Analog Devices Inc./Maxim Integrated MAX13058EEWG+T

Overview

MAX13058EEWG+T from Maxim Integrated is an 8-channel, bidirectional, high-speed logic-level translator IC designed for voltage-domain bridging between low-voltage (1.62V–3.2V) and higher-voltage (2.2V–3.6V) digital interfaces. It supports guaranteed 100Mbps data transfer with 2.5ns typical rise/fall times, internal 40µA pull-up current sources, and automatic shutdown when VCC < VL. It is used in portable communication devices, camera modules, and smart card readers requiring robust multivoltage I/O translation.

For engineers reviewing the MAX13058EEWG+T datasheet, MAX13058EEWG+T pinout, MAX13058EEWG+T application, or MAX13058EEWG+T equivalent, key selection criteria include its 8-channel bidirectional operation, 100Mbps push-pull performance, shutdown behavior under VCC/VL mismatch, ESD robustness (±15kV HBM), and WLP-24 package compatibility with space-constrained portable designs.

Technical Context

The MAX13058EEWG+T implements an nMOS pass-gate architecture with dedicated rise/fall time accelerator stages per channel, enabling fast edge transitions without external pull-ups. Its dual-supply operation (VL and VCC) allows independent logic-level definition on each side, with input thresholds scaled to VL and VCC (e.g., VIHL = VL – 0.2V, VIHC = VCC – 0.4V).

It features active-low enable (EN) control and automatic shutdown when VCC falls below VL, with defined I/O states during shutdown: both I/O VL_ and I/O VCC_ are pulled to GND via 10kΩ internal resistors - a distinguishing trait of the MAX13058E variant confirmed in the Ordering Information/Selector Guide.

Key Specifications

Pinout & Package

MAX13058EEWG+T is housed in a lead-free, RoHS-compliant 24-bump Wafer-Level Package (WLP) with 0.4mm pitch and footprint of 2.1mm × 2.1mm. The exposed silicon die top-side connects to PCB pads; bump layout follows standard W241B2-1 land pattern per Maxim document 21-0219.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-channel bidirectional level translation applications.

Compared with MAX13056EEWG+ and TXS0108EJRGR, MAX13058EEWG+T uniquely guarantees matched 10kΩ-to-GND termination on both sides during shutdown, delivers best-in-class ±15kV HBM/IEC ESD robustness without external components, and achieves lowest shutdown current (0.1µA) for battery-critical applications.

Availability

MAX13058EEWG+T is available at Aetrix Electronics and suitable for portable communication devices, camera modules, and smart card readers requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MAX13058EEWG+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and high-speed interface solutions for industrial, communications, and consumer applications.

The MAX13055E–MAX13058E family was designed specifically for high-speed, low-power, multivoltage system interfacing - targeting space-constrained portable electronics where reliability, ESD immunity, and deterministic power sequencing are critical.

FAQ

What is the guaranteed maximum data rate for MAX13058EEWG+T in push-pull mode?

The MAX13058EEWG+T guarantees 100Mbps data transfer in push-pull driver configurations, validated across the full operating temperature range (−40°C to +85°C) and supply ranges (VL = 1.62V–3.2V, VCC = 2.2V–3.6V). This performance assumes load capacitance ≤15pF on VL-side and ≤10pF on VCC-side I/Os, with source impedance <150Ω. Open-drain operation is limited to 1Mbps.

How does MAX13058EEWG+T behave during power-down when VCC is removed before VL?

When VCC drops below VL, the MAX13058EEWG+T automatically enters shutdown mode regardless of EN state. In this condition, both I/O VL_ and I/O VCC_ terminals are actively pulled to GND via internal 10kΩ resistors - a defined, low-impedance state confirmed for the MAX13058E variant in the Selector Guide. This prevents floating nodes and ensures predictable system behavior during asymmetric power sequencing.

Does MAX13058EEWG+T require external pull-up resistors on its I/O lines?

No. The MAX13058EEWG+T integrates 40µA current-source pull-ups on all I/O VL_ and I/O VCC_ lines, eliminating the need for external pull-up resistors. Using external resistors is explicitly discouraged in the datasheet, as they interfere with the internal rise/fall time accelerator circuitry and degrade timing performance. The internal pull-ups support both push-pull and open-drain drivers.

What is the ESD protection rating for MAX13058EEWG+T on the I/O VCC pins?

The MAX13058EEWG+T provides ±15kV ESD protection on all I/O VCC pins per Human Body Model (HBM) and ±15kV per IEC 61000-4-2 air-gap discharge. For contact discharge (IEC 61000-4-2), it delivers ±8kV robustness - sufficient to meet Level 4 compliance without external protection components in handheld and portable end equipment.

Can MAX13058EEWG+T be used with 1.2V logic on the VL side?

No. The MAX13058EEWG+T specifies a minimum VL supply of +1.62V. Operation below this voltage is outside the guaranteed specifications and may result in incorrect logic thresholds, increased propagation delay, or failure to meet the 100Mbps data rate. For 1.2V interfaces, consider alternative translators such as the MAX3378E or MAX3396E, which support lower VL ranges.