Analog Devices Inc./Maxim Integrated MAX13102EEBX-T

Overview

The MAX13102EEBX-T from Maxim Integrated is a 16-channel bidirectional CMOS logic-level translator enabling voltage translation between VL (1.2V–VCC) and VCC (1.65V–5.5V) domains without direction control. It supports up to 20Mbps data rate, features ±15kV HBM ESD protection on I/O VCC pins, and provides configurable shutdown states including 6kΩ pulldown on VL-side I/Os. It is used in portable electronics for interfacing low-voltage ASICs/PLDs with higher-voltage peripherals.

For engineers reviewing the MAX13102EEBX-T datasheet, MAX13102EEBX-T pinout, MAX13102EEBX-T application, or MAX13102EEBX-T equivalent, key selection considerations include its enable-controlled shutdown behavior, bidirectional operation without direction pin, I/O state configuration during power-down, and guaranteed 20Mbps throughput under 50pF load on VCC side and 15pF on VL side.

Technical Context

The MAX13102EEBX-T implements a one-shot accelerator output stage that activates only during signal transitions to rapidly charge/discharge line capacitance-reducing propagation delay while maintaining bidirectionality. Its EN input controls global shutdown, placing VL-side I/Os in high-impedance and VCC-side I/Os in 6kΩ pulldown mode.

This architecture eliminates need for direction control and enables seamless level shifting across asymmetric supply rails. The device operates over –40°C to +85°C and supports independent VL and VCC sequencing, with VL allowed to exceed VCC during power-up without damage.

Key Specifications

Pinout & Package

MAX13102EEBX-T is housed in a 36-bump UCSP package (3.06mm × 3.06mm), with exposed paddle connected to GND for thermal and ESD performance. Pin mapping follows the 6×6 bump array layout per Maxim's UCSP specification.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional logic-level translation applications.

Compared with TXB0108PWR and SN74AVCH16T245DGGR, the MAX13102EEBX-T uniquely combines 16-channel bidirectionality, integrated 6kΩ VCC-side pulldown in shutdown, and ±15kV HBM ESD - making it optimal for compact, high-reliability portable and industrial interfaces where pin count, power-down safety, and ESD robustness are co-critical.

Availability

MAX13102EEBX-T is available at Aetrix Electronics and suitable for mobile baseband interfaces, wearable sensor hubs, industrial PLC I/O modules, and automotive infotainment displays requiring stable component supply, extended temperature support (–40°C to +85°C), and guaranteed 20Mbps throughput.

Supply support for MAX13102EEBX-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, automotive, and consumer applications.

The MAX13102EEBX-T belongs to Maxim's logic-level translation product line, engineered specifically for multivoltage system interoperability in space- and power-constrained portable electronics.

FAQ

What is the function of the EN pin on the MAX13102EEBX-T?

The EN pin on the MAX13102EEBX-T is a global enable input. When driven low, it places the device in shutdown mode: VL-side I/Os enter high-impedance state, and VCC-side I/Os are pulled to GND through internal 6kΩ resistors. Supply currents drop to <1µA (VCC) and <2µA (VL). Driving EN to VL or VCC enables normal bidirectional translation. The input threshold is VIH-SHDN = VL − 0.4V, ensuring reliable activation across the full VL range.

Does the MAX13102EEBX-T require a direction control signal?

No, the MAX13102EEBX-T does not require a direction control signal. Its architecture is inherently bidirectional due to the one-shot accelerator output stage, allowing simultaneous or independent signal flow from VL to VCC or VCC to VL on any channel. This eliminates PCB routing for DIR pins and removes firmware dependency on direction management - a key differentiator from direction-controlled translators like SN74AVCH16T245DGGR.

What is the maximum capacitive load supported by the MAX13102EEBX-T at 20Mbps?

The MAX13102EEBX-T guarantees 20Mbps operation with CI/OVCC_ = 50pF and CI/OVL_ = 15pF, per the datasheet timing test conditions. Rise/fall times remain ≤15ns under these loads. For higher capacitance, performance degrades: at 50pF on VL side, tRVL/tFVL increase to ~7ns; at 50pF on VCC side, tRVCC/tFVCC reach ~4ns. System design must account for total trace + receiver capacitance to maintain timing margin.

How does the MAX13102EEBX-T handle power supply sequencing?

The MAX13102EEBX-T tolerates VL ≥ VCC during power-up without damage. To prevent unintended current flow when VCC is unpowered, Maxim recommends connecting VCC to GND via a ≤50Ω resistor. This ensures no excess leakage into VL-side I/Os and avoids interference with downstream logic. The device draws <10mA per VL-side load when VCC is disconnected, and does not latch up - a critical reliability feature for hot-swap or brown-out scenarios.

Is the MAX13102EEBX-T pin-compatible with other members of the MAX1310x family?

Yes, the MAX13102EEBX-T shares identical 36-bump UCSP pinout with MAX13101EEBX and MAX13103EEBX, including GND, VL, VCC, EN, and all 16 I/O VL/VCC assignments. However, shutdown behavior differs: MAX13101 pulls VCC-side I/Os to GND, MAX13102 pulls VL-side to high-Z (VCC-side to 6kΩ), and MAX13103 places all I/Os in high-Z. Functional substitution requires verifying shutdown-state requirements in the target application.