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Home > Products > Integrated Circuits (ICs) > Logic > Translators, Level Shifters

Analog Devices Inc./Maxim Integrated MAX13058EETI+

Name: MAX13058EETI+
Brand: Analog Devices Inc./Maxim Integrated
SKU: MAX13058EETI+
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MAX13058EETI+

Manufacturer:: Analog Devices Inc./Maxim Integrated

Category:: Translators, Level Shifters

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Datasheet:: MAX13058EETI+.pdf

Description:: IC TRANSLTR BIDIRECTIONAL 28TQFN

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Inventory:4,137

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Product details

Overview

MAX13058EETI+ from Maxim Integrated is an 8-channel, bidirectional, high-speed logic-level translator IC designed for voltage translation between 1.62V–3.2V (VL) and 2.2V–3.6V (VCC) domains in multivoltage systems. It supports guaranteed 100Mbps data transfer with push-pull drivers, features internal 40µA pullup current sources per I/O, and operates across –40°C to +85°C. It is used in portable communication devices, smart card readers, and camera modules requiring low-power, high-fidelity level shifting.

For engineers reviewing the MAX13058EETI+ datasheet, MAX13058EETI+ pinout, MAX13058EETI+ application, or MAX13058EETI+ equivalent, key selection criteria include its dual-supply operation (VL/VCC), shutdown control via EN input, automatic VCC < VL shutdown behavior, and compatibility with both open-drain and push-pull drivers without external pullups.

Technical Context

The MAX13058EETI+ implements an nMOS pass-gate architecture with dedicated rise/fall time accelerator stages per channel-generating short pulses during signal transitions to actively charge/discharge load capacitance and reduce propagation delay. Its bidirectional operation requires no direction control pin and relies on internal biasing and dynamic edge detection.

It supports two distinct shutdown modes: manual (EN = GND) and automatic (VCC < VL), with defined I/O states during shutdown-specifically, both I/O VL_ and I/O VCC_ are pulled down to GND via 10kΩ internal resistors in the MAX13058E variant. This ensures deterministic bus states in low-power system sleep sequences.

Key Specifications

Parameter	Value and Actual Design Meaning
Channels	8 bidirectional I/O channels-enables simultaneous translation of parallel buses like I²C auxiliary lines or GPIO banks.
Data Rate	100Mbps (push-pull mode)-supports high-speed interfaces such as SDIO, UART, or custom serial links in portable electronics.
Supply Range (VL)	+1.62V to +3.2V-compatible with 1.8V/2.5V/3.3V low-voltage ASICs, FPGAs, and microcontrollers.
Supply Range (VCC)	+2.2V to +3.6V-interoperable with 2.5V/3.3V system rails while maintaining safe margin vs. VL.
Propagation Delay	1ns to 6.5ns-ensures timing-critical signal integrity in sub-10ns clock domains and high-frequency data sampling.
ESD Protection	±15kV HBM, ±15kV IEC 61000-4-2 air, ±8kV contact-eliminates need for external TVS diodes on I/O VCC_ pins in handheld designs.
Shutdown Current	≤2µA (VCC), ≤4µA (VL)-enables battery-powered systems to achieve µA-level sleep current per interface bridge.

Pinout & Package

MAX13058EETI+ is housed in a lead-free, RoHS-compliant 28-pin TQFN-EP package (3.5mm × 5.5mm, 0.5mm pitch) with exposed thermal pad connected to GND. The package supports high-density PCB layouts and efficient heat dissipation in compact portable applications.

Pin	Circuit Role	Design Meaning
1, 12, 13, 14, 24, 25, 26, 27	N.C.	No internal connection-must be left floating or tied to GND per layout best practice; no routing required.
2–10	I/O VL1–VL8	Bidirectional I/O referenced to VL supply-connects to low-voltage side (e.g., 1.8V SoC GPIO); driven by push-pull or open-drain sources.
11	EN	Active-high enable-driving low places device in shutdown; rising edge enables translation with 5µs max enable-to-output delay.
15–23	I/O VCC1–VCC8	Bidirectional I/O referenced to VCC supply-connects to higher-voltage domain (e.g., 3.3V peripheral bus); mirrors VL-side signals with level shift.
19, 28	VCC / VL	Separate power inputs-VCC powers high-side circuitry and pullups; VL powers low-side circuitry and pullups; must satisfy VL ≤ VCC − 0.2V for normal operation.
6, 20, 22	GND	Ground reference for analog core and digital I/O-requires low-inductance connection to system ground plane; EP must be soldered to GND for thermal and EMI performance.

Key Features

Feature	Design Value
Internal 40µA pullup current sources	Eliminates need for external pullup resistors on I/O lines-reduces BOM count, board area, and risk of signal degradation due to resistor parasitics.
Rise/fall time accelerator circuitry	Reduces transition times to ≤2.5ns (typ.) under 10pF/15pF loads-enables reliable 100Mbps operation without slew-rate limiting or external active termination.
Dual shutdown modes (EN + auto-VCC)	Ensures fail-safe I/O state (10kΩ-to-GND on both sides) during brownout or sequenced power-down-prevents bus contention in multi-rail systems.
CMOS-compatible I/O loading	Designed to drive standard CMOS inputs only-prohibits resistive loads <25kΩ or RC filtering, preserving signal fidelity and timing margins.
Extended ESD protection on I/O VCC_	Meets IEC 61000-4-2 Level 4 (±8kV contact) without external protection-reduces design validation effort for handheld and field-deployed equipment.

Applications

Smart Card Readers	Camera Modules
Use Scenario: Interface between 1.8V smart card controller and 3.3V host processor in payment terminals or secure ID readers. IC Role / Device Role / Timing Role: Bidirectional level translator for ISO/IEC 7816-3 compliant serial protocol with strict setup/hold timing. Use Value: Guarantees 100Mbps-capable signal integrity across voltage domains while maintaining <6.5ns propagation delay-critical for T=0 protocol timing compliance.	Use Scenario: Bridging MIPI CSI-2 auxiliary control lines (e.g., I²C-based sensor configuration) between 1.8V image sensor and 3.3V application processor. IC Role / Device Role / Timing Role: Low-latency, low-power voltage translator for camera initialization and register access without interrupting main video stream. Use Value: Internal 40µA pullups eliminate external resistors on space-constrained flex PCBs-reducing component count and improving reliability in mobile camera assemblies.
Portable POS Systems	GPS Receivers
Use Scenario: Translating GPIO and status signals between 1.8V secure element and 3.3V main MCU in handheld point-of-sale terminals. IC Role / Device Role / Timing Role: Fail-safe level shifter with automatic VCC < VL shutdown-ensures secure element isolation during battery-swapping or low-battery conditions. Use Value: 10kΩ-to-GND shutdown state on both I/O VL_ and I/O VCC_ prevents floating bus lines and eliminates need for external pulldowns-simplifying firmware-driven power sequencing.	Use Scenario: Level-shifting NMEA 0183 or proprietary debug interface signals between 1.8V GPS baseband IC and 3.3V host navigation module. IC Role / Device Role / Timing Role: High-ESD-tolerance translator for outdoor-exposed serial interfaces subject to handling discharge events. Use Value: ±15kV HBM and ±8kV IEC contact ESD rating allows direct PCB routing without guard rings or shielding-reducing bill-of-materials and assembly cost in compact GPS modules.

Smart Card Readers

Camera Modules

Use Scenario: Interface between 1.8V smart card controller and 3.3V host processor in payment terminals or secure ID readers.

IC Role / Device Role / Timing Role: Bidirectional level translator for ISO/IEC 7816-3 compliant serial protocol with strict setup/hold timing.

Use Value: Guarantees 100Mbps-capable signal integrity across voltage domains while maintaining <6.5ns propagation delay-critical for T=0 protocol timing compliance.

Use Scenario: Bridging MIPI CSI-2 auxiliary control lines (e.g., I²C-based sensor configuration) between 1.8V image sensor and 3.3V application processor.

IC Role / Device Role / Timing Role: Low-latency, low-power voltage translator for camera initialization and register access without interrupting main video stream.

Use Value: Internal 40µA pullups eliminate external resistors on space-constrained flex PCBs-reducing component count and improving reliability in mobile camera assemblies.

Portable POS Systems

GPS Receivers

Use Scenario: Translating GPIO and status signals between 1.8V secure element and 3.3V main MCU in handheld point-of-sale terminals.

IC Role / Device Role / Timing Role: Fail-safe level shifter with automatic VCC < VL shutdown-ensures secure element isolation during battery-swapping or low-battery conditions.

Use Value: 10kΩ-to-GND shutdown state on both I/O VL_ and I/O VCC_ prevents floating bus lines and eliminates need for external pulldowns-simplifying firmware-driven power sequencing.

Use Scenario: Level-shifting NMEA 0183 or proprietary debug interface signals between 1.8V GPS baseband IC and 3.3V host navigation module.

IC Role / Device Role / Timing Role: High-ESD-tolerance translator for outdoor-exposed serial interfaces subject to handling discharge events.

Use Value: ±15kV HBM and ±8kV IEC contact ESD rating allows direct PCB routing without guard rings or shielding-reducing bill-of-materials and assembly cost in compact GPS modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MAX13055EETI+	Same 28-pin TQFN package and electrical specs, but I/O VL_/VCC_ float (open-drain) in shutdown mode instead of 10kΩ-to-GND.	Suitable where bus must remain high-impedance during shutdown-e.g., shared I²C buses with multiple masters.	Select MAX13055EETI+ when deterministic pull-down is not required and system-level pullups already exist.
MAX13057EETI+	Identical package and speed, but only I/O VL_ is pulled down (10kΩ to GND); I/O VCC_ floats in shutdown.	Applicable in asymmetric power-down scenarios-e.g., VL remains active while VCC is cycled for peripheral reset.	Choose MAX13057EETI+ when only low-side bus state control is needed and high-side retention is unnecessary.

Compared with MAX13055EETI+ and MAX13057EETI+, the MAX13058EETI+ uniquely provides matched 10kΩ-to-GND termination on both sides during shutdown-delivering strongest bus determinism for safety-critical or tightly sequenced power architectures.

Availability

MAX13058EETI+ is available at Aetrix Electronics and suitable for portable communication devices, smart card readers, and camera modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MAX13058EETI+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.

The MAX13055E–MAX13058E family was designed specifically for high-speed, low-power, multichannel bidirectional level translation in battery-operated portable electronics-addressing the need for robust, integrated solutions that replace discrete resistor-based translators and external ESD protection.

FAQ

What is the maximum data rate supported by the MAX13058EETI+ in push-pull mode?

The MAX13058EETI+ guarantees 100Mbps data transfer in push-pull driver configurations, validated under specified load conditions (CI/OVCC_ ≤10pF, CI/OVL_ ≤15pF, RSOURCE < 150Ω). Performance scales with reduced capacitive loading and higher supply voltages-e.g., tRVCC/tFVCC drop to 2.5ns (typ.) at VCC = 3.3V. Open-drain operation is limited to 1Mbps due to reliance on internal 40µA pullup current.

Does the MAX13058EETI+ require external pullup resistors on its I/O lines?

No, the MAX13058EETI+ does not require external pullup resistors. It integrates 40µA current-source pullups on all I/O VL_ and I/O VCC_ lines, enabling direct interfacing with open-drain or push-pull drivers. External pullups are explicitly discouraged in the datasheet, as they conflict with the internal accelerator circuitry and may degrade rise/fall time performance or cause contention.

How does the MAX13058EETI+ behave during power-down or brownout conditions?

During shutdown-whether triggered manually (EN = GND) or automatically (VCC < VL)-the MAX13058EETI+ pulls both I/O VL_ and I/O VCC_ to GND via internal 10kΩ resistors. This ensures a known, low-impedance bus state that prevents floating nodes, reduces EMI, and avoids unintended activation of downstream peripherals during partial power loss.

Can the MAX13058EETI+ translate between 1.8V and 3.3V logic levels reliably?

Yes-the MAX13058EETI+ is expressly characterized for VL = 1.8V and VCC = 3.3V operation. Input thresholds (VIHL = VL − 0.2V, VIHC = VCC − 0.4V) and output drive strengths (VOHL = 4/5 VL, VOHC = 4/5 VCC) ensure full logic swing compatibility. Propagation delay remains within 1–6.5ns, and ESD robustness (±8kV contact on I/O VCC_) is maintained across this voltage pair.

What is the thermal performance of the MAX13058EETI+ in its 28-pin TQFN package?

The MAX13058EETI+ in the 28-pin TQFN-EP package has a junction-to-ambient thermal resistance (θJA) of 35°C/W and junction-to-case (θJC) of 2.7°C/W when mounted on a standard four-layer JEDEC test board. With the exposed pad soldered to a solid GND plane, it sustains continuous operation up to +85°C ambient at full 100Mbps load-verified by thermal characterization in the datasheet's Typical Operating Characteristics section.

MAX13058EETI+ Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc./Maxim Integrated

Series:: -

Package/Case:

Packaging:: Tube

Product Status:: Active

Translator Type:: Voltage Level

Channel Type:: Bidirectional

Number of Circuits:: 1

Channels per Circuit:: 8

Voltage - VCCA:: 1.62 V ~ 3.2 V

Voltage - VCCB:: 2.2 V ~ 3.6 V

Input Signal:: -

Output Signal:: -

Output Type:: Open Drain, Push-Pull

Data Rate:: 100Mbps

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Features:: Power Supply Decoupling

Mounting Type:: Surface Mount

Supplier Device Package:: 28-WFQFN Exposed Pad

MAX13058EETI+ FAQ

1.How can I place an order for MAX13058EETI+ through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX13058EETI+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX13058EETI+ reliable?

The price and inventory of MAX13058EETI+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13058EETI+ is usually 5 days.

3.What payment methods are accepted for MAX13058EETI+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13058EETI+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX13058EETI+?

MAX13058EETI+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX13058EETI+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX13058EETI+?

For technical support, including MAX13058EETI+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13058EETI+ requirements.

6.How does Aetrix verify that MAX13058EETI+ is sourced from the original manufacturer or authorized distributors?

All MAX13058EETI+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13058EETI+ meets industry standards.

7.What is the process for return or replacement of MAX13058EETI+?

All MAX13058EETI+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX13058EETI+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX13058EETI+ part is unused and in its original packaging.

Return procedure for MAX13058EETI+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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