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Analog Devices Inc./Maxim Integrated MAX13101EEBX

Part No.:
MAX13101EEBX
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Translators, Level Shifters
Package:
Datasheet:
AetrixMAX13101EEBX.pdf
Description:
IC TRANSLTR BIDIRECTIONAL 36UCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:881

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Product details

Overview

MAX13101EEBX from Maxim Integrated is a 16-channel bidirectional CMOS logic-level translator enabling voltage translation between VL (1.2V to VCC) and VCC (1.65V to 5.5V) domains without direction control. It supports up to 20Mbps data rate, features ±15kV HBM ESD protection on I/O VCC pins, and provides tri-state or 6kΩ pulldown output states during shutdown. It is used in portable electronics for interfacing low-voltage ASICs/PLDs with higher-voltage system buses.

For engineers reviewing the MAX13101EEBX datasheet, MAX13101EEBX pinout, MAX13101EEBX application, or MAX13101EEBX equivalent, key selection criteria include guaranteed 20Mbps throughput, dual-supply independent operation, shutdown current <1µA (VCC) / <2µA (VL), 36-bump UCSP package (3.06mm × 3.06mm), and I/O VCC-side ESD robustness in handheld device interconnects.

Technical Context

The MAX13101EEBX implements a bidirectional one-shot accelerator architecture that activates only during signal transitions-reducing static power while accelerating edge rates. Its input thresholds are ratiometric (VIHL/VILL = 2/3×VL & 1/3×VL; VIHC/VILC = 2/3×VCC & 1/3×VCC), ensuring compatibility across supply combinations.

It uses an EN input to enter shutdown mode, where MAX13101E-specific behavior pulls I/O VCC lines to GND via internal 6kΩ resistors while placing I/O VL lines in high-impedance state-enabling safe isolation in battery-powered systems during sleep.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range+1.65V to +5.5V - supports interface between 1.8V/2.5V/3.3V/5V system domains
VL Range+1.2V to VCC - enables translation from ultra-low-voltage logic (e.g., 1.2V FPGA I/O) upward
Max Data Rate20Mbps - verified at CI/OVCC = 50pF, CI/OVL = 15pF, tRISE ≤ 3ns
ESD Protection±15kV HBM on I/O VCC pins - eliminates need for external TVS in exposed signal paths
Shutdown Current<1µA (VCC), <2µA (VL) - extends battery life in always-on portable subsystems
Propagation Delay20ns (max) - ensures timing closure in high-speed digital interfaces like SDIO or UART bridging
Channel Count16 bidirectional channels - replaces multiple discrete translators in multi-signal bus applications

Pinout & Package

The MAX13101EEBX is housed in a 36-bump UCSP™ package (3.06mm × 3.06mm, 0.5mm pitch), with exposed paddle connected to GND for thermal and EMI performance.

Pin/TerminalCircuit RoleDesign Meaning
GND (Pins D6, A1, F1)Ground referenceThree dedicated ground bumps ensure low-impedance return path for both supply domains and I/O switching currents
VL (Pins A1, C6)Low-voltage logic supplyAccepts 1.2V–VCC; must be bypassed with 0.1µF capacitor; defines I/O VL threshold levels
VCC (Pins F1, C6)High-voltage logic supplyAccepts 1.65V–5.5V; requires 0.1µF + 1.0µF ceramic bypass for full ESD immunity
EN (Pin C6)Global enable inputPull low to activate shutdown; drives I/O VCC to GND (6kΩ) and I/O VL to Hi-Z
I/O VL1–I/O VL16VL-referenced bidirectional I/O16 channels referenced to VL; tolerate -0.3V to (VL + 0.3V); support 20µA drive strength
I/O VCC1–I/O VCC16VCC-referenced bidirectional I/O16 channels referenced to VCC; tolerate -0.3V to (VCC + 0.3V); ±15kV HBM protected

Key Features

FeatureDesign Value
Bidirectional auto-sensing translationEliminates direction-control logic and PCB routing complexity in full-duplex interfaces
Ratiometric input thresholdsMaintains noise margin across all VL/VCC combinations without recalibration
One-shot accelerator stageReduces rise/fall times to ≤15ns (typ) without increasing quiescent current
Configurable shutdown I/O statesMAX13101E-specific 6kΩ pulldown on VCC side prevents floating bus contention during sleep
UCSP package with exposed paddleEnables compact layout in space-constrained portable designs while improving thermal dissipation

Applications

Smartphone Baseband-to-Application Processor InterfaceDigital Still Camera Sensor Hub Bridging

Use Scenario: Interfacing 1.2V MIPI D-PHY transmitter in baseband SoC with 1.8V application processor GPIOs.

IC Role / Device Role / Timing Role: Bidirectional level shifter translating control/status signals and clock-strobed data between mismatched voltage domains.

Use Value: Enables direct connection without external direction logic or pull-up networks, reducing BOM count and board area by >40% vs discrete solutions.

Use Scenario: Connecting 1.8V image sensor outputs to 3.3V host microcontroller ADC inputs in compact camera modules.

IC Role / Device Role / Timing Role: 16-channel translator handling parallel data bus, sync signals, and I²C configuration lines simultaneously.

Use Value: Guarantees 20Mbps throughput with sub-20ns propagation delay, preserving pixel timing integrity and eliminating frame skew.

Portable Medical Monitor Low-Power Sleep ModeIndustrial Handheld Terminal Display Interface

Use Scenario: Isolating 1.2V MCU peripherals during deep-sleep mode while maintaining safe I/O states on 3.3V display controller side.

IC Role / Device Role / Timing Role: Translator entering shutdown on EN low, pulling VCC-side I/Os to GND (6kΩ) and tri-stating VL-side I/Os.

Use Value: Prevents leakage-induced false wakeups and bus contention, extending battery runtime by >30% in standby.

Use Scenario: Bridging 1.8V FPGA video controller to 5V TFT-LCD RGB interface with ESD-prone external cabling.

IC Role / Device Role / Timing Role: Level shifter providing ±15kV HBM protection on all 16 VCC-side I/Os routed to connector pins.

Use Value: Eliminates need for discrete TVS diodes per line, reducing component count and assembly cost in ruggedized field devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar logic-level translation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TXB0108RSLR8-channel, auto-direction sensing, 3.6V max VCC, no integrated pulldown in shutdownLimited to lower channel count and narrower VCC range; lacks 6kΩ shutdown pulldown on VCC I/OsSelect when 8-channel capacity suffices and ESD requirements are less stringent
SN74AVCH16T245DGGR16-channel, direction-controlled, 3.6V max VCC, higher typical ICC (20µA)Requires external direction signal; incompatible with bidirectional protocols like I²C without arbitration logicChoose only if system already implements direction control and operates below 3.6V

Compared with TXB0108RSLR and SN74AVCH16T245DGGR, the MAX13101EEBX uniquely delivers 16-channel bidirectional translation with integrated 6kΩ VCC-side pulldown and ±15kV HBM protection-making it optimal for compact, ESD-sensitive, direction-agnostic portable interfaces.

Availability

MAX13101EEBX is available at Aetrix Electronics and suitable for smartphone baseband interfacing, digital camera sensor hub bridging, portable medical monitor sleep-mode isolation, industrial handheld display interfaces, and battery-powered IoT node voltage domain translation requiring stable component supply and long-term lifecycle support.

Supply support for MAX13101EEBX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, automotive, and portable applications.

The MAX13101E series belongs to Maxim's high-speed logic-level translation product line, engineered specifically for ultra-low-power, ESD-hardened, bidirectional interfacing in space-constrained portable electronics.

FAQ

What is the maximum capacitive load the MAX13101EEBX can drive while maintaining 20Mbps operation?

The MAX13101EEBX maintains 20Mbps data rate with CI/OVCC ≤ 50pF and CI/OVL ≤ 15pF under specified test conditions (RS = 50Ω, tRISE ≤ 3ns). Rise/fall times increase linearly with load capacitance-e.g., tRVL rises from 15ns (15pF) to ~6ns (50pF). For reliable 20Mbps operation, keep total trace + pin + receiver capacitance within these limits.

Does the MAX13101EEBX require external direction-control signals?

No. The MAX13101EEBX uses an inherent bidirectional architecture with no direction pin required. Signal flow is automatically detected and translated in either direction (VL ↔ VCC) on each of its 16 channels, simplifying PCB layout and firmware design for protocols like I²C or UART.

How does the MAX13101EEBX behave during power-up when VL ramps before VCC?

The MAX13101EEBX tolerates VL > VCC during power-up without damage (per Absolute Maximum Ratings). However, for functional correctness, VL must not exceed VCC + 0.3V in steady state. When VL powers first, the device remains non-operational until VCC is applied; no latch-up occurs, and leakage stays below 10µA per I/O.

What is the purpose of the 1.0µF capacitor required on the VCC supply?

The 1.0µF ceramic capacitor on VCC (in addition to the mandatory 0.1µF) is required to achieve full ±15kV Human Body Model ESD protection on I/O VCC pins. It provides low-impedance charge reservoir during fast ESD transients, preventing voltage overshoot beyond the clamp threshold of internal protection structures.

Can the MAX13101EEBX translate between 1.2V and 5.5V logic domains?

Yes. The MAX13101EEBX supports VL as low as +1.2V and VCC as high as +5.5V, enabling direct translation between ultra-low-voltage logic (e.g., advanced-node ASICs) and legacy 5V systems. Ratiometric input thresholds (VIHC = 2/3×VCC, VIHL = 2/3×VL) ensure robust noise margins across this full range.

MAX13101EEBX Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
Packaging:
Bulk
Product Status:
Active
Translator Type:
Voltage Level
Channel Type:
Bidirectional
Number of Circuits:
1
Channels per Circuit:
16
Voltage - VCCA:
1.2 V ~ 5.5 V
Voltage - VCCB:
1.65 V ~ 5.5 V
Input Signal:
-
Output Signal:
-
Output Type:
Tri-State, Non-Inverted
Data Rate:
20Mbps
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
36-WFBGA, CSPBGA

MAX13101EEBX FAQ

1.How can I place an order for MAX13101EEBX through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX13101EEBX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX13101EEBX reliable?

The price and inventory of MAX13101EEBX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13101EEBX is usually 5 days.

3.What payment methods are accepted for MAX13101EEBX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13101EEBX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX13101EEBX?

MAX13101EEBX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX13101EEBX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX13101EEBX?

For technical support, including MAX13101EEBX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13101EEBX requirements.

6.How does Aetrix verify that MAX13101EEBX is sourced from the original manufacturer or authorized distributors?

All MAX13101EEBX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13101EEBX meets industry standards.

7.What is the process for return or replacement of MAX13101EEBX?

All MAX13101EEBX units undergo pre-shipment inspection (PSI). If there is an issue with MAX13101EEBX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX13101EEBX part is unused and in its original packaging.

Return procedure for MAX13101EEBX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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