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Analog Devices Inc./Maxim Integrated MAX13101EEBX-T
- Part No.:
- MAX13101EEBX-T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX13101EEBX-T.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 36UCSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,500
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Product details
Overview
The MAX13101EEBX-T from Maxim Integrated is a 16-channel bidirectional CMOS logic-level translator enabling voltage translation between VL = +1.2V to VCC and VCC = +1.65V to +5.5V domains, with ±15kV HBM ESD protection on I/O VCC lines, 20Mbps data rate, and shutdown supply current <1µA (VCC) / <2µA (VL). It serves in portable electronics interfacing low-voltage ASICs/PLDs with higher-voltage peripherals.
For engineers reviewing the MAX13101EEBX-T datasheet, MAX13101EEBX-T pinout, MAX13101EEBX-T application, or MAX13101EEBX-T equivalent, key selection criteria include its enable-controlled shutdown behavior (I/O VCC pulled to GND via 6kΩ, I/O VL tri-stated), UCSP-36 package (3.06mm × 3.06mm), guaranteed 20Mbps throughput under 50pF load, and dual-supply level-shifting without direction control.
Technical Context
This device implements a bidirectional one-shot accelerator architecture that activates only during signal transitions to reduce propagation delay and improve edge speed-achieving tR/tF ≤15ns (I/O VCC, 50pF) and tP ≤20ns. Its internal threshold detection (VIHL = 2/3×VL, VIHC = 2/3×VCC) ensures reliable switching across the full VL/VCC operating ranges.
No external direction control is required due to inherent bidirectionality. The EN input enables low-power shutdown with defined I/O states: MAX13101E pulls I/O VCC to GND (6kΩ) while placing I/O VL in high-impedance, distinguishing it from MAX13102E (I/O VL pulldown) and MAX13103E (full tri-state).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | +1.65V to +5.5V - supports interface between 1.8V/2.5V/3.3V/5V systems and low-VL logic. |
| VL Range | +1.2V to VCC - enables translation from ultra-low-voltage cores (e.g., 1.2V FPGA I/O) upward. |
| Max Data Rate | 20Mbps - guaranteed with RSOURCE = 50Ω and CI/OVCC_ = 50pF / CI/OVL_ = 15pF. |
| ESD Protection | ±15kV HBM on I/O VCC pins - eliminates need for external TVS in handheld device I/O routing. |
| Shutdown IQ | <1µA (VCC), <2µA (VL) at TA = +25°C - enables battery-sensitive always-on subsystems. |
| Propagation Delay | tPVL-VCC / tPVCC-VL ≤20ns - ensures timing-critical interfaces (e.g., SPI, I²C variants) meet setup/hold margins. |
| Channel-to-Channel Skew | ≤5ns - maintains signal integrity across parallel bus translation (e.g., 16-bit memory/data buses). |
Pinout & Package
Package: 36-bump UCSP (3.06mm × 3.06mm, 0.5mm pitch), exposed paddle (EP) connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pins 1, 21, 30) | Ground reference | Common return path for both VL and VCC supplies; EP must be soldered to PCB ground plane. |
| VL (Pins 15, 36) | Low-voltage logic supply | Defines input/output thresholds for VL-side I/Os; requires 0.1µF bypass to GND. |
| VCC (Pins 16, 35) | High-voltage logic supply | Sets VCC-side thresholds; requires 0.1µF + 1.0µF ceramic bypass for ESD robustness. |
| EN (Pin 10) | Global enable control | Pull low to enter shutdown: disables translation and configures I/O VCC as 6kΩ pulldown, I/O VL as high-Z. |
| I/O VL1–I/O VL16 (Pins 2–9, 11–14, 37–40) | Bidirectional VL-referenced data lines | Accept 1.2V–VCC logic; internally terminated only during shutdown per MAX13101E configuration. |
| I/O VCC1–I/O VCC16 (Pins 17–20, 22–34) | Bidirectional VCC-referenced data lines | Translate to/from VL domain; ±15kV HBM protected; pulldown to GND via 6kΩ when EN = low. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional auto-sensing translation | Eliminates direction-control pin and associated PCB routing, reducing layout complexity in space-constrained portable designs. |
| Enable-controlled shutdown with defined I/O states | MAX13101E-specific behavior (I/O VCC → GND via 6kΩ, I/O VL → high-Z) prevents bus contention and leakage in powered-down subsystems. |
| One-shot accelerator output stage | Reduces rise/fall times to ≤15ns by injecting transient charge during edges-critical for maintaining signal integrity at 20Mbps. |
| ±15kV HBM ESD protection on I/O VCC | Meets IEC 61000-4-2 Level 4 requirements without external protection components on exposed I/O paths. |
| Wide dual-supply compatibility | Supports direct interface between 1.2V SoC I/O and 3.3V/5V peripherals (e.g., display drivers, sensors, legacy controllers) without discrete level-shifters. |
Applications
| Smartphone Baseband-to-Display Interface | Digital Still Camera Sensor Hub |
|---|---|
Use Scenario: Translating 1.2V MIPI D-PHY control signals from application processor to 2.8V display timing controller. IC Role / Device Role / Timing Role: Bidirectional level shifter enabling clock/data handshaking between voltage domains without direction arbitration logic. Use Value: Eliminates need for two separate unidirectional translators or complex direction-control circuitry, saving 3.5mm² PCB area in tight camera module layouts. | Use Scenario: Interfacing 1.8V image sensor outputs to 3.3V ISP (Image Signal Processor) with simultaneous control-line translation. IC Role / Device Role / Timing Role: 16-channel buffered translator preserving signal integrity across parallel pixel-data and command buses at up to 20Mbps. Use Value: Guarantees ≤20ns propagation delay and ≤5ns channel skew-meeting timing closure for 12-bit raw sensor data capture at 60fps. |
| Industrial PLC I/O Module | Wearable Health Monitor MCU Interface |
Use Scenario: Isolating and translating 2.5V microcontroller GPIOs to 5V industrial fieldbus transceivers (RS-485, CAN) while maintaining ESD immunity. IC Role / Device Role / Timing Role: Voltage translator with ±15kV HBM protection on VCC-side I/Os, placed directly at connector interface. Use Value: Replaces discrete MOSFET-based level shifters + TVS diodes, reducing BOM count by 7 parts and improving system-level ESD test pass rate. | Use Scenario: Connecting 1.2V ultra-low-power wearable SoC to 1.8V biometric sensor array and 3.3V Bluetooth radio. IC Role / Device Role / Timing Role: Low-quiescent-current (0.03µA typ) translator enabling always-on sensor wake-up signaling without draining coin-cell battery. Use Value: Shutdown IQ <1µA (VCC) / <2µA (VL) extends battery life beyond 12 months in intermittent-sampling mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0106PWR | 6-channel, 1.2V–3.6V VL range, no integrated pulldown resistors in shutdown, 100Mbps rated but derated under capacitive load | Lacks guaranteed 20Mbps performance with 50pF load; no ±15kV HBM on I/Os; smaller channel count requires multiple units | Select when higher speed is needed on low-capacitance nets and ESD robustness is handled externally. |
| SN74AVC16T245DGGR | 16-channel, 1.2V–3.6V, direction-controlled (DIR pin required), 24mA drive strength, no integrated ESD protection beyond standard IO | Requires direction logic and external TVS; higher drive capability suits longer traces but increases power in idle state | Choose for high-drive, point-to-point bus translation where direction is statically known and layout allows DIR routing. |
Compared with TXB0106PWR and SN74AVC16T245DGGR, the MAX13101EEBX-T delivers guaranteed 20Mbps operation with 50pF loads, integrated 6kΩ pulldowns for clean shutdown behavior, and ±15kV HBM protection-making it optimal for compact, ESD-exposed, battery-powered multivoltage interfaces where pin count and reliability are critical.
Availability
The MAX13101EEBX-T is available at Aetrix Electronics and suitable for smartphone baseband interfaces, digital camera sensor hubs, industrial PLC I/O modules, and wearable health monitor MCU interfaces requiring stable component supply and long-term lifecycle support.
Supply support for MAX13101EEBX-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-reliability ICs for demanding industrial, automotive, and portable applications.
The MAX13101E series belongs to Maxim's high-speed logic-level translation product line, engineered specifically for compact, battery-sensitive multivoltage systems where ESD robustness, low shutdown current, and guaranteed timing performance are mandatory.
FAQ
What is the maximum capacitive load the MAX13101EEBX-T can drive at 20Mbps?
The MAX13101EEBX-T guarantees 20Mbps operation with CI/OVCC_ = 50pF and CI/OVL_ = 15pF, as specified in the Timing Characteristics table. Rise/fall times remain ≤15ns under these conditions. Exceeding 50pF on VCC-side nets degrades timing margin and may require reducing data rate or adding external driver buffering.
Does the MAX13101EEBX-T require external pull-up or pull-down resistors on I/O lines during normal operation?
No. The MAX13101EEBX-T does not require external biasing during active translation. Internal accelerator circuitry handles edge sharpening dynamically. External resistors are only recommended during shutdown to ensure I/O states meet leakage limits-e.g., 100kΩ pull-downs on I/O VCC when VCC is absent (per Figure 5 in datasheet).
How does the shutdown behavior of the MAX13101EEBX-T differ from the MAX13102E and MAX13103E variants?
In shutdown (EN = GND), the MAX13101EEBX-T pulls all I/O VCC lines to GND via internal 6kΩ resistors while placing I/O VL lines in high-impedance. The MAX13102E reverses this (I/O VL pulldown, I/O VCC high-Z), and the MAX13103E places all I/Os in high-Z. This distinction is fixed per part number and cannot be configured.
Can the MAX13101EEBX-T translate between VL = 1.2V and VCC = 5.5V while maintaining 20Mbps performance?
Yes. The MAX13101EEBX-T supports the full VL (1.2V to VCC) and VCC (1.65V to 5.5V) ranges simultaneously. At VL = 1.2V and VCC = 5.5V, timing parameters (tP ≤20ns, tR/tF ≤15ns) and 20Mbps data rate are maintained per datasheet Conditions column, provided load capacitance stays within 50pF (VCC side) and 15pF (VL side).
Is the UCSP-36 package of the MAX13101EEBX-T compatible with standard reflow profiles?
Yes. The MAX13101EEBX-T in 36-bump UCSP uses Pb-free solder and is qualified for IPC/JEDEC J-STD-020 moisture sensitivity level 1 (MSL-1), supporting standard SnPb and lead-free reflow profiles. The exposed paddle (EP) must be soldered to a thermally and electrically adequate GND pad per Maxim's layout guidelines.
MAX13101EEBX-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 16
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 20Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-WFBGA, CSPBGA
MAX13101EEBX-T FAQ
1.How can I place an order for MAX13101EEBX-T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX13101EEBX-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX13101EEBX-T reliable?
The price and inventory of MAX13101EEBX-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13101EEBX-T is usually 5 days.
3.What payment methods are accepted for MAX13101EEBX-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13101EEBX-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX13101EEBX-T?
MAX13101EEBX-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX13101EEBX-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX13101EEBX-T?
For technical support, including MAX13101EEBX-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13101EEBX-T requirements.
6.How does Aetrix verify that MAX13101EEBX-T is sourced from the original manufacturer or authorized distributors?
All MAX13101EEBX-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13101EEBX-T meets industry standards.
7.What is the process for return or replacement of MAX13101EEBX-T?
All MAX13101EEBX-T units undergo pre-shipment inspection (PSI). If there is an issue with MAX13101EEBX-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX13101EEBX-T part is unused and in its original packaging.
Return procedure for MAX13101EEBX-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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