VCC lines. Contact discharge is rated at ±8kV per IEC 61000-4-2. These values are measured and specified in the official datasheet, and they reduce or eliminate the need for external ESD protection components in end equipment using the MAX13055EEWG+.
MAX13055EEWG+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 8
- Voltage - VCCA:
- 1.62 V ~ 3.2 V
- Voltage - VCCB:
- 2.2 V ~ 3.6 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Non-Inverted
- Data Rate:
- 100Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-WFBGA, WLBGA
MAX13055EEWG+ FAQ
1.How can I place an order for MAX13055EEWG+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX13055EEWG+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX13055EEWG+ reliable?
The price and inventory of MAX13055EEWG+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13055EEWG+ is usually 5 days.
3.What payment methods are accepted for MAX13055EEWG+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13055EEWG+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX13055EEWG+?
MAX13055EEWG+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX13055EEWG+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX13055EEWG+?
For technical support, including MAX13055EEWG+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13055EEWG+ requirements.
6.How does Aetrix verify that MAX13055EEWG+ is sourced from the original manufacturer or authorized distributors?
All MAX13055EEWG+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13055EEWG+ meets industry standards.
7.What is the process for return or replacement of MAX13055EEWG+?
All MAX13055EEWG+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX13055EEWG+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX13055EEWG+ part is unused and in its original packaging.
Return procedure for MAX13055EEWG+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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