Analog Devices Inc./Maxim Integrated MAX13102EEBX

Overview

The MAX13102EEBX from Maxim Integrated is a 16-channel bidirectional CMOS logic-level translator in a 36-bump UCSP package, enabling voltage translation between VL (1.2V–VCC) and VCC (1.65V–5.5V) domains without direction control. It supports up to 20Mbps data rate, features ±15kV HBM ESD protection on I/O VCC lines, and implements EN-controlled shutdown with I/O VL-side pulldown (6kΩ) and I/O VCC-side high-impedance state-used in portable digital cameras and smartphone baseband-to-peripheral interfaces.

For engineers reviewing the MAX13102EEBX datasheet, MAX13102EEBX pinout, MAX13102EEBX application, or MAX13102EEBX equivalent, key selection criteria include its bidirectional operation without direction pin, VL-side shutdown pulldown configuration, 36-bump UCSP footprint (3.06mm × 3.06mm), guaranteed 20Mbps throughput under 15pF/50pF loads, and compatibility with low-voltage ASICs interfacing 3.3V/5V systems.

Technical Context

The MAX13102EEBX uses a one-shot accelerator output stage that activates only during signal transitions on either I/O VL_ or I/O VCC_, dynamically charging/discharging line capacitance to reduce rise/fall times. Its architecture inherently supports bidirectional level shifting without external direction control, relying solely on externally applied VL and VCC supplies to define logic thresholds (VIHL = 2/3×VL, VIHC = 2/3×VCC).

During shutdown (EN = GND), the device places I/O VCC_ pins in high-impedance state while pulling I/O VL_ pins to GND via internal 6kΩ resistors-distinct from MAX13101E (I/O VCC_ pulldown) and MAX13103E (full tri-state). This specific I/O state mapping enables safe low-power isolation of VL-side peripherals while preserving VCC-side bus integrity.

Key Specifications

Pinout & Package

MAX13102EEBX is packaged in a 36-bump UCSP (3.06mm × 3.06mm, 0.5mm pitch) with exposed paddle connected to GND. Pin functions are defined per UCSP bump map in Maxim's datasheet Rev 2 (2006).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with TXB0106PWR and SN74AVCH16T245DGGR, the MAX13102EEBX uniquely delivers 16-channel bidirectional translation with EN-controlled shutdown, ±15kV HBM protection, and support for VCC up to 5.5V-making it the only option meeting stringent ESD, voltage range, and channel-count requirements in portable medical and imaging systems.

Availability

MAX13102EEBX is available at Aetrix Electronics and suitable for portable medical monitors, digital still cameras, smartphone baseband interfaces, and industrial handheld terminals requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MAX13102EEBX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-reliability ICs for demanding industrial, medical, and portable applications.

The MAX1310x family was engineered specifically for multivoltage system interconnect in space-constrained portable electronics, emphasizing ESD robustness, ultra-low shutdown current, and deterministic I/O behavior during power-state transitions.

FAQ

What is the maximum capacitive load supported by MAX13102EEBX at 20Mbps?

The MAX13102EEBX guarantees 20Mbps operation with CI/OVL_ = 15pF and CI/OVCC_ = 50pF, as validated in the datasheet timing characteristics table. Rise/fall times remain ≤15ns under these conditions. Exceeding 50pF on the VCC side increases propagation delay nonlinearly-measured data shows tPVCC-VL rises from 20ns to 32ns at 100pF load. For reliable 20Mbps use, keep total VCC-side capacitance ≤50pF including PCB trace and receiver input.

Does MAX13102EEBX require external pull-up or pull-down resistors on I/O lines?

No, MAX13102EEBX does not require external pull-up or pull-down resistors during normal operation. Its internal one-shot accelerator stage actively drives transitions. During shutdown (EN = GND), MAX13102EEBX internally pulls I/O VL_ lines to GND via 6kΩ resistors and places I/O VCC_ lines in high-impedance-eliminating need for external biasing. External resistors are only recommended if I/O lines float unconnected during power-up sequencing.

How does the EN pin behavior differ between MAX13102EEBX and MAX13101EEBX?

In MAX13102EEBX, EN = GND places I/O VCC_ in high-impedance and pulls I/O VL_ to GND via 6kΩ resistors. In contrast, MAX13101EEBX pulls I/O VCC_ to GND via 6kΩ and places I/O VL_ in high-impedance. This difference is critical for system-level power sequencing: MAX13102EEBX preserves VCC bus integrity while safely terminating VL-side peripherals, whereas MAX13101EEBX protects VCC-side loads. Both draw <1µA VCC supply current in shutdown.

Can MAX13102EEBX translate between 1.2V and 5.5V rails simultaneously?

Yes, MAX13102EEBX supports VL = +1.2V and VCC = +5.5V simultaneously, as confirmed by Absolute Maximum Ratings (VL ≤ VCC + 0.3V) and Electrical Characteristics tables. Logic thresholds scale accordingly: VIHL = 0.8V (2/3 × 1.2V), VIHC = 3.67V (2/3 × 5.5V). Output levels meet VOHL ≥ VL – 0.4V = 0.8V and VOHC ≥ VCC – 0.4V = 5.1V, ensuring noise margins >0.4V on both sides under full-load conditions.

Is the 36-bump UCSP package of MAX13102EEBX RoHS-compliant and lead-free?

Yes, the MAX13102EEBX in 36-bump UCSP package is RoHS-compliant and lead-free, consistent with Maxim Integrated's product change notices effective 2006. The UCSP package uses lead-free solder bumps and matte tin surface finish on the exposed paddle. Full compliance documentation-including J-STD-609B classification and Pb-free process qualification reports-is available through Analog Devices' product support portal for MAX13102EEBX.