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Analog Devices Inc./Maxim Integrated MAX13055EEWG+T

Part No.:
MAX13055EEWG+T
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Translators, Level Shifters
Package:
Datasheet:
AetrixMAX13055EEWG+T.pdf
Description:
IC TRANSLTR BIDIRECTIONAL 24WLP
Quantity:
Payment:
Payment
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Shipping

Inventory:2,043

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Product details

Overview

MAX13055EEWG+T from Maxim Integrated is an 8-channel, bidirectional, high-speed logic-level translator IC designed for voltage translation between 1.62V–3.2V (VL) and 2.2V–3.6V (VCC) domains in multivoltage systems. It supports guaranteed 100Mbps data transfer with push-pull drivers, features internal 40µA pullup current sources per I/O, and operates across –40°C to +85°C. It is used in portable communication devices, camera modules, and smart card readers requiring low-power, high-fidelity level shifting.

For engineers reviewing the MAX13055EEWG+T datasheet, MAX13055EEWG+T pinout, MAX13055EEWG+T application, or MAX13055EEWG+T equivalent, key selection considerations include its 24-bump WLP package (0.4mm pitch), open-drain I/O VL_/I/O VCC_ behavior during shutdown, ±15kV HBM ESD rating, and compatibility with 4mA minimum external drivers - all critical for compact, robust, multivoltage interface design.

Technical Context

The MAX13055EEWG+T implements an nMOS pass-gate architecture with dedicated rise/fall time accelerator stages per channel, enabling sub-7ns propagation delay (tPVCC-VL/tPVL-VCC) and <2.5ns rise/fall times under 15pF load. Its dual-supply operation (VL and VCC) allows independent domain control, while automatic shutdown activates when VCC < VL - a safety feature for asymmetric power sequencing.

Each I/O pair is internally pulled up to its respective supply (VL or VCC) via 40µA current sources, eliminating need for external resistors and supporting both push-pull and open-drain drivers. The EN input provides explicit low-power control, and the device maintains defined I/O states (open-drain) during shutdown per ordering variant - confirmed for MAX13055EEWG+T in the Selector Guide.

Key Specifications

Parameter Value and Actual Design Meaning
Channels8 bidirectional I/O pairs - enables full parallel translation of multi-bit buses like I²C auxiliary lines or GPIO banks.
Max Data Rate100Mbps (push-pull) - supports high-speed serial links such as camera sensor control interfaces or fast peripheral handshaking.
Supply Range VL+1.62V to +3.2V - matches low-voltage ASICs, FPGAs, and mobile SoCs (e.g., 1.8V core logic).
Supply Range VCC+2.2V to +3.6V - interfaces directly with 3.3V system buses, PMIC rails, or legacy peripherals.
Propagation Delay1ns to 6.5ns - ensures timing-critical applications (e.g., real-time sensor sync) meet setup/hold margins.
ESD Rating (HBM)±15kV on I/O VCC_ - eliminates need for external TVS diodes in handheld device front-end interfaces.
Shutdown Current0.1µA to 2µA (VCC), 0.1µA to 4µA (VL) - enables battery-sensitive designs like GPS modules to minimize quiescent drain.

Pinout & Package

MAX13055EEWG+T is housed in a lead-free, RoHS-compliant 24-bump Wafer-Level Package (WLP) with 0.4mm pitch. The package has no exposed pad and is optimized for space-constrained portable PCBs.

Pin/Terminal Circuit Role Design Meaning
I/O VL1–I/O VL8VL-referenced bidirectional I/OConnect to low-voltage domain signals (e.g., 1.8V FPGA GPIO); internally pulled up to VL at 40µA.
I/O VCC1–I/O VCC8VCC-referenced bidirectional I/OConnect to higher-voltage domain (e.g., 3.3V microcontroller bus); internally pulled up to VCC at 40µA.
VLLow-voltage supply inputBypass with 0.1µF ceramic capacitor; defines logic thresholds for VL-side I/Os.
VCCHigh-voltage supply inputBypass with 1µF + 0.1µF ceramics; powers VCC-side circuitry and pullups.
ENEnable control inputDrive high for normal operation; drive low to enter low-power shutdown (I/Os become open-drain).
GNDGround referenceCommon return for both VL and VCC supplies; must be low-impedance for noise immunity.
N.C.No connectionPins 1, 12, 13, 14, 24, 25, 26, 27 - electrically unconnected; leave floating or ground per layout best practice.

Key Features

Feature Design Value
8-channel bidirectional translationEliminates need for separate unidirectional translators or complex direction-control logic in multi-signal interfaces.
Internal 40µA pullup current sourcesRemoves external pullup resistors, saving board area and reducing BOM count in dense portable layouts.
Rise/fall time acceleratorReduces edge distortion under capacitive loads (e.g., flex cables or long traces), maintaining signal integrity at 100Mbps.
Automatic VCC < VL shutdownPrevents backfeeding and latch-up during asymmetric power-up sequences common in battery-powered systems.
±15kV HBM ESD protectionMeets IEC 61000-4-2 Level 4 requirements without external protection components - critical for consumer-facing ports.

Applications

Smart Card Readers Camera Modules

Use Scenario: Translating command/response signals between a 1.8V smart card controller and a 3.3V host MCU.

IC Role / Device Role / Timing Role: Bidirectional level translator ensuring protocol-compliant voltage levels on ISO/IEC 7816-3 I/O lines.

Use Value: Guarantees 100Mbps timing margin for APDU exchange while consuming <2µA in standby - extending reader battery life.

Use Scenario: Interfacing a 1.8V image sensor's control bus (e.g., SCCB/I²C) with a 3.3V application processor.

IC Role / Device Role / Timing Role: High-speed, low-skew translator preserving clock/data alignment across voltage domains.

Use Value: Sub-7ns propagation delay prevents frame-sync errors; internal pullups avoid resistor-induced RC delays on sensor control lines.

Portable POS Systems GPS Receivers

Use Scenario: Level-shifting GPIO and status lines between a 1.8V secure element and 3.3V payment processing SoC.

IC Role / Device Role / Timing Role: Secure, ESD-hardened interface translator meeting EMVCo terminal requirements.

Use Value: ±15kV HBM rating protects against user-handling ESD events; open-drain shutdown state prevents bus contention during power cycling.

Use Scenario: Translating NMEA 0183 serial data and PPS timing signals between a 1.8V GNSS baseband IC and 3.3V host MCU.

IC Role / Device Role / Timing Role: Low-jitter, low-latency translator preserving PPS edge accuracy for time-stamping.

Use Value: <2.5ns rise/fall time ensures sub-10ns PPS edge fidelity; 0.1µA shutdown current extends battery runtime in always-on tracking mode.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Alternative Part Technical Difference Application Difference Selection Advice
MAX13056EEWG+I/O VCC_ pulled down to GND (10kΩ) during shutdown; same VL-side open-drain behavior.Suitable where VCC-domain bus must be actively pulled low (e.g., reset signaling) during sleep.Select MAX13056EEWG+ if controlled VCC-side discharge is required; otherwise MAX13055EEWG+T offers symmetric open-drain shutdown.
TXB0108RGERTI part with auto-direction sensing, 3.6V max VCCA, 5.5V max VCCB, no integrated ESD protection beyond 2kV HBM.Requires external ESD protection for handheld use; lacks guaranteed 100Mbps performance at 1.8V/3.3V.Choose TXB0108RGER only for cost-sensitive, non-portable applications with lower ESD risk and relaxed speed requirements.

Compared with MAX13055EEWG+T, MAX13056EEWG+ provides active VCC-side discharge during shutdown - useful for reset coordination - while TXB0108RGER trades guaranteed 100Mbps and ±15kV ESD for auto-direction convenience and wider VCCB range, but requires external protection in portable designs.

Availability

MAX13055EEWG+T is available at Aetrix Electronics and suitable for portable communication devices, camera modules, and smart card readers requiring stable component supply, extended temperature operation, and high-reliability level translation.

Supply support for MAX13055EEWG+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and high-speed interface solutions for industrial, automotive, and portable applications.

The MAX13055E–MAX13058E product line was designed specifically for high-speed, low-power, multivoltage system interfacing - targeting space-constrained, battery-operated devices needing robust, integrated level translation without external components.

FAQ

What is the maximum data rate supported by the MAX13055EEWG+T?

The MAX13055EEWG+T guarantees 100Mbps data transfer when driven by push-pull sources. This is validated under specified conditions: VCC = +3.3V, VL = +1.8V, CI/OVCC_ ≤10pF, CI/OVL_ ≤15pF, and RSOURCE < 150Ω. Open-drain operation reduces maximum rate to 1Mbps due to RC-limited rise time - a design trade-off explicitly documented in the datasheet timing table.

Does the MAX13055EEWG+T require external pullup resistors?

No, the MAX13055EEWG+T does not require external pullup resistors. It integrates 40µA current-source pullups on all I/O VL_ and I/O VCC_ lines, enabling direct interface with both push-pull and open-drain drivers. External pullups are explicitly discouraged in the datasheet because they conflict with the internal accelerator architecture and may degrade timing or cause contention.

What happens to the I/O pins of the MAX13055EEWG+T during shutdown mode?

During shutdown (EN = GND or VCC < VL), the MAX13055EEWG+T places both I/O VL_ and I/O VCC_ pins in open-drain state - confirmed in the Ordering Information/Selector Guide for the MAX13055EEWG+T variant. This ensures high-impedance isolation without unintended DC paths, preserving signal integrity on shared buses during low-power states.

What is the ESD protection rating of the MAX13055EEWG+T?

The MAX13055EEWG+T provides ±15kV ESD protection per Human Body Model (HBM) on all I/O VCC_ pins, and ±15kV IEC 61000-4-2 air-discharge and ±8kV contact-discharge ratings. These values are measured and guaranteed - not typical - and eliminate the need for discrete ESD protection in end-equipment designs targeting IEC 61000-4-2 Level 4 compliance.

Can the MAX13055EEWG+T translate between 1.2V and 3.3V logic domains?

No, the MAX13055EEWG+T cannot translate between 1.2V and 3.3V. Its VL supply range is strictly +1.62V to +3.2V, and VCC range is +2.2V to +3.6V. A 1.2V source falls below the minimum VL specification and would fail to meet input threshold requirements (VIHL = VL – 0.2V), risking unreliable logic detection. For 1.2V interfaces, alternate translators like MAX3378E must be considered.

MAX13055EEWG+T Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Translator Type:
Voltage Level
Channel Type:
Bidirectional
Number of Circuits:
1
Channels per Circuit:
8
Voltage - VCCA:
1.62 V ~ 3.2 V
Voltage - VCCB:
2.2 V ~ 3.6 V
Input Signal:
-
Output Signal:
-
Output Type:
Open Drain, Push-Pull
Data Rate:
100Mbps
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Features:
Power Supply Decoupling
Mounting Type:
Surface Mount
Supplier Device Package:
24-WFBGA, WLBGA

MAX13055EEWG+T FAQ

1.How can I place an order for MAX13055EEWG+T through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX13055EEWG+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX13055EEWG+T reliable?

The price and inventory of MAX13055EEWG+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13055EEWG+T is usually 5 days.

3.What payment methods are accepted for MAX13055EEWG+T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13055EEWG+T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX13055EEWG+T?

MAX13055EEWG+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX13055EEWG+T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX13055EEWG+T?

For technical support, including MAX13055EEWG+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13055EEWG+T requirements.

6.How does Aetrix verify that MAX13055EEWG+T is sourced from the original manufacturer or authorized distributors?

All MAX13055EEWG+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13055EEWG+T meets industry standards.

7.What is the process for return or replacement of MAX13055EEWG+T?

All MAX13055EEWG+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX13055EEWG+T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX13055EEWG+T part is unused and in its original packaging.

Return procedure for MAX13055EEWG+T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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